Items : %s%s
IC Adapters
Additional Feature
- ADAPTER
- SOCKET ADAPTER
- SOCKET ADAPTER, 94V-0
- SOCKET ADAPTER, UL 94V-0
- STANDARD: UL 94V-0
- UL 94V-0
Board Material
- FR4 Epoxy Glass
- Polyimide (PI)
Body Breadth
- 0.7 inch
Body Depth
- 0.3 inch
Body Material
- Glass, Polysulfone
Cable Length
- 3m
Connector Type
- DIP, Socket
Contact Finish - Mating
- GOLD
- GOLD (10)
- GOLD (10) OVER NICKEL (100)
- NOT SPECIFIED
- Silver
- TIN
- TIN LEAD
- Tin-Lead
Contact Finish - Post
- Gold
- Tin
- Tin-Lead
Contact Finish Thickness - Post
- Flash
Contact Material
- Brass
- Copper
Contact Material - Mating
- Beryllium Copper
- Brass
- Copper
- Phosphor Bronze
Contact Material - Post
- Beryllium Copper
- Brass
- Brass Alloy
- Phosphor Bronze
Contact Plating
- Gold
- Gold, Tin
- Lead, Tin
- Silver
- Tin
Contact Style
- RND PIN-SKT
Convert From (Adapter End)
- AT90PWM1
- AT90PWM2
- DIP, 0.3 (7.62mm) Row Spacing
- DIP, 0.4 (10.16mm) Row Spacing
- DIP, 0.6 (15.24mm) Row Spacing
- DIP, 0.8 (20.32mm) Row Spacing
- DIP, 0.9 (22.86mm) Row Spacing
- DIP, 1.0 (25.40mm) Row Spacing
- HB2E Relay
- MSOP
- Multiple Packages
- PLCC
- PQFP
- QFP
- SIP
- Socket, 0.6 (15.24mm) Row Spacing
- SOIC
- SOIC-W
- SOJ
- SSOP
- TQFP
- TSOP
- VQFP
Convert To (Adapter End)
- DIP
- DIP, 0.3 (7.62mm) Row Spacing
- DIP, 0.4 (10.16mm) Row Spacing
- DIP, 0.6 (15.24mm) Row Spacing
- DIP, 0.8 (20.32mm) Row Spacing
- DIP, 0.9 (22.86mm) Row Spacing
- DIP, 1.0 (25.40mm) Row Spacing
- JEDEC
- PGA
- PLCC
- QFP
- SOIC
- SOWIC
Core Architecture
- AVR
Current Rating
- 1A
- 3A
Current Rating (Amps)
- 1A
- 3A
Depth
- 25.4mm
- 32.3mm
- 32mm
- 43.2mm
- 6.9mm
Device Socket Type
- IC SOCKET
ECCN Code
- EAR99
Factory Lead Time
- 16 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
Feature
- Closed Frame
- High Temperature
- Socket Included
Flammability Rating
- UL94 V-0
Gender
- Female
Height
- 1.58mm
- 2.29mm
- 2.39mm
- 5.85mm
- 6.08mm
- 6.9mm
Housing Material
- Polyamide
- Polyamide (PA46), Nylon 4/6, Glass Filled
- Polyester
- Polyphenylene Sulfide (PPS)
- Polysulfone (PSU), Glass Filled
- RYTON
Insulation Resistance
- 1GOhm
JESD-609 Code
- e0
- e3
- e4
Lead Free
- Contains Lead
- Lead Free
Lead Length
- 2.032mm
- 2.286mm
- 3.175mm
- 3.302mm
- 3.683mm
- 3.81mm
- 3m
- 5.9944mm
Lead Pitch
- 1.27mm
- 2.54mm
Length
- 10.2mm
- 100.3mm
- 17.8mm
- 19.4mm
- 20.3mm
- 22.2mm
- 22.9mm
- 25.4mm
- 30.5mm
- 34.3mm
- 35.6mm
- 39.4mm
- 3m
- 40.1mm
- 40.5mm
- 40.6mm
- 43.2mm
- 45mm
- 50.3mm
- 55.2mm
- 65.5mm
- 68.1mm
- 69.9mm
- 72.5mm
- 95.7mm
Material
- Glass, Polyester, Thermoplastic
- Polyester
Material Flammability Rating
- UL94 V-0
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Not Applicable
