Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Min Supply Voltage | Density | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Voltage - Supply | Organization | Memory Width | Sync/Async | Data Bus Width | Clock Frequency | Standby Current-Max | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Data Polling | Page Size | Serial Bus Type | I2C Control Byte | Reverse Pinout | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MT29F256G08CMCABH2-12Z:A TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 100-TBGA | Surface Mount | 0°C~70°C TA | FLASH - NAND | 100-TBGA (12x18) | 256Gb 32G x 8 | Non-Volatile | 2.7V~3.6V | 83MHz | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT25080B-TH-B | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1997 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | Surface Mount | -40°C~85°C TA | AT25080 | 8Kb 1K x 8 | Non-Volatile | 1.8V~5.5V | 20MHz | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT24CS02-SSHM-B | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2005 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | Gold | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | Surface Mount | -40°C~85°C TA | AT24CS02 | 550ns | 2Kb 256 x 8 | Non-Volatile | 1.7V~5.5V | 1MHz | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
25LC512T-E/SM | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | Tape & Reel (TR) | 2010 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5.26mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 512 kb | 5.25mm | Surface Mount | -40°C~125°C TA | CMOS | 2.03mm | 1 | 5mA | e3 | Matte Tin (Sn) | DUAL | 5V | 25LC512 | 8 | 1.27mm | 2.5V | 3/5V | 5.5V | 50 ns | 512Kb 64K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 20MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||
 |
25LC256T-H/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.A | 4.9mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 256 kb | 3.9mm | Surface Mount | -40°C~150°C TA | CMOS | 1.75mm | 1 | 5mA | e3 | Matte Tin (Sn) | DUAL | 260 | 2.7V | 40 | 25LC256 | 8 | 1.27mm | 2.5V | 2/5V | 5.5V | 100 ns | 256Kb 32K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 5MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 6ms | SPI | EEPROM | SPI | 6ms | |||||||||||||||||||||||||||||||||||||||
|
24AA256T-I/SM | Microchip Technology | 0.8325 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | Tape & Reel (TR) | 2007 | yes | Active | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 5.26mm | ROHS3 Compliant | Lead Free | Gold | No | 8 | 8-SOIC (0.209, 5.30mm Width) | I2C, Serial | No SVHC | 256 kb | 5.25mm | Surface Mount | -40°C~85°C TA | CMOS | 2.03mm | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 260 | 40 | 24AA256 | 8 | 1.27mm | 1.7V | 5.5V | 900ns | 256Kb 32K x 8 | Non-Volatile | 1.7V~5.5V | 8 | 400kHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | NO | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||
.png "7143LA35GB") |
7143LA35GB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Through Hole | Bulk | 2013 | no | Active | 1 (Unlimited) | 68 | 125°C | -55°C | 5V | 2 | 29.46mm | RoHS Compliant | Contains Lead | No | 68 | Parallel | 5.5V | 4.5V | 32 kb | 29.46mm | 3.68mm | CMOS | 1 | 295mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 20 | 68 | MILITARY | SRAMs | 5V | 3-STATE | 35 ns | MIL-PRF-38535 | RAM, SRAM | 22b | Asynchronous | 0.004A | 16b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||
 |
71V424L15YG | Renesas Electronics America Inc. | 7.1040 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 36-BSOJ (0.400, 10.16mm Width) | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | IDT71V424 | 36-SOJ | 15ns | 4Mb 512K x 8 | Volatile | 3V~3.6V | SRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93AA76BT-I/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Tape & Reel (TR) | 2012 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 3mm | ROHS3 Compliant | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | Serial | 8 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.1mm | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 260 | 2.5V | 40 | 93AA76B | 8 | 0.65mm | 5.5V | 8Kb 512 x 16 | Non-Volatile | 1.8V~5.5V | 512X16 | 16 | 3MHz | 8 | 5ms | MICROWIRE | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||
|
