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Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Lead Free | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SSLTNC-250G | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn42Bi57Ag1 (42/57/1) | Jar, 8.8 oz (250g) | Lead Free | 279°F 137°C | No-Clean | ||||||||||||
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TS991AX500T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||
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92-7068-8820 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||
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70-3205-1810 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | NXG1 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 8 Months | Date of Manufacture | Sn99.3Cu0.7 (99.3/0.7) | Jar, 17.64 oz (500g) | Lead Free | 441°F 227°C | No-Clean | ||||||||||
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24-7068-6407 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 331 | Active | 1 (Unlimited) | 0.040 1.02mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Water Soluble | ||||||||
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14-6337-0062 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2010 | Solid Core Wire | Active | Not Applicable | 0.062 1.57mm | Non-RoHS Compliant | Contains Lead | 1lb 453.59g | 14 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | ||||||
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SMDSW.031 .7OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Tube, 0.7 oz (19.85g) | Leaded | 361°F 183°C | No-Clean, Water Soluble | |||||||||||
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SMDIN100-S-16 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | ROHS3 Compliant | Solder Shot | In100 (100) | Bag, 1 lb (454g) | Lead Free | 315°F 157°C | ||||||||||||||
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24-7080-9702 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn95Sb5 (95/5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 450°F~464°F 232°C~240°C | Rosin Mildly Activated (RMA) | ||||||||
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SMDPB100-S-16 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | Non-RoHS Compliant | Solder Shot | Pb100(100) | Bag, 1 lb (454g) | Leaded | 622°F 328°C | ||||||||||||||
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85-9601-0118 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Active | 1 (Unlimited) | 0.118 3.00mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 9 AWG, 11 SWG | Spool, 22.05 lbs (10kg) | Leaded | 361°F 183°C | |||||||||||||
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24-7080-0634 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | OR421 | Obsolete | 1 (Unlimited) | 0.032 0.81mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn95Sb5 (95/5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 450°F~464°F 232°C~240°C | Water Soluble | ||||||||||||
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SMDSW.020 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | 0.25lb 113.4g | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 4 oz (113.40g) | Leaded | 361°F 183°C | No-Clean, Water Soluble | ||||||||||
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24-6040-9759 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2017 | 285 | Obsolete | 1 (Unlimited) | 0.050 1.27mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Mildly Activated (RMA) | |||||||||
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92-7068-7645 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2015 | 275 | Obsolete | 1 (Unlimited) | 0.045 1.14mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 17 AWG, 18 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||
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SMD4300SNL250T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | |||||||
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SMD291SNL250T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||
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24-7080-0061 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.062 1.57mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn95Sb5 (95/5) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 450°F~464°F 232°C~240°C | Rosin Activated (RA) | ||||||||
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SMD291AX10T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Syringe | 2014 | Active | Not Applicable | Non-RoHS Compliant | 0.077lb 34.93g | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | Leaded | 361°F 183°C | No-Clean | |||||||
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SMDSWLT.040 20G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.040 1.02mm | ROHS3 Compliant | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 18 AWG, 19 SWG | Spool, 0.7 oz (20g) | Lead Free | 280°F 138°C | No-Clean, Rosin Activated (RA) | |||||||||||
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24-7012-0655 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2007 | OR421 | Obsolete | 1 (Unlimited) | 0.062 1.57mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn99.3Cu0.7 (99.3/0.7) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | Water Soluble | |||||||||
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14-7070-0040 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2014 | Solid Core Wire | Active | 1 (Unlimited) | 0.040 1.02mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn95Ag5 (95/5) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F~473°F 221°C~245°C | |||||||||
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SMD2SW.015 100G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | 1 (Unlimited) | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | 27 AWG, 28 SWG | Spool, 3.53 oz (100g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | |||||||||||
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96-9574-9525 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 268 | Active | Not Applicable | 0.025 0.64mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn99.3Cu0.7 (99.3/0.7) | 22 AWG, 23 SWG | Spool, 17.64 oz (500g) | Lead Free | 441°F 227°C | No-Clean | ||||||||||
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92-6337-6420 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 331 | Active | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | Water Soluble | ||||||||||
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24-6337-0657 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2007 | OR421 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Water Soluble | ||||||||
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91-7068-7603 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 8.8 oz (250g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||
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SMD2185 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.018 0.46mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||
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70-0605-0810 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2011 | EM907 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||
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WBNCC633720-2OZ | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Active | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 2 oz (56.70g) | Leaded | 361°F 183°C | No-Clean |
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TS991AX500T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (500g jar)
Price: 0.0000
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