Items : %s%s
Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | Package / Case | REACH SVHC | Height | Width | Outside Diameter | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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SMDAL200 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn96.5Ag3.5 (96.5/3.5) | Jar, 7.05 oz (200g) | Lead Free | 430°F 221°C | Water Soluble | ||||||||||||||||
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14-0015-0025 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Obsolete | 1 (Unlimited) | 0.025 0.64mm | Non-RoHS Compliant | Wire Solder | Pb97.5Ag1.5Sn1 (97.5/1.5/1) | 22 AWG, 23 SWG | Spool, 1 lb (454 g) | Leaded | 588°F 309°C | ||||||||||||||||||||
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SMDSWLF.015 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||||||||||
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SMD4300SNL250T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | ||||||||||||||
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SMD4300SNL250T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | |||||||||||||
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70-1607-0504 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Syringe | 2007 | R276 | Active | Not Applicable | Non-RoHS Compliant | 0.22lb 99.79g | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | Leaded | 361°F 183°C | No-Clean | |||||||||||||
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24-7068-1401 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2007 | 48 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Lead Free | 217 | 1lb 453.59g | 24 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Activated (RA) | ||||||||||
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24-7068-9716 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2012 | 285 | Active | 1 (Unlimited) | 0.040 1.02mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Mildly Activated (RMA) | ||||||||||||||
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23-6040-0018 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Solder | Spool | 2006 | 44 | Obsolete | Not Applicable | 0.025 0.64mm | Non-RoHS Compliant | 0.5lb 226.8g | 22 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 22 AWG, 23 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | ||||||||||||
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96-7068-8825 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.025 0.64mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 22 AWG, 23 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||||||
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91-7068-7642 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2015 | 275 | Obsolete | 1 (Unlimited) | 0.015 0.38mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||||||||
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CQ100GE.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean | |||||||||||||||||||
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SMD3SW.020 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 2 oz (56.70g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | ||||||||||||||||||
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4875-227G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4870 | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 0.5lb 226.8g | 20 AWG | Wire Solder | Sn60Pb40 (60/40) | 20 AWG, 21 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F~376°F 183°C~191°C | No-Clean | |||||||||||||
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24-7340-9790 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.063 1.60mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Leaded | 565°F~574°F 296°C~301°C | Rosin Mildly Activated (RMA) | ||||||||||||||
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848874 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | 2000 | C502 | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | 361°F 183°C | No-Clean | ||||||||||||||||||
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NC191SNL250 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||||||||
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92-6337-8825 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.040 1.02mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 18 AWG, 19 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||||||
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24-6337-6403 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 331 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Unknown | 787.4 μm | 1lb 453.59g | 20 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Water Soluble | |||||||||
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28-4060-6413 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 331 | Active | 1 (Unlimited) | 0.093 2.36mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Pb60Sn40 (60/40) | 11 AWG, 13 SWG | Spool, 20 lbs (9.07kg) | Leaded | 361°F~460°F 183°C~238°C | Water Soluble | ||||||||||||||
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397127 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | 370 | Obsolete | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | 1.2lbs 544.3g | 22 AWG | Wire Solder | Sn62Pb38 (62/38) | 22 AWG, 23 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||||||
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386874 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | C400 | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | No-Clean | |||||||||||||||||||
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TS991SNL500T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||||||||
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24-6337-0039 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 44 | Active | Not Applicable | 0.040 1.02mm | 57.15mm | Non-RoHS Compliant | Contains Lead | Unknown | 57.15mm | 57.15mm | 1lb 453.59g | 18 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||
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70-1608-0804 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | R276 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 3.53 oz (100g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||||||||
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NC191SNL15 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||||||||
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NCSWLF.015 0.2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||||||||
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70-0102-0411 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | EP256 | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn62Pb36Ag2 (62/36/2) | Cartridge, 21.16 oz (600g) | Leaded | 354°F 179°C | No-Clean | |||||||||||||||||
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07-6337-0030 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | ULTRAPURE® | Active | 1 (Unlimited) | Non-RoHS Compliant | Contains Lead | Bar Solder | Sn63Pb37 (63/37) | Bar, 10 lbs (4.54kg) | Leaded | 361°F 183°C | ||||||||||||||||||||
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70-0605-0911 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | EM907 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean |
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TS991SNL500T3 Chip Quik Inc.
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T3 (500g jar)
Price: 0.0000
RFQ -
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NCSWLF.015 0.2OZ Chip Quik Inc.
Solder LF Solder Wire Mini Pocket Pack 96.5/3/0.5 Tin/Silver/Copper No-Clean .015 .2oz
Price: 0.0000
RFQ -
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