93LC76AT-I/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Tape & Reel (TR) | 2012 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 3mm | ROHS3 Compliant | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | Serial | 8 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.1mm | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 260 | 5V | 40 | 93LC76A | 8 | 0.65mm | 2.5V | 5.5V | 8Kb 1K x 8 | Non-Volatile | 2.5V~5.5V | 512X16 | 16 | 3MHz | 8 | 5ms | MICROWIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||
 |
24LC04BHT-I/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Surface Mount | Tape & Reel (TR) | 2007 | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | I2C, Serial | 4 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 1 | 3mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 40 | 24LC04BH | 8 | 0.65mm | OPEN-DRAIN | 900ns | ISO/TS-16949 | 4Kb 256 x 8 x 2 | Non-Volatile | 2.5V~5.5V | 8 | 400kHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | YES | 16words | I2C | 1010XXMR | NO | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||
 |
24VL014H/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Through Hole | Tube | 2008 | Active | 1 (Unlimited) | 8 | EAR99 | 3.3V | 9.271mm | ROHS3 Compliant | Tin | 8 | 8-DIP (0.300, 7.62mm) | I2C, Serial | 1 kb | 7.62mm | Through Hole | -20°C~85°C TA | CMOS | SYNCHRONOUS | 5.334mm | 1 | 3mA | e3 | DUAL | NOT APPLICABLE | 1.8V | NOT APPLICABLE | 24VL014H | 8 | 2.54mm | 1.5V | Not Qualified | 3.6V | 900ns | 1Kb 128 x 8 | Non-Volatile | 1.5V~3.6V | 8 | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||
|
AT25256-10PC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1999 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 8-DIP (0.300, 7.62mm) | Through Hole | 0°C~70°C TA | EEPROM | AT25256 | 8-PDIP | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | 3MHz | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
24AA025E48-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 1 Weeks | Tube | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 100KHZ AVAILABLE @1.7V | 8-SOIC (0.154, 3.90mm Width) | I2C, Serial | No SVHC | 2 kb | 1.75mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | DUAL | 260 | 5V | 40 | 24AA025E48 | 8 | YES | 1.27mm | 900ns | TS 16949 | 2Kb 256 x 8 | Non-Volatile | 1.7V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||
|
93C56B-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | Serial | 2 kb | 1.5mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 2mA | e3 | DUAL | 260 | 5V | 40 | 93C56B | 8 | 1.27mm | 5V | 250 ns | 2Kb 128 x 16 | Non-Volatile | 4.5V~5.5V | 2MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 2ms | MICROWIRE | EEPROM | SPI | 2ms | |||||||||||||||||||||||||||||||||||||||||
 |
24LC128-I/MF | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2007 | yes | Active | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 5mm | ROHS3 Compliant | Lead Free | No | 8 | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | 8-VDFN Exposed Pad | 2-Wire, I2C, Serial | No SVHC | 128 kb | 950μm | 6mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 260 | 4.5V | 40 | 24LC128 | 8 | 1.27mm | 2.5V | 3/5V | 5.5V | 900ns | 128Kb 16K x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||
|
EDFA112A2PF-JD-F-D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 9 Weeks | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | FBGA | -30°C~85°C TC | SDRAM - Mobile LPDDR3 | 16Gb 128M x 128 | Volatile | 1.14V~1.95V | 933MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
93C86C/W15K | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 1 (Unlimited) | ROHS3 Compliant | Die | Surface Mount | 0°C~70°C TA | EEPROM | 93C86C | Die | 16Kb 2K x 8 1K x 16 | Non-Volatile | 4.5V~5.5V | 3MHz | EEPROM | SPI | 2ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
93C76B-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Through Hole | Tube | 2012 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 9.46mm | ROHS3 Compliant | No | 8 | 8-DIP (0.300, 7.62mm) | Serial | 8 kb | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | 4.32mm | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 2.5V | 93C76B | 8 | 2.54mm | 5V | 8Kb 512 x 16 | Non-Volatile | 4.5V~5.5V | 8 | 3MHz | 0.000001A | 8 | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 6ms | MICROWIRE | EEPROM | SPI | 2ms | |||||||||||||||||||||||||||||||||||||||||||
|
93C76A-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Through Hole | Tube | 2012 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 9.46mm | ROHS3 Compliant | No | 8 | 8-DIP (0.300, 7.62mm) | Serial | 8 kb | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | 4.32mm | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 2.5V | 93C76A | 8 | 2.54mm | 5V | 8Kb 1K x 8 | Non-Volatile | 4.5V~5.5V | 8 | 3MHz | 0.000001A | 8 | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 6ms | MICROWIRE | EEPROM | SPI | 2ms | |||||||||||||||||||||||||||||||||||||||||||
