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Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | REACH SVHC | Height | Width | Outside Diameter | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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24-6040-9713 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Mildly Activated (RMA) | |||||||||||||
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24-6337-8811 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | 2015 | 245 | Obsolete | 1 (Unlimited) | 0.030 0.76mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 21 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||
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24-6337-0027 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 44 | Active | Not Applicable | 0.031 0.79mm | 63.5mm | Non-RoHS Compliant | Contains Lead | Unknown | 57.15mm | 63.5mm | 787.4 μm | 1lb 453.59g | 20 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||
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SMD291SNLT6 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||||||
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26-5050-0061 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.062 1.57mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn50Pb50 (50/50) | 14 AWG, 16 SWG | Spool, 5 lbs (2.27kg) | Leaded | 361°F~420°F 183°C~216°C | Rosin Activated (RA) | |||||||||||||
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4944-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2016 | 4944 | Obsolete | Not Applicable | 0.032 0.81mm | Wire Solder | 65°F~80°F 18°C~27°C | 60 Months | Date of Manufacture | Sn99.5Cu0.5 (99.5/0.5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 442°F 228°C | Rosin Activated (RA) | ||||||||||||
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4885-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4880 | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 1lb 453.59g | 20 AWG | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||
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SMD2036-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.018 0.46mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | ||||||||||||||||
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4885WS-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2015 | 4880 | Obsolete | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Water Soluble | ||||||||||||||
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SMD2SW.031 .7OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | 20 AWG, 21 SWG | Tube, 0.7 oz (19.85g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | ||||||||||||||||
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SMD2SWLF.015 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 2 oz (56.70g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | |||||||||||||||||
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SMD291SNL10T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Syringe | 2014 | Active | Not Applicable | ROHS3 Compliant | 0.077lb 34.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||||||
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70-1506-1410 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | R253-5 | Obsolete | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn95Sb5 (95/5) | Jar, 17.64 oz (500g) | Lead Free | 450°F~464°F 232°C~240°C | No-Clean | |||||||||||||||||
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SMDSWLF.015 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||||||||
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NC191SNL250T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | ||||||||||||||||
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SMD291SNL | Chip Quik Inc. | 13.0847 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Syringe | 2005 | Active | Not Applicable | 139.7mm | ROHS3 Compliant | Lead Free | 25.4mm | 76.2mm | 0.033lb 14.97g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||||
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24-6337-9702 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2007 | 285 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Lead Free | 453.59237g | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | |||||||||||
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24-6337-0069 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.125 3.18mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 8 AWG, 10 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||||||
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24-5050-0069 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.125 3.18mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn50Pb50 (50/50) | 8 AWG, 10 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~420°F 183°C~216°C | Rosin Activated (RA) | |||||||||||||
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04-6337-0030 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Solder | 2007 | Active | Not Applicable | 304.8mm | Non-RoHS Compliant | Contains Lead | 19.05mm | 25.4mm | 757.499258g | Bar Solder | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Bar, 1.66 lbs (750g) | Leaded | 361°F 183°C | ||||||||||||
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29-4060-0177 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.250 6.35mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 2 AWG, 3 SWG | Spool | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | ||||||||||||||
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70-2002-0510 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Jar | R560 | Active | Not Applicable | Non-RoHS Compliant | 1.1lbs 499g | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | Water Soluble | |||||||||||||
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24-6337-8843 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2015 | 245 | Obsolete | 1 (Unlimited) | 0.015 0.38mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||
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SMD4300SNL500T5C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Cartridge | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | ||||||||||||||
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18-6337-0081 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Solid Core Wire | Active | 1 (Unlimited) | 0.081 2.06mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 12 AWG, 14 SWG | Spool, 20 lbs (9.07kg) | Leaded | 361°F 183°C | |||||||||||||||
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SMDLTLFP10T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Syringe | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 281°F 138°C | No-Clean | ||||||||||||||
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24-6337-7400 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2005 | 282 | Active | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Contains Lead | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||||||||
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NC2SWLF.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean | |||||||||||||||||
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24-6337-9727 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Wire | 2007 | 285 | Active | 1 (Unlimited) | 0.015 0.38mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||||||
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NC191LT15 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 280°F 138°C | No-Clean |
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24-6337-0027 Kester Solder
KESTER SOLDER24-6337-0027SOLDER WIRE, 63/37 SN/PB, 183°C, 1LB
Price: 0.0000
RFQ -
SMD291SNLT6 Chip Quik Inc.
SMD291SNLT6 datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 0.0000
RFQ -
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SMD291SNL Chip Quik Inc.
SMD291SNL datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 13.0847
RFQ -
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24-6337-9727 Kester Solder
285 Rosin Mildly Activated 63% Tin 37% Lead Solder Wire
Price: 0.0000
RFQ -

























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