Items : %s%s
Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | Package / Case | REACH SVHC | Height | Width | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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893358 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Hydro-X | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 23 AWG, 24 SWG | Spool, 8.8 oz (250g) | Lead Free | 423°F 217°C | Water Soluble | ||||||||||||||||
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SMDLTLFP15T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Jar | 2015 | Active | Not Applicable | 63.5mm | ROHS3 Compliant | No SVHC | 57.15mm | 63.5mm | 15g | Solder Paste, Two Part Mix | 37°F~77°F 3°C~25°C | 24 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 0.53 oz (15g) | Lead Free | 281°F 138°C | No-Clean | |||||||||
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RASW.031 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 21 AWG, 20 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||||||||||
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SMDIN52SN48 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | In52Sn48 (52/48) | 20 AWG, 21 SWG | Spool | Lead Free | 244°F 118°C | |||||||||||||||||
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S200 | Chemtronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Solder | Tube | SMD2 | Active | Not Applicable | 0.040 1.02mm | 95.25mm | ROHS3 Compliant | Lead Free | 19.05mm | 19.05mm | 18.143695g | 18 AWG | Wire Solder | 60 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Tube | Lead Free | 423°F~424°F 217°C~218°C | Rosin Activated (RA) | ||||||
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1051208 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | 2000 | MP218 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Cartridge, 22.93 oz (650g) | Leaded | No-Clean | ||||||||||||||||
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90-7068-1407 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 48 | Active | 1 (Unlimited) | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 3.53 oz (100g) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Activated (RA) | ||||||||||||||
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70-1607-0520 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Syringe | 2007 | R276 | Active | Not Applicable | Non-RoHS Compliant | 0.077lb 34.93g | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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92-7068-6402 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 331 | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | Water Soluble | |||||||||||||||
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SMD2140-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.008 0.20mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | ||||||||||||||||
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24-7068-7608 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Wire | Spool | 2013 | 275 | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Lead Free | 015 | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||
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NC191SNL50 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | ||||||||||||||||
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386927 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Spool | C400 | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 1.1lbs 499g | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||||
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RASWLF.015 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 1 lb (454 g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||||
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RASWLF.020 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 8 oz (227g), 1/2 lb | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||||
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SMD2SWLF.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | |||||||||||||||
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TS391SNL250 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||||||||||
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RASWLF.020 .4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Tube, 0.4 oz (11.34g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||||
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1354291 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | WS300 | Not For New Designs | Not Applicable | RoHS Compliant | Solder Paste | 35.6°F~46.4°F 2°C~8°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F 217°C | Water Soluble | |||||||||||||||||
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SMDSW.031 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | No-Clean, Water Soluble | |||||||||||||||||
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24-6337-7415 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 282 | Active | 1 (Unlimited) | 0.015 0.38mm | Non-RoHS Compliant | Contains Lead | Wire Solder | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | |||||||||||||||
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24-7150-8842 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.025 0.64mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn62Pb36Ag2 (62/36/2) | 22 AWG, 23 SWG | Spool, 1 lb (454 g) | Leaded | 354°F 179°C | No-Clean | |||||||||||||||
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SMD2180 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.016 0.40mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | ||||||||||||||||
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849328 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | C502 | Obsolete | Not Applicable | 0.064 1.63mm | Non-RoHS Compliant | Wire Solder | 14 AWG, 16 SWG | Spool, 5.51 lbs (2.5kg) | 361°F 183°C | No-Clean | |||||||||||||||||||
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RASWLF.031 .7OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 21 AWG, 20 SWG | Tube, 0.7 oz (19.85g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||||
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RASWLF.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 1 oz (28.35g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||||
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389261 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Spool | 2000 | 370 | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | 0.551lb 249.93g | 26 AWG | Wire Solder | Sn60Pb40 (60/40) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | ||||||||||||
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4884-227G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4880 | Active | Not Applicable | 0.025 0.64mm | Non-RoHS Compliant | 0.5lb 226.8g | 22 AWG | Wire Solder | Sn63Pb37 (63/37) | 22 AWG, 23 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||
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SMD2200-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2017 | SMD2 | Active | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Leaded | 361°F 183°C | |||||||||||||||
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SMD2028 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.014 0.36mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C |
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SMDLTLFP15T4 Chip Quik Inc.
CHIP QUIK SMDLTLFP15T4 SOLDER PASTE, SN, BI, AG, 138DEG C, 15G
Price: 0.0000
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