
Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Boot Block |
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N25Q016A11E5140F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-XFBGA, CSPBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | N25Q016A11 | 16Mb 4M x 4 | Non-Volatile | 1.7V~2V | 108MHz | FLASH | SPI | 8ms, 1ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MX25L51245GMI-08G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | MXSMIO™ | Active | 3 (168 Hours) | 16 | 10.3mm | RoHS Compliant | ALSO CONFIGURED WITH 1-BIT WIDTH | 16-SOIC (0.295, 7.50mm Width) | 7.52mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.65mm | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G16 | 2.7V | 3.6V | 512Mb 64M x 8 | Non-Volatile | 2.7V~3.6V | 128MX4 | 4 | 536870912 bit | SERIAL | 166MHz | 2 | 3V | FLASH | SPI | 60μs, 750μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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47C16-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 28 Weeks | Tube | Active | Not Applicable | 8 | 9.271mm | ROHS3 Compliant | IT ALSO HAS EEPROM BACKUP OF 2K X 8 BITS | 8-DIP (0.300, 7.62mm) | 7.62mm | Through Hole | -40°C~85°C TA | EEPROM, SRAM | SYNCHRONOUS | 5.334mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 5V | 47C16 | NO | 2.54mm | R-PDIP-T8 | 4.5V | 5.5V | 400ns | TS 16949 | 16Kb 2K x 8 | Non-Volatile | 4.5V~5.5V | 2KX8 | 8 | 16384 bit | 1MHz | EERAM | I2C | 1ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V2546S150BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 150MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 325mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | COMMERCIAL | SRAMs | 3-STATE | 3.8 ns | RAM, SRAM | 17b | Synchronous | 0.04A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W632GU6NB-09 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | Active | 3 (168 Hours) | 96 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 96-VFBGA | 7.5mm | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.35V | YES | 0.8mm | R-PBGA-B96 | 1.283V | 1.45V | 20ns | 2Gb 128M x 16 | Volatile | 1.283V~1.45V | 128MX16 | 16 | 2147483648 bit | 1.067GHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S29PL032J60BFW123 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | PL-J | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | 8.15mm | ROHS3 Compliant | 48 | TOP AND BOTTOM BOOT BLOCK | 48-VFBGA | 6.15mm | Surface Mount | -25°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1mm | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | 260 | 3V | 40 | YES | 0.8mm | 2.7V | Not Qualified | 3/3.3V | 3.6V | 32Mb 2M x 16 | Non-Volatile | 0.07mA | 2.7V~3.6V | 2MX16 | 16 | 33554432 bit | 0.000005A | 60 ns | 3V | YES | YES | YES | 1662 | 8words | YES | YES | FLASH | Parallel | 60ns | 4K32K | BOTTOM/TOP | |||||||||||||||||||||||||||||||||||||||||||||||||||
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AT29C020-90TU-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 1997 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 32-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TC | AT29C020 | 90ns | 2Mb 256K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BR93G76FV-3AGTE2 | ROHM Semiconductor | 0.5557 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Cut Tape (CT) | Active | 1 (Unlimited) | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | Surface Mount | -40°C~85°C TA | 8Kb 512 x 16 | Non-Volatile | 1.7V~5.5V | 3MHz | 3-WIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24LC16B-E/SN16KVAO | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Automotive, AEC-Q100 | Active | 3 (168 Hours) | 8 | 4.9mm | 8-SOIC (0.154, 3.90mm Width) | compliant | 3.9mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.75mm | 8 | DUAL | 5V | 24LC16B | YES | 1.27mm | R-PDSO-G8 | 2.5V | 5.5V | 900ns | AEC-Q100; TS 16949 | 16Kb 2K x 8 | Non-Volatile | 2.5V~5.5V | 256X8 | 8 | 2048 bit | SERIAL | 400kHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7016S15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 80 | SEMAPHORE; INTERRUPT FLAG; AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | TQFP | Parallel | 5.5V | 4.5V | 144 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 310mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 80 | COMMERCIAL | 0.65mm | SRAMs | 5V | 3-STATE | 15 ns | 18kB | RAM, SDR, SRAM | 14b | 16KX9 | Asynchronous | 0.015A | 