Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Height | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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W9825G2JB-6 TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 90-TFBGA | Surface Mount | 0°C~70°C TA | SDRAM | 5ns | 256Mb 8M x 32 | Volatile | 3V~3.6V | 166MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q80EWSVIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2016 | SpiFlash® | Active | 3 (168 Hours) | 8 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 3.9mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.9mm | 1 | DUAL | 1.8V | YES | 1.27mm | R-PDSO-G8 | 1.65V | Not Qualified | 1.8V | 1.95V | 8Mb 1M x 8 | Non-Volatile | 0.02mA | 1.65V~1.95V | 8MX1 | 1 | 8388608 bit | 104MHz | 0.0000075A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 1.8V | SPI | FLASH | SPI | 800μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71256SA20Y8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape and Reel | 2010 | no | 28 | EAR99 | 70°C | 0°C | 5V | 1 | Non-RoHS Compliant | 28 | Parallel | 5.5V | 4.5V | 256 kb | CMOS | 3.556mm | 1 | 145mA | e0 | TIN LEAD | DUAL | J BEND | 225 | 5V | 30 | 28 | COMMERCIAL | Not Qualified | 3-STATE | 20 ns | RAM, SRAM - Asynchronous | 15b | 32KX8 | 8 | Asynchronous | 8b | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL064LABMFB003 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tape & Reel (TR) | 2017 | Automotive, AEC-Q100, FL-L | Active | 3 (168 Hours) | 16 | 10.3mm | ROHS3 Compliant | IT IS ALSO CONFIGURED AS 64M X 1 | 16-SOIC (0.295, 7.50mm Width) | 7.5mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 2.65mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G16 | 2.7V | 3.6V | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 16MX4 | 4 | 67108864 bit | SERIAL | 108MHz | 2 | 3V | FLASH | SPI - Quad I/O, QPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT53B384M32D2DS-062 XT:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 200-WFBGA | Surface Mount | -30°C~105°C TC | SDRAM - Mobile LPDDR4 | 12Gb 384M x 32 | Volatile | 1.1V | 1600MHz | DRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29AL016J70BFI010 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 2005 | AL-J | Active | 3 (168 Hours) | 48 | 8.15mm | ROHS3 Compliant | Lead Free | Copper, Silver, Tin | No | 48 | TOP BOOT BLOCK | 48-VFBGA | 16 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1mm | 8542.32.00.51 | 1 | 12mA | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | 260 | 3V | 40 | 0.8mm | 2.7V | 3/3.3V | 3.6V | 16Mb 2M x 8 1M x 16 | Non-Volatile | 2.7V~3.6V | 1MX16 | 16 | Asynchronous | 8b | 0.000005A | 70 ns | 8 | 3V | YES | YES | YES | 12131 | YES | YES | FLASH | Parallel | 70ns | 16K8K32K64K | TOP | |||||||||||||||||||||||||||||||||||||||||||||||
 |
71421LA20PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel | 2008 | yes | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Lead Free | No | 64 | AUTOMATIC POWER DOWN | TQFP | Parallel | 5.5V | 4.5V | 16 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 30 | 64 | COMMERCIAL | YES | 0.8mm | SRAMs | 5V | 3-STATE | 20 ns | 2kB | RAM, SDR, SRAM | 22b | 0.0015A | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST25VF032B-80-4I-QAE-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2005 | SST25 | yes | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.A | 3.3V | 6mm | ROHS3 Compliant | Lead Free | No | 8 | 8-WDFN Exposed Pad | SPI, Serial | 32 Mb | Surface Mount | -40°C~85°C TA | CMOS | 1 | 25mA | e3 | MATTE TIN | DUAL | SST25VF032B | 1.27mm | 2.7V | 3.6V | 6 ns | 32Mb 4M x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 8b | 80MHz | 0.00002A | 8b | 100 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 10μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F256G08CBCBBWP-10:B TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | 0°C~70°C TA | FLASH - NAND | 256Gb 32G x 8 | Non-Volatile | 2.7V~3.6V | 100MHz | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT45DB321D-SU-2.5 | Adesto Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | Obsolete | 1 (Unlimited) | 8 | 3A991.B.1.A | 3.3V | 7.7mm | RoHS Compliant | No | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | No SVHC | 32 Mb | 1.7mm | 5.13mm | Surface Mount | 540.001716mg | -40°C~85°C TC | CMOS | 15mA | 1 | 15mA | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 8 | 1.27mm | 2.5V | 3.6V | 6 ns | 32Mb 528Bytes x 8192 pages | Non-Volatile | 1b | 2.5V~3.6V | 32MX1 | Synchronous | 8b | 50MHz | 8b | 2.7V | 512B | FLASH | SPI | 6ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S25FL256SDSMFV011 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tube | 2016 | FL-S | Active | 3 (168 Hours) | 16 | 10.3mm | ROHS3 Compliant | ALSO CONFIGURABLE AS 256M X 1 | 16-SOIC (0.295, 7.50mm Width) | SPI, Serial | 7.5mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 2.65mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G16 | 2.7V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 32MX8 | 8 | 268435456 bit | 80MHz | 500ms | 3V | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "IS61NVF102418-7.5B3I-TR") |
IS61NVF102418-7.5B3I-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 165 | 165-TBGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 7.5ns | 18Mb 1M x 18 | Volatile | 2.375V~2.625V | 117MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL512S10FHSS30 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tray | GL-S | Active | 3 (168 Hours) | RoHS Compliant | 64 | 64-LBGA | Surface Mount | 0°C~85°C TA | FLASH - NOR | 100ns | 512Mb 32M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 60ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
FM25040B-GATR | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | Automotive, AEC-Q100, F-RAM™ | Obsolete | 3 (168 Hours) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 4 kb | Surface Mount | -40°C~125°C TA | FRAM (Ferroelectric RAM) | SYNCHRONOUS | 1.75mm | 1 | 3mA | e3 | Tin (Sn) | DUAL | 260 | 5V | 30 | FM25040 | 8 | 1.27mm | SRAMs | Not Qualified | 5V | 30 ns | 4Kb 512 x 8 | Non-Volatile | 4.5V~5.5V | 8 | 8b | 14MHz | 0.00003A | 8b | FRAM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY62177EV30LL-55ZXI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tray | 2001 | MoBL® | Active | 3 (168 Hours) | 48 | 3V | 1 | 18.4mm | ROHS3 Compliant | Lead Free | No | 48 | 48-TFSOP (0.724, 18.40mm Width) | No SVHC | 32 Mb | 1.2mm | 12mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 45mA | 1 | 45mA | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 30 | CY62177 | 48 | 0.5mm | 2.2V | 3.7V | 3-STATE | 32Mb 4M x 8 2M x 16 | Volatile | 21b | 2.2V~3.7V | Asynchronous | 55 ns | COMMON | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S32800B-6BI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 2 (1 Year) | 90 | EAR99 | 1 | 13mm | Non-RoHS Compliant | 90 | AUTO/SELF REFRESH | 90-TFBGA | not_compliant | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.45mm | 8542.32.00.24 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 90 | YES | 0.8mm | 3V | Not Qualified | 3.3V | 3.6V | 5.5ns | 256Mb 8M x 32 | Volatile | 0.3mA | 3V~3.6V | 8MX32 | 32 | 268435456 bit | 32b | 166MHz | 0.002A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71T75902S75BGGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2005 | 3 (168 Hours) | 119 | 3A991.B.2.A | 85°C | -40°C | 22mm | RoHS Compliant | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | TIN LEAD | BOTTOM | BALL | 225 | 2.5V | 30 | 119 | INDUSTRIAL | YES | 1.27mm | 2.375V | Not Qualified | 2.625V | RAM, SRAM | 1MX18 | 18 | 18874368 bit | 7.5 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
FM24V02-GTR | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2008 | F-RAM™ | Obsolete | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | 256 kb | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 1.75mm | 1 | 1mA | e4 | NICKEL PALLADIUM GOLD | DUAL | 260 | 3.3V | 20 | FM24V02 | 8 | 1.27mm | 2V | SRAMs | 2.5/3.3V | 3.6V | 130ns | 256Kb 32K x 8 | Non-Volatile | 2V~3.6V | 8 | 8b | 3.4MHz | 0.00015A | 8b | FRAM | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT29F4G08ABADAWP-AITX:D TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NAND | 4Gb 512M x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY62256NL-70SNXI | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | MoBL® | yes | Obsolete | 3 (168 Hours) | 28 | 17.9324mm | ROHS3 Compliant | 28-SOIC (0.295, 