Mount
- Socket
- Surface Mount
- Through Hole
- Through Hole, Wire
- Wire
Mounting Type
- Surface Mount
- Through Hole
Number of Contacts
- 10
- 100
- 12
- 128
- 132
- 14
- 144
- 16
- 160
- 18
- 20
- 200
- 208
- 22
- 24
- 28
- 32
- 36
- 40
- 42
- 44
- 48
- 52
- 56
- 64
- 68
- 8
- 80
- 84
- 90
Number of Pins
- 10
- 100
- 12
- 128
- 132
- 14
- 144
- 16
- 160
- 169
- 18
- 184
- 20
- 208
- 22
- 24
- 26
- 28
- 32
- 36
- 40
- 42
- 44
- 48
- 52
- 56
- 60
- 64
- 68
- 8
- 80
- 84
- 90
Number of Positions
- 10
- 12
- 14
- 144
- 16
- 160
- 18
- 20
- 22
- 24
- 26
- 28
- 32
- 40
- 42
- 48
- 56
- 64
- 90
- 95
Number of Rows
- 1
- 2
Orientation
- Straight
Package / Case
- PLCC
- QFP
- SOIC
- TO-8
- TSOP
Packaging
- Box
- Bulk
Part Status
- Active
- Obsolete
Pbfree Code
- no
- yes
PCB Contact Pattern
- RECTANGULAR
PCB Contact Row Spacing
- 0.3 mm
- 0.6 mm
Pitch
- 1.778mm
- 1.78mm
- 2.54mm
Pitch - Mating
- 0.020 0.50mm
- 0.024 0.60mm
- 0.025 0.64mm
- 0.026 0.65mm
- 0.031 0.80mm
- 0.050 1.27mm
- 0.070 1.78mm
- 0.100 2.54mm
Pitch - Post
- 0.031 0.80mm
- 0.050 1.27mm
- 0.070 1.78mm
- 0.100 2.54mm
Published
- 2000
- 2001
- 2002
- 2003
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2017
- 2018
Radiation Hardening
- No
REACH SVHC
- No SVHC
RoHS Status
- Non-RoHS Compliant
- RoHS Compliant
- ROHS3 Compliant
Row Spacing
- 10.16 mm
- 15.24 mm
- 2.54 mm
- 20.32 mm
- 22.86 mm
- 25.4 mm
- 3.81 mm
- 7.62 mm
Sensing Distance
- 3 m
Series
- 647
- DS9075
Termination
- Solder
- Wire Wrap
Termination Post Length
- 0.030 0.76mm
- 0.031 0.80mm
- 0.080 2.03mm
- 0.089 2.28mm
- 0.090 2.29mm
- 0.125 3.18mm
- 0.130 3.30mm
- 0.145 3.68mm
- 0.150 3.81mm
- 0.180 4.57mm
- 0.236 6.00mm
- 0.620 15.75mm
Voltage - Rated
- 1kV
Weight
- 453.59237g
- 680.388555g
Width
- 24.4mm
- 27.9mm
- 32.3mm
- 32mm
- 38.5mm
- 43.2mm
- 6.9mm
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Housing Material | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Termination | Number of Positions | ECCN Code | Max Operating Temperature | Min Operating Temperature | Contact Finish - Mating | Number of Contacts | RoHS Status | Flammability Rating | Lead Free | Contact Material | Contact Plating | Current Rating | Number of Pins | Additional Feature | Package / Case | REACH SVHC | Lead Pitch | Mounting Type | Weight | Operating Temperature | Lead Length | JESD-609 Code | Number of Rows | Pitch | Current Rating (Amps) | Material Flammability Rating | Row Spacing | Device Socket Type | Pitch - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Material - Mating | Contact Material - Post | Termination Post Length | Pitch - Post | Convert From (Adapter End) | Convert To (Adapter