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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Voltage - Rated Current Rating Radiation Hardening Number of Pins Additional Feature Package / Case REACH SVHC Height Width Mounting Type Weight Operating Temperature Insulation Resistance Lead Length JESD-609 Code Body Material Number of Rows Feature Pitch Current Rating (Amps) Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
228-1277-19-0602J 228-1277-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 32mm 28 50.3mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 6.9mm Through Hole 453.59237g -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
248-1282-29-0602J 248-1282-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 48 150°C -55°C Female Gold 48 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 48 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
10-350000-10-HT 10-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder 10 Tin Non-RoHS Compliant Tin 10 SOIC Through Hole 3.175mm High Temperature 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
18-665000-00 18-665000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 18 Non-RoHS Compliant 18 Surface Mount 787.4μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
20-351000-10 20-351000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2009 Correct-A-Chip® 351000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 20 Non-RoHS Compliant Contains Lead Tin 1A 20 SOCKET ADAPTER 1.58mm Through Hole e0 2 7.62 mm IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
1110267-N 1110267-N Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole 2006 Correct-A-Chip® 1110267-N Active 1 (Unlimited) Solder EAR99 64 Non-RoHS Compliant 68 SOCKET ADAPTER Through Hole e0 IC SOCKET Tin-Lead 200.0μin 5.08μm Brass 0.100 2.54mm PLCC DIP, 0.9 (22.86mm) Row Spacing FR4 Epoxy Glass
214-3339-19-0602J 214-3339-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 14 150°C -55°C Female Gold Straight 14 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 14 Through Hole 453.59237g -55°C~125°C Glass, Polysulfone 2 Closed Frame 2.54mm 1A UL94 V-0 7.62 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
95-100I25 95-100I25 Aries Electronics 0.0000
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0.00000000 download 2001 Obsolete 1 (Unlimited) Solder EAR99 Tin 100 34.3mm RoHS Compliant Lead Free Brass 100 SOCKET ADAPTER 2.39mm Through Hole 2.54 mm IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Copper Brass Alloy 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
16-35W000-10 16-35W000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2003 Correct-A-Chip® 35W000 Active 1 (Unlimited) Solder EAR99 16 20.3mm Non-RoHS Compliant Lead Free 16 1.58mm Through Hole e0 IC SOCKET 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
800-19-6-1 800-19-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
232-1285-09-0602J 232-1285-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 32 150°C -55°C Female Gold Straight 6.9mm 32 55.2mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1kV 1A 32 32mm Through Hole -55°C~125°C 1GOhm Glass, Polysulfone Closed Frame 2.54mm 1A UL94 V-0 15.24 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
28-352000-10 28-352000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole RYTON 2007 Correct-A-Chip® 352000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 28 Non-RoHS Compliant 1A 28 Through Hole 3.175mm e3 IC SOCKET 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
84-653000-11-RC 84-653000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 653000 yes Active 1 (Unlimited) Solder EAR99 105°C -55°C 84 ROHS3 Compliant UL94 V-0 Lead Free 1A 84 UL 94V-0 Through Hole 3.175mm e4 2 Socket Included UL94 V-0 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
32-450001-10-P 32-450001-10-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 450001 Active 1 (Unlimited) Solder 32 Non-RoHS Compliant Contains Lead 32 SOIC Through Hole 3.175mm 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
28-450001-11-RC 28-450001-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 450001 yes Active 1 (Unlimited) Solder EAR99 Gold 28 ROHS3 Compliant 28 SOCKET ADAPTER Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
224-5248-09-0602J 224-5248-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 24 150°C -55°C Female Gold 24 RoHS Compliant Lead Free Copper Gold 24 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
28-354000-20 28-354000-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 28 ROHS3 Compliant UL94 V-0 Lead Free Tin 3A 28 STANDARD: UL 94V-0 1.58mm Surface Mount e3 2 2.54mm UL94 V-0 7.62 mm IC SOCKET 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing SOIC
1110087 1110087 Aries Electronics 0.0000
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0.00000000 download 6 Weeks 2012 Correct-A-Chip® 1110087 Active 1 (Unlimited) Solder EAR99 Gold 144 Non-RoHS Compliant 144 SOCKET ADAPTER Through Hole 105°C e0 IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm VQFP PGA FR4 Epoxy Glass
22-666000-00 22-666000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 22 Non-RoHS Compliant 22 UL 94V-0 Surface Mount 2.032mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
LCQT-QFP0.8-32 LCQT-QFP0.8-32 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 32 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.031 0.80mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
228-1277-39-0602J 228-1277-39-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
28-354000-21-RC 28-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 28 ROHS3 Compliant UL94 V-0 3A 28 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing SOIC
08-301296-10 08-301296-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 301296 Active 1 (Unlimited) Solder EAR99 105°C -55°C 8 Non-RoHS Compliant Lead Free Tin 8 Through Hole 3.175mm e3 1 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm SOIC JEDEC FR4 Epoxy Glass
84-652000-10 84-652000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 84 Non-RoHS Compliant 1A 84 UL 94V-0 Through Hole 3.175mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
222-3343-09-0602J 222-3343-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 22 150°C -55°C Female Gold 22 RoHS Compliant Lead Free Copper Gold 22 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
08-305479-10 08-305479-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Box 2009 Correct-A-Chip® 305479 Active 1 (Unlimited) Solder EAR99 8 Non-RoHS Compliant Lead Free 8 Through Hole 3.175mm e3 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm SOIC JEDEC FR4 Epoxy Glass
232-1285-39-0602J 232-1285-39-0602J Artery 0.0000
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Min: 1

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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 32 Gold Straight 32 RoHS Compliant Lead Free Copper Gold No 32 Through Hole -55°C~125°C 2 Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
240-1280-39-0602J 240-1280-39-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2006 Textool™ Active 1 (Unlimited) Wire Wrap 40 150°C -55°C Female Gold 40 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 40 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
96-100M65 96-100M65 Aries Electronics 0.0000
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0.00000000 download 2003 Obsolete 1 (Unlimited) Solder EAR99 Tin 200 34.3mm Non-RoHS Compliant Contains Lead 100 SOCKET ADAPTER 2.39mm Through Hole IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
20-555000-00 20-555000-00 Aries Electronics 0.0000
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0.00000000 6 Weeks 2009 Correct-A-Chip® 555000 Active 1 (Unlimited) Solder EAR99 20 Non-RoHS Compliant Lead Free 20 SOCKET ADAPTER Surface Mount 105°C e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.050 1.27mm SSOP SOWIC FR4 Epoxy Glass
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