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Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | Height | Width | Weight | Wire/Cable Gauge | Power Rating | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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NC2SWLF.015 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||||||
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24-7068-9716 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2012 | 285 | Active | 1 (Unlimited) | 0.040 1.02mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Mildly Activated (RMA) | ||||||||||||
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04-6337-0030 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Solder | 2007 | Active | Not Applicable | 304.8mm | Non-RoHS Compliant | Contains Lead | 19.05mm | 25.4mm | 757.499258g | Bar Solder | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Bar, 1.66 lbs (750g) | Leaded | 361°F 183°C | |||||||||||
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92-7068-9831 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2016 | 296 | Obsolete | 1 (Unlimited) | 0.031 0.79mm | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||||||||
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1434537 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | LF318M | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | Lead Free | 350°F 177°C | No-Clean | ||||||||||||||||
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NC191AX50 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||||
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SMD2050-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2017 | SMD2 | Active | Not Applicable | 0.024 0.61mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Lead Free | 423°F~428°F 217°C~220°C | ||||||||||||||
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1434501 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | LF318M | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | Lead Free | 350°F 177°C | No-Clean | ||||||||||||||||
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WBNCSAC20-2OZ | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Active | 1 (Unlimited) | 0.020 0.51mm | RoHS Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 2 oz (56.70g) | Lead Free | 430°F 221°C | No-Clean | |||||||||||||||||
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NC2SWLF.015 0.2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||||||
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2041006 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Cartridge | LOCTITE® GC 3W | Active | Not Applicable | RoHS Compliant | Solder Paste | 32°F~77°F 0°C~25°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | Lead Free | 423°F 217°C | Water Soluble | |||||||||||||
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2164169 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | LM100 | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | Bi58Sn42 (58/42) | Jar | Lead Free | 281°F 138°C | No-Clean | ||||||||||||||||
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544784 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2000 | WS200™ | Obsolete | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Leaded | 361°F 183°C | Water Soluble | ||||||||||||||
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TS391LT50 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | Lead Free | 281°F 138°C | No-Clean | ||||||||||||||
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SMDSWLF.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | 0.062lb 28.12g | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 1 oz (28.35g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||||||
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24-9574-1407 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 48 | Active | 1 (Unlimited) | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn99.3Cu0.7 (99.3/0.7) | 27 AWG, 28 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | Rosin Activated (RA) | |||||||||||||
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92-9574-7618 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn99.3Cu0.7 (99.3/0.7) | 20 AWG, 22 SWG | Spool, 17.64 oz (500g) | Lead Free | 441°F 227°C | No-Clean | |||||||||||||
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35232 | Master Appliance Corp. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Solder | Tube | Active | Not Applicable | Non-RoHS Compliant | 300W | Wire Solder | Tube | Lead Free | |||||||||||||||||||
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BARSN63PB37-8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | Non-RoHS Compliant | Bar Solder | Sn63Pb37 (63/37) | Bar, 0.5 lb (227g) | Leaded | 361°F 183°C | ||||||||||||||||||
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4860P-500G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2016 | 4860 | Obsolete | Not Applicable | Solder Paste | 35°F~50°F 2°C~10°C | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||||
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4860P-250G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | 2014 | 4860 | Obsolete | Not Applicable | Non-RoHS Compliant | Solder Paste | 35°F~50°F 2°C~10°C | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||
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397127 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | 370 | Obsolete | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | 1.2lbs 544.3g | 22 AWG | Wire Solder | Sn62Pb38 (62/38) | 22 AWG, 23 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||||
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386827 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Spool | 2000 | 370 | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 1.1lbs 499g | 20 AWG | Wire Solder | Sn60Pb40 (60/40) | 20 AWG, 21 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | |||||||||||
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450314 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | C400 | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | 1.1lbs 499g | 23 AWG | Wire Solder | Sn63Pb37 (63/37) | 23 AWG, 24 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||||||||
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1817240 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Bar | 2000 | Active | Not Applicable | Non-RoHS Compliant | Lead Free | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F 217°C | ||||||||||||||
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893357 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | Hydro-X | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Lead Free | 423°F 217°C | Water Soluble | ||||||||||||||
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1769647 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2000 | HF212 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 21.16 oz (600g) | Lead Free | 423°F 217°C | No-Clean | ||||||||||||||
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437756 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 366 | Obsolete | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | Sn50Pb48.5Cu1.5 (50/48.5/1.5) | 20 AWG, 21 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F~420°F 183°C~216°C | Rosin Activated (RA) | ||||||||||||||||
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568759 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 366 | Obsolete | Not Applicable | 0.048 1.22mm | Non-RoHS Compliant | Wire Solder | Sn50Pb48.5Cu1.5 (50/48.5/1.5) | 16 AWG, 18 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F~420°F 183°C~216°C | Rosin Activated (RA) | ||||||||||||||||
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MM01039 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Spool | 2000 | 370 | Obsolete | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 1.1lbs 499g | Wire Solder | Sn62Pb38 (62/38) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) |
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NC2SWLF.015 1OZ Chip Quik Inc.
Solder LF Solder Wire 99.3/0.7 Tin/Copper No-Clean .015 1oz
Price: 0.0000
RFQ -
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NC2SWLF.015 0.2OZ Chip Quik Inc.
Solder LF Solder Wire Mini Pocket Pack 99.3/0.7 Tin/Copper No-Clean .015 .2oz
Price: 0.0000
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BARSN63PB37-8OZ Chip Quik Inc.
BARSN63PB37-8OZ datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 0.0000
RFQ -
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