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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Voltage - Rated Current Rating Radiation Hardening Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Width Mounting Type Weight Operating Temperature Insulation Resistance Lead Length JESD-609 Code Body Material Number of Rows Feature Pitch Current Rating (Amps) Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
20-352000-10 20-352000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole RYTON 2006 Correct-A-Chip® 352000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 20 Non-RoHS Compliant 1A 20 Through Hole 3.175mm e3 IC SOCKET 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
PA-TS1D6SM18-56 PA-TS1D6SM18-56 Logical Systems Inc. 0.0000
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0.00000000 7 Weeks 2006 Active Not Applicable Solder RoHS Compliant 56 Through Hole 0.020 0.50mm 0.125 3.18mm 0.100 2.54mm TSOP DIP
18-665000-00 18-665000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 18 Non-RoHS Compliant 18 Surface Mount 787.4μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
1110267-N 1110267-N Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole 2006 Correct-A-Chip® 1110267-N Active 1 (Unlimited) Solder EAR99 64 Non-RoHS Compliant 68 SOCKET ADAPTER Through Hole e0 IC SOCKET Tin-Lead 200.0μin 5.08μm Brass 0.100 2.54mm PLCC DIP, 0.9 (22.86mm) Row Spacing FR4 Epoxy Glass
232-1285-39-0602J 232-1285-39-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 32 Gold Straight 32 RoHS Compliant Lead Free Copper Gold No 32 Through Hole -55°C~125°C 2 Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
1107254-08 1107254-08 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 Active 1 (Unlimited) Solder EAR99 Gold 8 ROHS3 Compliant UL94 V-0 3A 8 SOCKET ADAPTER, UL 94V-0 2.54mm Through Hole 3.302mm e0 2 UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
20-354W00-10 20-354W00-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 20 25.4mm ROHS3 Compliant Lead Free 20 STANDARD: UL 94V-0 1.58mm Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
08-354000-10 08-354000-10 Aries Electronics 0.0000
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0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 8 Non-RoHS Compliant UL94 V-0 Tin 3A 8 STANDARD: UL 94V-0 Surface Mount 105°C e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
20-354000-20 20-354000-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 20 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 20 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
44-653000-11-RC 44-653000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder 44 ROHS3 Compliant UL94 V-0 Lead Free Brass Gold 1A 44 No SVHC Through Hole 3.175mm Socket Included 1A UL94 V-0 15.24 mm 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
16-354W00-20 16-354W00-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 16 ROHS3 Compliant 16 STANDARD: UL 94V-0 Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
1110087 1110087 Aries Electronics 0.0000
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0.00000000 download 6 Weeks 2012 Correct-A-Chip® 1110087 Active 1 (Unlimited) Solder EAR99 Gold 144 Non-RoHS Compliant 144 SOCKET ADAPTER Through Hole 105°C e0 IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm VQFP PGA FR4 Epoxy Glass
224-1275-29-0602J 224-1275-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 24 150°C -55°C Female Gold 24 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 24 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
84-653000-10 84-653000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2007 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 84 Non-RoHS Compliant Contains Lead Tin 1A 84 UL 94V-0 6.08mm Through Hole e0 2 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
LCQT-QFP0.8-32 LCQT-QFP0.8-32 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 32 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.031 0.80mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
228-1277-19-0602J 228-1277-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 32mm 28 50.3mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 6.9mm Through Hole 453.59237g -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
96-080M80 96-080M80 Aries Electronics 0.0000
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0.00000000 download 2001 Obsolete 1 (Unlimited) Solder EAR99 Tin 80 34.3mm RoHS Compliant Lead Free 80 SOCKET ADAPTER 2.39mm Through Hole IC SOCKET 0.031 0.80mm Tin-Lead 200.0μin 5.08μm Copper Brass Alloy 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
1111163 1111163 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 1111163 Active 1 (Unlimited) EAR99 Gold 40 Non-RoHS Compliant UL94 V-0 Gold, Tin 40 SOCKET ADAPTER, UL 94V-0 2.54mm e3 2.54mm UL94 V-0 IC SOCKET 10.0μin 0.25μm Brass Socket, 0.6 (15.24mm) Row Spacing PLCC FR4 Epoxy Glass
214-3339-19-0602J 214-3339-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 14 150°C -55°C Female Gold Straight 14 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 14 Through Hole 453.59237g -55°C~125°C Glass, Polysulfone 2 Closed Frame 2.54mm 1A UL94 V-0 7.62 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
97-68340 97-68340 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 97-68340 Active 1 (Unlimited) Solder EAR99 Tin 144 39.4mm Non-RoHS Compliant Lead Free 144 SOCKET ADAPTER 2.39mm Through Hole IC SOCKET 0.026 0.65mm 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
18-35W000-11-RC 18-35W000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 18 ROHS3 Compliant 18 SOCKET ADAPTER SOIC Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
20-350001-10 20-350001-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 20 Non-RoHS Compliant Contains Lead 20 SOCKET ADAPTER SOIC 1.58mm Through Hole e0 2 7.62 mm IC SOCKET 0.050 1.27mm Tin 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
24-350000-10-HT 24-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 8 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 no Active 1 (Unlimited) Solder EAR99 Tin 24 Non-RoHS Compliant 24 SOCKET ADAPTER Through Hole 3.175mm e0 High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
28-350002-11-RC-P 28-350002-11-RC-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2013 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder ROHS3 Compliant 28 SOIC Through Hole 3.175mm 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
14-651000-10 14-651000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 14 Non-RoHS Compliant 1A 14 SOCKET ADAPTER Through Hole 3.683mm e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
232-1285-09-0602J 232-1285-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 32 150°C -55°C Female Gold Straight 6.9mm 32 55.2mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1kV 1A 32 32mm Through Hole -55°C~125°C 1GOhm Glass, Polysulfone Closed Frame 2.54mm 1A UL94 V-0 15.24 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
MIKROE-231 MIKROE-231 MikroElektronika 0.0000
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0.00000000 Obsolete 1 (Unlimited) 40 AT90PWM2 DIP
28-651000-11-RC 28-651000-11-RC Aries Electronics 0.0000
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0.00000000 Correct-A-Chip® 651000 Obsolete Not Applicable Solder 28 Through Hole 1A 0.026 0.65mm Gold 10.0μin 0.25μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
24-354W00-10 24-354W00-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 24 30.5mm ROHS3 Compliant Lead Free 24 STANDARD: UL 94V-0 1.58mm Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
LCQT-QFP0.5-52 LCQT-QFP0.5-52 Aries Electronics 0.0000
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Min: 1

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0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C ROHS3 Compliant UL94 V-0 Lead Free 52 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.020 0.50mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
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