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M2S150TS-FC1152

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Manufacturer No:

M2S150TS-FC1152

Manufacturer:

Microsemi

HK JDW NO:

523-M2S150TS-FC1152

Package:

1152-BBGA, FCBGA

Datasheet:

M2S150TS-FC1152

Description:

0°C~85°C TJ System On ChipSmartFusion?2 Series 574 I/O1.2V

Quantity:

In Stock : 999

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Product Details

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This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.There is a 1152-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.It is important to note that this SoC security combines FPGA - 150K Logic Modules.An advanced Tray package houses this SoC system on a chip.574 I/Os in total are included in this SoC part.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.If it has at least a 1.14V volt power supply, it can work fine.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.There are 574 outputs available on this SoC.You will need to provide 1.2V power supplies in order to run system on chip.574 inputs are available on the SoC chip.A logic SoC has 146124 logic cells.This flash has a size of 512KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S150TS-FC1152 System On Chip (SoC) applications.

  • System-on-chip (SoC)
  • Smart appliances
  • Networked sensors
  • Microcontroller
  • Optical drive
  • Industrial transport
  • Mouse
  • Communication interfaces ( I2C, SPI )
  • Communication network-on-Chip (cNoC)
  • Automotive
1. Purchase

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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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Our sales will reply to your request by email within 24 hours.

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

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DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S150TS-FC1152

technical specifications, attributes, parameters and parts with similar specifications to M2S150TS-FC1152.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 1 month ago)

  • Package / Case

    1152-BBGA, FCBGA

  • Surface Mount

    YES

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2015

  • Series

    SmartFusion®2

  • JESD-609 Code

    e0

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Terminal Finish

    Tin/Lead (Sn/Pb)

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1.2V

  • Terminal Pitch

    1mm

  • Reach Compliance Code

    not_compliant

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    S-PBGA-B1152

  • Number of Outputs

    574

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.26V

  • Power Supplies

    1.2V

  • Supply Voltage-Min (Vsup)

    1.14V

  • Number of I/O

    574

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Number of Inputs

    574

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Primary Attributes

    FPGA - 150K Logic Modules

  • Number of Logic Cells

    146124

  • Flash Size

    512KB

  • Height Seated (Max)

    2.9mm

  • Length

    35mm

  • Width

    35mm

  • RoHS Status

    Non-RoHS Compliant

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