|
24AA02HT-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2008 | Active | 1 (Unlimited) | 8 | EAR99 | 2.5V | 4.9mm | ROHS3 Compliant | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | I2C, Serial | 2 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.75mm | 1 | 3mA | e3 | DUAL | 260 | 2.5V | 40 | 24AA02H | 8 | 1.27mm | 1.7V | 2/5V | 5.5V | 900ns | 2Kb 256 x 8 | Non-Volatile | 1.7V~5.5V | 8 | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010XXXR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||
 |
MT48LC8M16A2B4-75:G | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2012 | Obsolete | 3 (168 Hours) | 54 | EAR99 | 3.3V | 1 | 8mm | ROHS3 Compliant | Lead Free | No | 54 | AUTO/SELF REFRESH | 54-VFBGA | 128 Mb | Surface Mount | 0°C~70°C TA | SDRAM | 1mm | 1 | 150mA | e1 | TIN SILVER COPPER | BOTTOM | 260 | 3.3V | 30 | MT48LC8M16A2 | 54 | 0.8mm | 3V | 3.6V | 3-STATE | 5.4ns | 128Mb 8M x 16 | Volatile | 14b | 3V~3.6V | 8MX16 | 16 | 16b | 133MHz | 0.002A | COMMON | 4096 | DRAM | Parallel | 15ns | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||
|
AT24C32C-TH-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 1997 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | Surface Mount | -40°C~85°C TA | EEPROM | AT24C32 | 8-TSSOP | 550ns | 32Kb 4K x 8 | Non-Volatile | 1.8V~5.5V | 1MHz | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
24LC16B/W15K | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 1 (Unlimited) | ROHS3 Compliant | Die | Surface Mount | 0°C~70°C TA | EEPROM | 24LC16B | Die | 900ns | 16Kb 2K x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT46V64M4P-5B:M | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 2011 | Obsolete | 3 (168 Hours) | 66 | 2.6V | 1 | 22.22mm | ROHS3 Compliant | Lead Free | No | 66 | AUTO/SELF REFRESH | 66-TSSOP (0.400, 10.16mm Width) | 256 Mb | Surface Mount | 0°C~70°C TA | SDRAM - DDR | 1.2mm | 1 | 400MHz | DUAL | 2.6V | MT46V64M4 | YES | 0.65mm | 2.5V | 2.7V | 700ps | 256Mb 64M x 4 | Volatile | 15b | 2.5V~2.7V | 64MX4 | 4 | 4b | 200MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
|
25LC040XT-I/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2006 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.4mm | ROHS3 Compliant | Lead Free | No | 8 | DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 4 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 1 | 5mA | e3 | Matte Tin (Sn) | DUAL | 260 | 3.3V | 40 | 25LC040 | 8 | YES | 0.65mm | 2.5V | 3/5V | 5.5V | 230 ns | 4Kb 512 x 8 | Non-Volatile | 2.5V~5.5V | 8 | 2MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||
|
M29F400BB55M1 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | 2007 | Obsolete | 3 (168 Hours) | 70°C | 0°C | ROHS3 Compliant | 44-SOIC (0.496, 12.60mm Width) | Parallel | Surface Mount | 0°C~70°C TA | FLASH - NOR | M29F400 | 44-SO | 55ns | 4Mb 512K x 8 256K x 16 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
24LC32A-E/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2010 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 3mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | I2C, Serial | 32 kb | 3mm | Surface Mount | -40°C~125°C TA | CMOS | 1.1mm | 1 | 3mA | e3 | DUAL | 260 | 5V | 40 | 24LC32A | 8 | 0.65mm | 2.5V | 3/5V | 5.5V | 900ns | 32Kb 4K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 400kHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||
|
23A640-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2009 | yes | Active | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 1.8V | 1 | 4.9mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | No SVHC | 64 kb | 1.25mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 10mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 1.8V | 40 | 23A640 | 8 | 3-STATE | 32 ns | 64Kb 8K x 8 | Volatile | 1b | 1.7V~1.95V | Synchronous | 20MHz | 8b | SEPARATE | SRAM | SPI | ||||||||||||||||||||||||||||||||||||||||||
|
7133LA45J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | AUTOMATIC POWER-DOWN | PLCC | Parallel | 5.5V | 4.5V | 32 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 45 ns | 4kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 16b | COMMON | 2V |
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