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A2F200M3F-1FGG484I

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Manufacturer No:

A2F200M3F-1FGG484I

Manufacturer:

Microsemi

HK JDW NO:

523-A2F200M3F-1FGG484I

Package:

484-BGA

Description:

484 Terminations-40°C~100°C TJ 484 Pin A2F200 System On ChipSmartFusion? Series MCU - 41, FPGA - 94 I/O1.5V Min 1.425V VMax 1.575V V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.This system on a chip is packaged as 484-BGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion? is the series in which this system on chip SoC falls under.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops is important.This SoC system on a chip has been designed in a state-of-the-art Tray package.As a whole, this SoC part is comprised of MCU - 41, FPGA - 94 inputs and outputs.Ideally, a power supply with a voltage of 1.5V should be used.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.As a result, there are 484 terminations in total, which does really benefit system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.There are 94 outputs available on this SoC.It has a 256KB flash.By searching A2F200, you will find system on chips with similar specs and purposes.The wireless SoC works at a frequency of 100MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC is the 484-pin version.Voltages up to 1.575V are specified for this SoC security.Power is supplied to it at least in the amount of 1.425V.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-1FGG484I System On Chip (SoC) applications.

  • Smartphone accessories
  • Level
  • Sensor network-on-chip (sNoC)
  • Keywords
  • AC drive control module
  • Industrial automation devices
  • Fitness
  • Self-aware system-on-chip (SoC)
  • Smartphones
  • Avionics
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F200M3F-1FGG484I

technical specifications, attributes, parameters and parts with similar specifications to A2F200M3F-1FGG484I.

  • Type
    Parameter
    Select All
  • Frequency

    100MHz

  • Time@Peak Reflow Temperature-Max (s)

    30

  • Base Part Number

    A2F200

  • Number of Outputs

    94

  • Qualification Status

    Not Qualified

  • Operating Supply Voltage

    1.5V

  • Interface

    EBI/EMI, Ethernet, I2C, SPI, UART, USART

  • Max Supply Voltage

    1.575V

  • Min Supply Voltage

    1.425V

  • Operating Supply Current

    1mA

  • Number of I/O

    MCU - 41, FPGA - 94

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, Ethernet, I2C, SPI, UART/USART

  • Architecture

    MCU, FPGA

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Core Architecture

    ARM

  • Number of Gates

    200000

  • Number of Logic Blocks (LABs)

    8

  • Primary Attributes

    ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

  • Flash Size

    256KB

  • Height Seated (Max)

    2.44mm

  • Length

    23mm

  • Width

    23mm

  • RoHS Status

    RoHS Compliant

  • Factory Lead Time

    12 Weeks

  • Package / Case

    484-BGA

  • Surface Mount

    YES

  • Number of Pins

    484

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2015

  • Series

    SmartFusion®

  • JESD-609 Code

    e1

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    484

  • Terminal Finish

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    250

  • Supply Voltage

    1.5V

  • Terminal Pitch

    1mm

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