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Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Lead Free | REACH SVHC | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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SMD2165 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.012 0.31mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||
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17555LF | Aven Tools | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Spool | 2015 | Active | Not Applicable | 0.039 0.99mm | ROHS3 Compliant | Wire Solder | 60 Months | Date of Manufacture | Sn99.3Cu0.7 (99.3/0.7) | 18 AWG, 19 SWG | Spool, 3.53 oz (100g) | Lead Free | 440°F 227°C | Rosin Activated (RA) | |||||||||
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1844641 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | HF212 | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 | Jar, 17.64 oz (500g) | Lead Free | 408°F~424°F 209°C~218°C | No-Clean | |||||||||||||
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1728117 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | LF318 | Active | Not Applicable | RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.88 oz (25g) | Lead Free | 423°F 217°C | No-Clean | ||||||||||||
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4935-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2016 | 4935 | Obsolete | Not Applicable | 0.032 0.81mm | Wire Solder | 65°F~80°F 18°C~27°C | 60 Months | Date of Manufacture | Sn99.5Cu0.5 (99.5/0.5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 442°F 228°C | No-Clean | ||||||||
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SS-S020 | Easy Braid Co | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||
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397127 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | 370 | Obsolete | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | 1.2lbs 544.3g | 22 AWG | Wire Solder | Sn62Pb38 (62/38) | 22 AWG, 23 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||
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673832 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | C400 | Active | Not Applicable | 0.064 1.63mm | RoHS Compliant | 0.55lb 249.48g | 14 AWG | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F 217°C | No-Clean | ||||||||
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92-6337-8801 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.031 0.79mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | |||||||||||
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24-6337-7631 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2015 | 275 | Obsolete | 1 (Unlimited) | 0.010 0.25mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 30 AWG, 33 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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24-9574-7631 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.010 0.25mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn99.3Cu0.7 (99.3/0.7) | 30 AWG, 33 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean | |||||||||
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19-6337-0062 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | Solid Core Wire | Active | 1 (Unlimited) | 0.062 1.57mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 14 AWG, 16 SWG | Leaded | 361°F 183°C | ||||||||||||
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386840 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Spool | 2000 | 370 | Obsolete | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | 1.1lbs 499g | 23 AWG | Wire Solder | Sn63Pb37 (63/37) | 22 AWG, 23 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||
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544784 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2000 | WS200™ | Obsolete | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Leaded | 361°F 183°C | Water Soluble | |||||||||||
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554889 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bar | 2000 | Obsolete | Not Applicable | Non-RoHS Compliant | 2lbs 907.2g | Bar Solder | 59°F~86°F 15°C~30°C | Sn63Pb37 (63/37) | Bar, 2 lbs (907g) | Leaded | 361°F 183°C | |||||||||||||
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24-6337-8834 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 245 | Active | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Contains Lead | Unknown | 1lb 453.59g | 24 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||
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SMDLTLFP10T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Syringe | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 281°F 138°C | No-Clean | ||||||||||
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732999 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | C511™ | Active | Not Applicable | 0.048 1.22mm | Non-RoHS Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F 217°C | No-Clean | |||||||||||
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BARSN96.5AG3.0CU0.5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | ROHS3 Compliant | Bar Solder | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | Bar, 1 lb (454g) | Lead Free | 422°F~428°F 217°C~220°C | |||||||||||||||
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SMDIN100-R | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | ROHS3 Compliant | Ribbon Solder | In100 (100) | Spool | Lead Free | 315°F 157°C | |||||||||||||||
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SMDLTLFP50T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.113lb 51.26g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | Lead Free | 281°F 138°C | No-Clean | |||||||||
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TS391AX500C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | |||||||||||
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SMD291AX500T3C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Cartridge | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | ||||||||||
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SMD291SNL10T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Syringe | 2014 | Active | Not Applicable | ROHS3 Compliant | 0.077lb 34.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||
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BARSN42BI57AG1 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | ROHS3 Compliant | Bar Solder | Sn42Bi57Ag1 (42/57/1) | Bar, 1 lb (454g) | Lead Free | 280°F 138°C | |||||||||||||||
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SMD291AXT4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 0.53 oz (15g), 5cc | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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SMDIN97AG3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | 24 Months | Date of Manufacture | In97Ag3 (97/3) | 20 AWG, 21 SWG | Spool | Lead Free | 289°F 143°C | |||||||||||
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RASWLF.015 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 2 oz (56.70g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||
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BARSN63PB37-8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | Non-RoHS Compliant | Bar Solder | Sn63Pb37 (63/37) | Bar, 0.5 lb (227g) | Leaded | 361°F 183°C | |||||||||||||||
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RASWLF.015 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 4 oz (113.40g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) |
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BARSN63PB37-8OZ Chip Quik Inc.
BARSN63PB37-8OZ datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 0.0000
RFQ -