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XC18V512SOG20C

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Manufacturer No:

XC18V512SOG20C

Manufacturer:

Xilinx

HK JDW NO:

903-XC18V512SOG20C

Package:

20-SOIC (0.295, 7.50mm Width)

Datasheet:

XC18V512SOG20C

Description:

Surface Mount Tray Configuration Proms for FPGAs 3 (168 Hours) In System Programmable Active XC18V512

Quantity:

In Stock : 999

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XC18V512SOG20C Overview


A neat 20-SOIC (0.295, 7.50mm Width) package is used.External packaging of type Tray.0°C~70°C-qualified.This device can be programmed using In System Programmable.The voltage fed to it is 3V~3.6V.FPGA is mounted in Surface Mount.Look for "XC18V512" for other related parts.Supply voltage 3.3V is required.20 terminations with different functions.FPGA is possible to use this memory device at a maximum voltage of 3.6V.If the device needs to be supplied with power, then a minimum voltage of 3V is required.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.If reflow soldering is being performed, the temperature should not be higher than 260 when soldering should be reflowed.FPGA has pins on the 20 axis.Through PARALLEL/SERIAL-processing, data is transmitted from this memory to the CPU.A memory chip can operate at a voltage no greater than 0.025mA.Parts include 20 pins.Using a 33MHz frequency, this memory IC can work at high speeds.To run the part safely and stably in a circuit, 3.3V recommends users apply 3.3V on the part.In specific, it can be described as a form of Flash Memories.

XC18V512SOG20C Features


Operating temperature: 0°C~70°C.
In System Programmable program capability.
CONFIGURATION MEMORY memory IC.
PARALLEL/SERIAL processing.

XC18V512SOG20C Applications


There are a lot of Xilinx Inc. XC18V512SOG20C applications of configuration proms for FPGAs.

  • servers
  • eDRAM
  • data buffer
  • networking
  • personal digital assistants
  • workstations,
  • cell phones
  • multimedia computers
  • eSRAM
  • mainframes
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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4. Shipping Cost

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FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

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DHL(www.dhl.com)
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UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XC18V512SOG20C

technical specifications, attributes, parameters and parts with similar specifications to XC18V512SOG20C.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Mounting Type

    Surface Mount

  • Package / Case

    20-SOIC (0.295, 7.50mm Width)

  • Surface Mount

    YES

  • Number of Pins

    20

  • Operating Temperature

    0°C~70°C

  • Packaging

    Tray

  • Published

    1999

  • JESD-609 Code

    e3

  • Pbfree Code

    yes

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    20

  • ECCN Code

    EAR99

  • Terminal Finish

    Matte Tin (Sn)

  • Subcategory

    Flash Memories

  • Technology

    CMOS

  • Voltage - Supply

    3V~3.6V

  • Terminal Position

    DUAL

  • Terminal Form

    GULL WING

  • Peak Reflow Temperature (Cel)

    260

  • Number of Functions

    1

  • Supply Voltage

    3.3V

  • Terminal Pitch

    1.27mm

  • Time@Peak Reflow Temperature-Max (s)

    30

  • Base Part Number

    XC18V512

  • Pin Count

    20

  • Operating Supply Voltage

    3.3V

  • Supply Voltage-Max (Vsup)

    3.6V

  • Supply Voltage-Min (Vsup)

    3V

  • Programmable Type

    In System Programmable

  • Clock Frequency

    33MHz

  • Supply Current-Max

    0.025mA

  • Organization

    64KX8

  • Memory Width

    8

  • Density

    512 kb

  • Standby Current-Max

    0.01A

  • Access Time (Max)

    15 ns

  • Parallel/Serial

    PARALLEL/SERIAL

  • Memory IC Type

    CONFIGURATION MEMORY

  • Data Retention Time-Min

    20

  • Height Seated (Max)

    2.6416mm

  • Length

    12.827mm

  • Width

    7.5184mm

  • Radiation Hardening

    No

  • RoHS Status

    ROHS3 Compliant

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