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XA7Z020-1CLG400I

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Manufacturer No:

XA7Z020-1CLG400I

Manufacturer:

Xilinx

HK JDW NO:

903-XA7Z020-1CLG400I

Package:

400-LFBGA, CSPBGA

Datasheet:

XA7Z020-1CLG400I

Description:

400 Terminations-40°C~100°C TJ 400 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.It has been assigned a package 400-LFBGA, CSPBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides reliable operation.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Automotive, AEC-Q100, Zynq?-7000 XA series, this system on chip SoC is included.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines Artix?-7 FPGA, 85K Logic Cells.Housed in the state-of-art Tray package.This SoC part has a total of 130 I/Os.In total, there are 400 terminations, which is great for system on a chip.There is no doubt that this system on a chip is outstanding, just as other high-quality Other uPs/uCs/Peripheral ICs will do.In order to operate system on chip, you will need 11.8V power supplies.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.It operates at a frequency of 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.This is the version with 400 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM

There are a lot of Xilinx Inc.


XA7Z020-1CLG400I System On Chip (SoC) applications.

  • USB hard disk enclosure
  • Healthcare
  • Sports
  • Digital Signal Processing
  • Digital Media
  • DC-input BLDC motor drive
  • Multiprocessor system-on-chips (MPSoCs)
  • sequence controllers
  • Deep learning hardware
  • System-on-chip (SoC)
1. Purchase

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Tell us the model and quantity you need, our sales staff will reply the price in time.
EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XA7Z020-1CLG400I

technical specifications, attributes, parameters and parts with similar specifications to XA7Z020-1CLG400I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Contact Plating

    Copper, Silver, Tin

  • Mount

    Surface Mount

  • Package / Case

    400-LFBGA, CSPBGA

  • Number of Pins

    400

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2010

  • Series

    Automotive, AEC-Q100, Zynq®-7000 XA

  • JESD-609 Code

    e1

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • Number of Terminations

    400

  • ECCN Code

    EAR99

  • Terminal Finish

    Tin/Silver/Copper (Sn/Ag/Cu)

  • HTS Code

    8542.39.00.01

  • Subcategory

    Other uPs/uCs/Peripheral ICs

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Terminal Pitch

    0.8mm

  • Frequency

    667MHz

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • Qualification Status

    Not Qualified

  • Operating Supply Voltage

    1V

  • Power Supplies

    11.8V

  • Interface

    CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

  • Number of I/O

    130

  • RAM Size

    256KB

  • uPs/uCs/Peripheral ICs Type

    MICROPROCESSOR CIRCUIT

  • Core Processor

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Peripherals

    DMA

  • Connectivity

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Architecture

    MCU, FPGA

  • Data Bus Width

    32b

  • Core Architecture

    ARM

  • Primary Attributes

    Artix™-7 FPGA, 85K Logic Cells

  • UV Erasable

    N

  • Height Seated (Max)

    1.6mm

  • Length

    17mm

  • RoHS Status

    ROHS3 Compliant

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