End) | Board Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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LCQT-QFP0.5-40-1 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Through Hole | Polyester | Correct-A-Chip® | Active | 1 (Unlimited) | Solder | 125°C | -55°C | Non-RoHS Compliant | UL94 V-0 | Lead Free | 40 | QFP | No SVHC | Through Hole | -55°C~125°C | 5.9944mm | UL94 V-0 | 0.020 0.50mm | Gold | Flash | Brass | 0.236 6.00mm | 0.100 2.54mm | Multiple Packages | QFP | FR4 Epoxy Glass | |||||||||||||||||||||
 |
1109522 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Through Hole | Polyamide (PA46), Nylon 4/6, Glass Filled | 2006 | Correct-A-Chip® 1109522 | Active | 1 (Unlimited) | Solder | EAR99 | 105°C | -55°C | Gold | 8 | Non-RoHS Compliant | UL94 V-0 | 3A | 8 | STANDARD: UL 94V-0 | TO-8 | 2.54mm | Through Hole | 3.175mm | e0 | 2 | UL94 V-0 | IC SOCKET | 0.100 2.54mm | Tin-Lead | 10.0μin 0.25μm | 200.0μin 5.08μm | Beryllium Copper | Brass | 0.125 3.18mm | DIP, 0.3 (7.62mm) Row Spacing | JEDEC | FR4 Epoxy Glass | |||||||||||||
 |
228-4817-19-0602J | Artery | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Wire | Polysulfone (PSU), Glass Filled | 2011 | Textool™ | Active | 1 (Unlimited) | Solder | 28 | 150°C | -55°C | Gold | 28 | RoHS Compliant | UL94 V-0 | Lead Free | Copper | Gold | 1A | 28 | Through Hole | 453.59237g | -55°C~125°C | 2.54mm | 1A | UL94 V-0 | 0.100 2.54mm | Gold | 30.0μin 0.76μm | 30.0μin 0.76μm | Beryllium Copper | Beryllium Copper | 0.100 2.54mm | DIP, 0.4 (10.16mm) Row Spacing | DIP, 0.4 (10.16mm) Row Spacing | ||||||||||||||
 |
16-354000-10 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Polyamide (PA46), Nylon 4/6, Glass Filled | 2012 | Correct-A-Chip® 354000 | Active | 1 (Unlimited) | Solder | EAR99 | Gold | 16 | Non-RoHS Compliant | UL94 V-0 | Tin | 3A | 16 | STANDARD: UL 94V-0 | Surface Mount | 105°C | e3 | 2 | UL94 V-0 | 7.62 mm | IC SOCKET | 0.100 2.54mm | 10.0μin 0.25μm | 10.0μin 0.25μm | Beryllium Copper | Brass | 0.050 1.27mm | DIP, 0.3 (7.62mm) Row Spacing | SOIC | |||||||||||||||||||
|
LCQT-QFP0.65-52 | Aries Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Through Hole | Polyester | Correct-A-Chip® | Active | 1 (Unlimited) | Solder | 125°C | -55°C | Non-RoHS Compliant | UL94 V-0 | Lead Free | 52 | QFP | No SVHC | Through Hole | -55°C~125°C | 5.9944mm | UL94 V-0 | 0.026 0.65mm | Gold | Flash | Brass | 0.236 6.00mm | 0.100 2.54mm | Multiple Packages | QFP | FR4 Epoxy Glass |
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16-354000-10 Aries Electronics
IC & Component Sockets 16P DIP TO SOIC ADAPTER SHORT PIN
Price: 0.0000
RFQ -
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