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  • FDG6301N

FDG6301N

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Manufacturer No:

FDG6301N

Manufacturer:

ON Semiconductor

HK JDW NO:

598-FDG6301N

Package:

6-TSSOP, SC-88, SOT-363

Datasheet:

FDG6301N

Description:

FDG6301N datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available at HK JDW

Quantity:

In Stock : 999

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Product Details

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FDG6301N MOSFET Description


Onsemi's patented, high cell density, DMOS technology is used to manufacture the FDG6301N dual N-Channel logic level enhancement MOSFET. This ultra-high-density technique is specifically designed to reduce on-state resistance. This device was created to replace bipolar digital transistors and tiny signal MOSFETs in low voltage applications. The FDG6301N MOSFET is widely renowned for its low drain-on-resistance and durable ESD architecture.



FDG6301N MOSFET Features


  • 25 V, 0.22 A continuous, 0.65 A peak

  • Low RDS(ON) = 4 Ω @ VGS= 4.5 V

  • Very low-level gate drive requirements allow direct operation in 3 V circuits (VGS(th) < 1.5 V).

  • Gate-Source Zener for ESD ruggedness

  • Compact industry standard SC70-6 surface mount package



FDG6301N MOSFET Applications


  • High Current, High-Speed Switching

  • Up to 12s Battery Power Tools

  • Buck Converters

  • Power Converters with Multi-Megahertz Operation

  • Three-Phase Bridge for Brushless DC Motor Control

  • Lighting Applications

  • Other Half and Full-Bridge Topologies

  • Off-Line Power Supplies

  • PFC Controllers

  • Adapters

  • Battery Management

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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

FDG6301N

technical specifications, attributes, parameters and parts with similar specifications to FDG6301N.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Lifecycle Status

    ACTIVE (Last Updated: 2 days ago)

  • Contact Plating

    Tin

  • Mount

    Surface Mount

  • Mounting Type

    Surface Mount

  • Package / Case

    6-TSSOP, SC-88, SOT-363

  • Number of Pins

    6

  • Weight

    28mg

  • Transistor Element Material

    SILICON

  • Operating Temperature

    -55°C~150°C TJ

  • Packaging

    Tape & Reel (TR)

  • Published

    1999

  • JESD-609 Code

    e3

  • Pbfree Code

    yes

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    1 (Unlimited)

  • Number of Terminations

    6

  • Termination

    SMD/SMT

  • ECCN Code

    EAR99

  • Resistance

    4Ohm

  • Additional Feature

    LOGIC LEVEL COMPATIBLE

  • Subcategory

    FET General Purpose Power

  • Voltage - Rated DC

    25V

  • Max Power Dissipation

    300mW

  • Terminal Form

    GULL WING

  • Current Rating

    220mA

  • Number of Elements

    2

  • Element Configuration

    Dual

  • Operating Mode

    ENHANCEMENT MODE

  • Power Dissipation

    300mW

  • Turn On Delay Time

    5 ns

  • FET Type

    2 N-Channel (Dual)

  • Transistor Application

    SWITCHING

  • Rds On (Max) @ Id, Vgs

    4 Ω @ 220mA, 4.5V

  • Vgs(th) (Max) @ Id

    1.5V @ 250μA

  • Input Capacitance (Ciss) (Max) @ Vds

    9.5pF @ 10V

  • Gate Charge (Qg) (Max) @ Vgs

    0.4nC @ 4.5V

  • Rise Time

    4.5ns

  • Fall Time (Typ)

    4.5 ns

  • Turn-Off Delay Time

    4 ns

  • Continuous Drain Current (ID)

    220mA

  • Threshold Voltage

    850mV

  • Gate to Source Voltage (Vgs)

    8V

  • Drain to Source Breakdown Voltage

    25V

  • Dual Supply Voltage

    25V

  • FET Technology

    METAL-OXIDE SEMICONDUCTOR

  • Max Junction Temperature (Tj)

    150°C

  • FET Feature

    Logic Level Gate

  • Height

    1.1mm

  • Length

    2mm

  • Width

    1.25mm

  • Radiation Hardening

    No

  • REACH SVHC

    No SVHC

  • RoHS Status

    ROHS3 Compliant

  • Lead Free

    Lead Free

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