9b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V124SA12PHG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | yes | Active | 3 (168 Hours) | 32 | 70°C | 0°C | 3.3V | 1 | 20.95mm | RoHS Compliant | Lead Free | 32 | SOIC | Parallel | 3.6V | 3V | 1 Mb | 10.16mm | 1mm | CMOS | 1 | 130mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 30 | 32 | COMMERCIAL | SRAMs | Not Qualified | 3-STATE | 12 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 17b | Asynchronous | 8b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY7C146-25JXC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | yes | Obsolete | 3 (168 Hours) | 52 | 19.1262mm | ROHS3 Compliant | 52-LCC (J-Lead) | unknown | 19.1262mm | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | 5.08mm | 1 | e3 | TIN | QUAD | 260 | 5V | 20 | 52 | YES | 1.27mm | S-PQCC-J52 | 4.5V | COMMERCIAL | 5.5V | 16Kb 2K x 8 | Volatile | 4.5V~5.5V | 2KX8 | 8 | 16384 bit | 25 ns | SRAM | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS25CQ032-JBLE-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 32 Mb | Surface Mount | 540.001716mg | -40°C~105°C TA | 15mA | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 8b | 104MHz | 256B | FLASH | SPI | 4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BR24T08FVT-WE2 | ROHM Semiconductor | 0.2641 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tape & Reel (TR) | 2011 | yes | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | Lead Free | Copper, Tin | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 8 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.2mm | 1 | e3 | Matte Tin (Sn) | DUAL | 225 | 2.5V | NOT SPECIFIED | BR24T08 | 0.65mm | 1.6V | Not Qualified | 5.5V | 900 ns | 8Kb 1K x 8 | Non-Volatile | 0.002mA | 1.6V~5.5V | 8 | 400kHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DMMR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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S25FL127SABBHIS00 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tray | 2006 | FL-S | Active | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 24 | 24-TBGA | SPI, Serial | 108MHz | Surface Mount | -40°C~85°C TA | FLASH - NOR | 24-BGA (8x6) | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 108MHz | FLASH | SPI - Quad I/O | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V67703S75PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel | 2009 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | FLOW-THROUGH ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 9 Mb | 117MHz | 14mm | 1.4mm | CMOS | 1 | 265mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 7.5 ns | 117MHz | 1.1MB | RAM, SDR, SRAM | 18b | 256KX36 | Synchronous | 0.05A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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93C76C-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Tube | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 10.16mm | Non-RoHS Compliant | Tin | No | 8 | 8-DIP (0.300, 7.62mm) | Serial | 8 kb | 4.953mm | 7.112mm | Through Hole | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | DUAL | 5V | 93C76C | 8 | 2.54mm | 5V | 100 ns | 8Kb 1K x 8 512 x 16 | Non-Volatile | 4.5V~5.5V | 512X16 | 3MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2ms | MICROWIRE | EEPROM | SPI | 2ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MX25U8035EZNI-10G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2010 | MX25xxx35/36 - MXSMIO™ | Not For New Designs | 3 (168 Hours) | 8 | EAR99 | 1.8V | 6mm | ROHS3 Compliant | Lead Free | ALSO CONFIGURABLE AS 8M X 1 | 8-WDFN Exposed Pad | SPI, Serial | 8 Mb | 5mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | 8 | YES | 1.27mm | R-PDSO-N8 | 1.65V | Not Qualified | 2V | 8Mb 1M x 8 | Non-Volatile | 0.025mA | 1.65V~2V | 2MX4 | 4 | 104MHz | 0.00002A | 2 | 10 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | SPI | FLASH | SPI | 30μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT40A1G4HX-083E:A | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2015 | Obsolete | 3 (168 Hours) | 78 | 1.2V | 1 | 11.5mm | ROHS3 Compliant | Lead Free | 78 | AUTO/SELF REFRESH | 78-TFBGA | unknown | 4 Gb | 9mm | Surface Mount | 0°C~95°C TC | SDRAM - DDR4 | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | 1.2V | YES | 0.8mm | 1.14V | 1.26V | 4Gb 1G x 4 | Volatile | 1.14V~1.26V | 1GX4 | 4 | 1.2GHz | MULTI BANK PAGE BURST | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LE24LA162CB-TE-F-H | ON Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 11 Weeks | Tape & Reel (TR) | 2016 | Active | 1 (Unlimited) | ROHS3 Compliant | 2-Wire, I2C, Serial | Surface Mount | -40°C~85°C TA | 16Kb 2K x 8 | Non-Volatile | 1.7V~3.6V | 400kHz | EEPROM | I2C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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47C04T-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel (TR) | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | IT ALSO HAS EEPROM BACKUP OF 512 X 8 BITS | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~125°C TA | EEPROM, SRAM | SYNCHRONOUS | 1.2mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 47C04 | YES | 0.65mm | R-PDSO-G8 | 4.5V | 5.5V | 400ns | TS 16949 | 4Kb 512 x 8 | Non-Volatile | 4.5V~5.5V | 512X8 | 8 | 4096 bit | 1MHz | EERAM | I2C | 1ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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M93S46-MN6T | STMicroelectronics | 7.7894 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | Non-RoHS Compliant | Contains Lead | No | 8 | 8-SOIC (0.154, 3.90mm Width) | Serial | 1 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.75mm | 1 | DUAL | 5V | M93S46 | 8 | YES | 1.27mm | 5V | 1 μs | 1Kb 64 x 16 | Non-Volatile | 0.002mA | 4.5V~5.5V | 64X16 | 16 | 2MHz | 0.000015A | 40 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | MICROWIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7006L55PFI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 64-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | IDT7006 | 64-TQFP (14x14) | 55ns | 128Kb 16K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S29GL128P10FFI012 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Surface Mount | Tape & Reel (TR) | 2003 | GL-P | Active | 3 (168 Hours) | 64 | 13mm | ROHS3 Compliant | Copper, Silver, Tin | No | 64 | 64-LBGA | 128 Mb | 11mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.4mm | 8542.32.00.51 | 1 | 110mA | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | 260 | 3V | 40 | 1mm | 2.7V | 3/3.3V | 3.6V | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 128MX1 | 1 | Asynchronous | 0.000005A | 100 ns | 8 | 3V | YES | YES | YES | 128 | 8/16words | YES | YES | FLASH | Parallel | 100ns | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||||
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70V07L35G | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | Active | 1 (Unlimited) | Non-RoHS Compliant | 68-BPGA | Through Hole | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT70V07 | 256Kb 32K x 8 | Volatile | 3V~3.6V | SRAM | Parallel | 35ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY7C1518KV18-333BZXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Tray | 2003 | Active | 3 (168 Hours) | 165 | 1.8V | 1 | ROHS3 Compliant | No | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 72 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, DDR II | 1 | 520mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | CY7C1518 | 165 | 3-STATE | 450 ps | 72Mb 4M x 18 | Volatile | 22b | 1.7V~1.9V | 18 | Synchronous | 333MHz | 18b | COMMON | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7007L20PF8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 80-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT7007 | 80-TQFP (14x14) | 20ns | 256Kb 32K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 20ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V2546S133BG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | Non-RoHS Compliant | 119-BGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V2546 | 119-PBGA (14x22) | 4.2ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 133MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT24C64AN-10SU-2.7-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | EEPROM | AT24C64 | 8-SOIC | 900ns | 64Kb 8K x 8 | Non-Volatile | 2.7V~5.5V | 400kHz | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY7C144E-25AXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 1996 | Obsolete | 3 (168 Hours) | 64 | EAR99 | 5V | 2 | 14mm | ROHS3 Compliant | Lead Free | No | 64 | 64-LQFP | 64 kb | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | 1.6mm | 1 | 275mA | e3 | Matte Tin (Sn) | QUAD | 260 | 5V | 30 | 64 | 0.8mm | 5V | 3-STATE | 64Kb 8K x 8 | Volatile | 26b | 4.5V~5.5V | 8KX8 | 8 | Asynchronous | 0.0005A | 8b | COMMON | SRAM | Parallel | 25ns |
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71V2546S150BG8 Integrated Device Technology (IDT)
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