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  • M2S060-FCS325

M2S060-FCS325

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Manufacturer No:

M2S060-FCS325

Manufacturer:

Microsemi

HK JDW NO:

523-M2S060-FCS325

Package:

325-TFBGA, CSPBGA

Datasheet:

M2S060-FCS325

Description:

325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V

Quantity:

In Stock : 999

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Product Details

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This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.Its package is 325-TFBGA, CSPBGA.A 64KB RAM SoC chip provides reliable performance to users.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion?2 is the series number of this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 60K Logic Modules, an important feature to keep in mind.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 200.Use a power supply with a voltage of 1.2V if possible.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.In order to run it, it must be fed by at least 1.14V of power.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.A system on a chip benefits from having 325 terminations.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 200 outputs.You will need to provide 1.2V power supplies in order to run system on chip.Inputs are available on the SoC chip in the number of 200.Logic system on chips features 56520 logic cells.This flash has a size of 256KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S060-FCS325 System On Chip (SoC) applications.

  • String inverter
  • Self-aware system-on-chip (SoC)
  • Published Paper
  • Deep learning hardware
  • Industrial automation devices
  • Apple smart watch
  • Flow Sensors
  • Robotics
  • Defense
  • Medical Pressure
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

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UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S060-FCS325

technical specifications, attributes, parameters and parts with similar specifications to M2S060-FCS325.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    12 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 2 weeks ago)

  • Package / Case

    325-TFBGA, CSPBGA

  • Surface Mount

    YES

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2015

  • Series

    SmartFusion®2

  • JESD-609 Code

    e0

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    325

  • Terminal Finish

    Tin/Lead (Sn/Pb)

  • Additional Feature

    LG-MIN, WD-MIN

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1.2V

  • Terminal Pitch

    0.5mm

  • Reach Compliance Code

    not_compliant

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    S-PBGA-B325

  • Number of Outputs

    200

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.26V

  • Power Supplies

    1.2V

  • Supply Voltage-Min (Vsup)

    1.14V

  • Number of I/O

    200

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Number of Inputs

    200

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Primary Attributes

    FPGA - 60K Logic Modules

  • Number of Logic Cells

    56520

  • Flash Size

    256KB

  • Height Seated (Max)

    1.01mm

  • Length

    11mm

  • Width

    11mm

  • RoHS Status

    Non-RoHS Compliant

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