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Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Lead Free | Package / Case | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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24-7050-0039 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2016 | 44 | Obsolete | 1 (Unlimited) | 0.040 1.02mm | RoHS Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.3Ag3.7 (96.3/3.7) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F~444°F 221°C~223°C | Rosin Activated (RA) | ||||||||||
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386818 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | Hydro-X | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 1lb 453.59g | Wire Solder | 70°F~85°F 20°C~30°C | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Water Soluble | ||||||||
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SMD291SNL250T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||
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TS991AX500T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||
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SMDSWLT.040 20G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.040 1.02mm | ROHS3 Compliant | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 18 AWG, 19 SWG | Spool, 0.7 oz (20g) | Lead Free | 280°F 138°C | No-Clean, Rosin Activated (RA) | ||||||||||||
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CQ100GE 35G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months | Date of Manufacture | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 441°F 227°C | No-Clean | ||||||||||||
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SMDSW.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | 0.062lb 28.12g | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 1 oz (28.35g) | Leaded | 361°F 183°C | No-Clean, Water Soluble | |||||||||||
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24-7068-7606 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 275 | Active | Not Applicable | 0.050 1.27mm | ROHS3 Compliant | Lead Free | 217 | 1lb 453.59g | 16 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||
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91-7068-9820 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2016 | 296 | Obsolete | 1 (Unlimited) | 0.020 0.51mm | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 8.8 oz (250g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||||
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70-0902-0510 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | FL250D | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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BARSN42BI57AG1-8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | ROHS3 Compliant | Bar Solder | Sn42Bi57Ag1 (42/57/1) | Bar, 0.5 lb (227g) | Lead Free | 280°F 138°C | |||||||||||||||
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SS-S020AS | Easy Braid Co | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||
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SS-S031 | Easy Braid Co | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||
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17553LF | Aven Tools | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Spool | 2015 | Active | Not Applicable | 0.047 1.19mm | ROHS3 Compliant | Wire Solder | 60 Months | Date of Manufacture | Sn99.3Cu0.7 (99.3/0.7) | 17 AWG, 18 SWG | Spool, 3.53 oz (100g) | Lead Free | 440°F 227°C | Rosin Activated (RA) | |||||||||
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4912-227G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2006 | 4912 | Obsolete | Not Applicable | 0.020 0.51mm | Wire Solder | 65°F~80°F 18°C~27°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 8 oz (227g), 1/2 lb | Lead Free | 423°F~430°F 217°C~221°C | No-Clean | ||||||||||
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24-7040-7601 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3.5 (96.5/3.5) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F 221°C | No-Clean | |||||||||
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22-7005-0118 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Obsolete | 1 (Unlimited) | 0.118 3.00mm | Non-RoHS Compliant | Wire Solder | Pb70Sn29.5Bi0.5 (70/29.5/0.5) | 9 AWG, 11 SWG | Spool, 10 lbs (4.54kg) | Leaded | ||||||||||||||||
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389261 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Spool | 2000 | 370 | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | 0.551lb 249.93g | 26 AWG | Wire Solder | Sn60Pb40 (60/40) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | ||||||||
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18-7000-0062 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Solid Core Wire | Active | 1 (Unlimited) | 0.062 1.57mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn99 (99) | 14 AWG, 16 SWG | Spool, 20 lbs (9.07kg) | Lead Free | ||||||||||||
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70-1003-0519 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | HydroMark 531 | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 24.69 oz (700g) | Leaded | 361°F 183°C | Water Soluble | ||||||||||||
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SMD2SW.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | Spool, 1 oz (28.35g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | |||||||||||||
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SMD2180 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.016 0.40mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | ||||||||||||
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SMDIN52SN48 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | In52Sn48 (52/48) | 20 AWG, 21 SWG | Spool | Lead Free | 244°F 118°C | |||||||||||||
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SMDLTLFP500T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 17.64 oz (500g) | Lead Free | 281°F 138°C | No-Clean | |||||||||||
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SMD2SWLF.015 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | SMD2 | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 27 AWG, 28 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | |||||||||||
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SMD2215 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.030 0.76mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||
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RASW.015 100G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 3.53 oz (100g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||||||
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SMD4300SNL500T3C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Cartridge | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | ||||||||||
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SMD291AX500T4C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Cartridge | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | ||||||||||
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SMD2040 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C |
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TS991AX500T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (500g jar)
Price: 0.0000
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91-7068-9820 Kester Solder
91-7068-9820 datasheet pdf and Solder product details from Kester Solder stock available at Utmel
Price: 0.0000
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24-7040-7601 Kester Solder
275 No Clean Core 96.5% Tin 3.5% Silver Lead Free Solder Wire
Price: 0.0000
RFQ -
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