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Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Lead Free | Package / Case | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SMDSN100-S-16 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | ROHS3 Compliant | Solder Shot | Sn100(100) | Bag, 1 lb (454g) | Lead Free | 450°F 232°C | |||||||||||||||
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04-7070-0000 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | ULTRAPURE® | Active | 1 (Unlimited) | ROHS3 Compliant | Lead Free | Bar Solder | Sn95Ag5 (95/5) | Bar, 1.66 lbs (750g) | Lead Free | 430°F~473°F 221°C~245°C | ||||||||||||||
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04-7386-0000 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | Bar Solder | Pb95Sn3Ag2 (95/3/2) | Bar, 1.66 lbs (750g) | Leaded | ||||||||||||||||||
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23-6337-0007 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Solder | Spool | 2006 | 44 | Obsolete | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | 015 | 0.5lb 226.8g | 26 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||
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SMDSWLT.040 100G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.040 1.02mm | ROHS3 Compliant | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 18 AWG, 19 SWG | Spool, 3.5 oz (100g) | Lead Free | 280°F 138°C | No-Clean, Rosin Activated (RA) | ||||||||||||
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SMD2200 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||
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04-7071-0000 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | ULTRAPURE® | Active | 1 (Unlimited) | ROHS3 Compliant | Lead Free | Bar Solder | Sn95.5Ag3.9Cu0.6 (95.5/3.9/0.6) | Bar, 1.66 lbs (750g) | Lead Free | |||||||||||||||
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SMD4300AX500T4C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Cartridge | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | Leaded | 361°F 183°C | Water Soluble | ||||||||||
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25-7068-1404 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 48 | Active | 1 (Unlimited) | 0.050 1.27mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 16 AWG, 18 SWG | Spool, 4 lbs (1.81kg) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Activated (RA) | |||||||||
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CQ-SS-SNBIAG-0.45MM-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||
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90-7068-6442 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 331 | Active | 1 (Unlimited) | 0.010 0.25mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 30 AWG, 33 SWG | Spool, 3.53 oz (100g) | Lead Free | 423°F~424°F 217°C~218°C | Water Soluble | |||||||||||
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SMDAL400C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn96.5Ag3.5 (96.5/3.5) | Cartridge, 14.11 oz (400g) | Lead Free | 430°F 221°C | Water Soluble | |||||||||||
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1372425 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | LF620M | Obsolete | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | Jar, 17.64 oz (500g) | Lead Free | No-Clean | ||||||||||||||||
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SMDIN100 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | In100 (100) | 20 AWG, 21 SWG | Spool | Lead Free | 315°F 157°C | |||||||||||||
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NC191LT15T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 280°F 138°C | No-Clean | ||||||||||||
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NC191AX35 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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NC191AX250 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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SMD2016 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.008 0.20mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | ||||||||||||
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732977 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | Hydro-X | Not For New Designs | Not Applicable | 0.064 1.63mm | RoHS Compliant | 1lb 453.59g | 14 AWG | Wire Solder | 59°F~86°F 15°C~30°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F 217°C | Water Soluble | |||||||
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SSLFNC-T5-35G | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||||
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91-7068-9816 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2016 | 296 | Obsolete | 1 (Unlimited) | 0.015 0.38mm | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||||
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RASW.020 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||||||
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WBNCC633720-4OZ | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Active | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 4 oz (113.40g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||||
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BARSN60PB40 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | Non-RoHS Compliant | Bar Solder | Sn60Pb40 (60/40) | Bar, 1 lb (454g) | Leaded | 361°F~370°F 183°C~188°C | |||||||||||||||
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24-9574-7615 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Wire | Spool | 2007 | 275 | Active | Not Applicable | 0.062 1.57mm | ROHS3 Compliant | Lead Free | 062 | 453.59237g | Wire Solder | 50°F~104°F 10°C~40°C | Sn99.3Cu0.7 (99.3/0.7) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean | |||||
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70-0202-0610 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | EP256HA | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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92-7068-7644 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 275 | Active | 1 (Unlimited) | 0.025 0.64mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 22 AWG, 23 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||
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421562 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | 2000 | C502 | Not For New Designs | Not Applicable | 0.040 1.02mm | Non-RoHS Compliant | Wire Solder | 59°F~86°F 15°C~30°C | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | No-Clean | |||||||||||||
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91-6337-9727 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2017 | 285 | Obsolete | 1 (Unlimited) | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | |||||||||||
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386857 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | C400 | Obsolete | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 1.1lbs 499g | 20 AWG | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean |
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CQ-SS-SNBIAG-0.45MM-25000 Chip Quik Inc.
Solder Solder Spheres Sn42/Bi57.6/Ag0.4 0.45mm diameter 25K Bottle
Price: 0.0000
RFQ -
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BARSN60PB40 Chip Quik Inc.
BARSN60PB40 datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 0.0000
RFQ -
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