7.50mm Width) | unknown | 7.5057mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 2.794mm | 1 | e3/e4 | MATTE TIN/NICKEL PALLADIUM GOLD | DUAL | 260 | 5V | 20 | 28 | YES | 1.27mm | R-PDSO-G28 | 4.5V | COMMERCIAL | 5.5V | 256Kb 32K x 8 | Volatile | 4.5V~5.5V | 32KX8 | 8 | 262144 bit | 70 ns | SRAM | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MTFC4GMWDQ-AIT A | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 7 Weeks | Bulk | e•MMC™ | Active | 3 (168 Hours) | ROHS3 Compliant | 100-LBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND | 32Gb 4G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93LC66BX-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2003 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 8-SOIC (0.154, 3.90mm Width) | Serial | 4 kb | 1.5mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 2mA | e3 | DUAL | 260 | 3V | 40 | 93LC66B | 8 | 1.27mm | 2.5V | 3/5V | 5.5V | 3-STATE | 250 ns | 4Kb 256 x 16 | Non-Volatile | 2.5V~5.5V | 2MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 6ms | MICROWIRE | EEPROM | SPI | 6ms | |||||||||||||||||||||||||||||||||||||||||||||||||||
|
N25Q008A11ESC40F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | 2016 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | -40°C~85°C TA | FLASH - NOR | N25Q008A11 | 8Mb 1M x 8 | Non-Volatile | 1.7V~2V | 108MHz | FLASH | SPI | 8ms, 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75902S75PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | 2005 | Active | 70°C | 0°C | 2.5V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | LQFP | Parallel | 18 Mb | 14mm | 1.4mm | RAM, SRAM | 20b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V65603S100PF | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V65603 | 5ns | 9Mb 256K x 36 | Volatile | 3.135V~3.465V | 100MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IS61LPS102418A-250B3I | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | no | Active | 3 (168 Hours) | 165 | 3A991.B.2.A | 15mm | ROHS3 Compliant | 165 | PIPELINED ARCHITECTURE | 165-TBGA | 13mm | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 165 | YES | 1mm | 3.135V | Not Qualified | 2.5/3.33.3V | 3.465V | 3-STATE | 2.6ns | 18Mb 1M x 18 | Volatile | 0.5mA | 3.135V~3.465V | 1MX18 | 18 | 18874368 bit | 250MHz | 0.125A | COMMON | 3.14V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
DS1230ABP-100+ | Maxim Integrated | 26.3158 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2002 | yes | Active | 1 (Unlimited) | 34 | EAR99 | ROHS3 Compliant | 34-PowerCap™ Module | not_compliant | Surface Mount | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 8473.30.11.40 | 1 | e3 | MATTE TIN | DUAL | 245 | 5V | 40 | DS1230AB | 34 | YES | R-XDMA-U34 | 4.75V | SRAMs | Not Qualified | 5V | 5.25V | 256Kb 32K x 8 | Non-Volatile | 0.085mA | 4.75V~5.25V | 32KX8 | 8 | 262144 bit | 0.0006A | 100 ns | NVSRAM | Parallel | 100ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT53E128M32D2DS-053 AUT:A TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 200-WFBGA | Surface Mount | -40°C~125°C | SDRAM - Mobile LPDDR4 | 4Gb 128M x 32 | Volatile | 0.6V 1.1V | 1.866GHz | DRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
FM21LD16-60-BG | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2009 | F-RAM™ | Obsolete | 3 (168 Hours) | 48 | EAR99 | 3.3V | 8mm | ROHS3 Compliant | No | 48 | 48-TFBGA | 2 Mb | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 1.2mm | 8542.32.00.71 | 1 | 12mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3.3V | FM21LD16 | 48 | 0.75mm | 2.7V | SRAMs | 3.6V | 2Mb 128K x 16 | Non-Volatile | 2.7V~3.6V | 128KX16 | 16 | 16b | 0.00027A | 110 ns | 16b | FRAM | Parallel | 110ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S34MS01G200BHI000 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Surface Mount | Tray | 2014 | MS-2 | Discontinued | 3 (168 Hours) | 63 | 1.8V | 11mm | ROHS3 Compliant | Lead Free | Copper, Silver, Tin | No | 63 | 63-VFBGA | 1 Gb | Surface Mount | -40°C~85°C TA | FLASH - NAND | 1mm | 8542.32.00.51 | 1 | BOTTOM | 1.8V | 0.8mm | 1.7V | 1.95V | 1Gb 128M x 8 | Non-Volatile | 28b | 1.7V~1.95V | 128MX8 | 8 | 2kB | FLASH | Parallel | 45ns |
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