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M2S050TS-1FCS325I

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Manufacturer No:

M2S050TS-1FCS325I

Manufacturer:

Microsemi

HK JDW NO:

523-M2S050TS-1FCS325I

Package:

325-TFBGA, CSPBGA

Datasheet:

M2S050TS-1FCS325I

Description:

325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V

Quantity:

In Stock : 999

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Product Details

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This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.In the SmartFusion?2 series, this system on chip SoC is included.The average operating temps for this SoC meaning should be -40°C~100°C TJ.This SoC security combines FPGA - 50K Logic Modules and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part has a total of 200 I/Os.A power supply with a 1.2V rating is recommended.In the SoCs wireless, voltages above 1.26V are considered unsafe.Power supplies of at least 1.14V are required.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.Having 325 terminations in total makes system on a chip possible.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.In order for this SoC chip to work properly, you can have 200 outputs.There is 1.2V power supply requirement for this system on chip SoC.There are 200 inputs available on the SoC chip.Logic system on chips consist of 56340 logic cells.A 256KB flash can be seen on it.Further features of this SoC processor are LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S050TS-1FCS325I System On Chip (SoC) applications.

  • Medical
  • Central alarm system
  • Efficient hardware for inference of neural networks
  • Three phase UPS
  • Level
  • ARM Cortex M4 microcontroller
  • Smartphones
  • Fitness
  • Microcontroller based SoC ( RISC-V, ARM)
  • Video Imaging
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

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UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S050TS-1FCS325I

technical specifications, attributes, parameters and parts with similar specifications to M2S050TS-1FCS325I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 2 weeks ago)

  • Package / Case

    325-TFBGA, CSPBGA

  • Surface Mount

    YES

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Series

    SmartFusion®2

  • JESD-609 Code

    e0

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    325

  • Terminal Finish

    Tin/Lead (Sn/Pb)

  • Additional Feature

    LG-MIN, WD-MIN

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1.2V

  • Terminal Pitch

    0.5mm

  • Reach Compliance Code

    not_compliant

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    S-PBGA-B325

  • Number of Outputs

    200

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.26V

  • Power Supplies

    1.2V

  • Supply Voltage-Min (Vsup)

    1.14V

  • Number of I/O

    200

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Number of Inputs

    200

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Primary Attributes

    FPGA - 50K Logic Modules

  • Number of Logic Cells

    56340

  • Flash Size

    256KB

  • Height Seated (Max)

    1.01mm

  • Length

    11mm

  • Width

    11mm

  • RoHS Status

    Non-RoHS Compliant

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