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DS1314E
DS1314E
503-DS1314E
20-TSSOP (0.173, 4.40mm Width)
DS1314E datasheet pdf and Memory - Controllers product details from Maxim Integrated stock available at HK JDW
In Stock : 999
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DS1314E Overview
A package containing materials from Tube is provided. For the sake of saving board space, it has been placed in the 20-TSSOP (0.173, 4.40mm Width). In this case, it is an extremely reliable and high quality type of Nonvolatile RAM. Setting -40°C~85°C as the operating temperature is recommended. It is essential that 3V~3.6V voltage be supplied in order for it to function properly. A technique known as Surface Mount is used to mount the device. Based on the base part number DS1314, more related electronic components can be found. The transmission line ends are terminated with 20 terminations in order to prevent signals from reflecting off the end. 3.3V is the device's supply voltage. The pin configuration is 20. As a result, the reflow temperature limit of 240 is determined by the component with the lowest tolerance for high temperatures. This item falls under the Power Management Circuits subcategory. It is possible to transmit data using 1 channels. The power supplies of 3.3V enable high efficiency to be achieved. POWER SUPPLY SUPPORT CIRCUIT is the type of analog integrated circuit used in this device. A minimum supply voltage of 3V should be maintained. An internal circuit is capable of withstanding a maximum voltage of 3.6V without deteriorating its characteristics. The maximum current that can be supplied without causing characteristics degradation or damage to the internal circuit is as low as 140mA.
DS1314E Features
Available in the 20-TSSOP (0.173, 4.40mm Width) package
Nonvolatile RAM as controller type
Operating temperature of -40°C~85°C
DS1314E Applications
There are a lot of Maxim Integrated DS1314E Memory Controllers applications.
- High reliability & industrial Solid State Drives (SSD)
- Embedded modules including U.2, M.2, MO-297 and MO-300
- Servers
- IDE Disk-on-Modules (DoM)
- Multi-Chip-Package (MCP)
- eUSB, embedded USB module
- MultiMediaCardsTM (MMC)
- System-in-Package (SiP) embedded flash drives (eSSD)
- High reliability & industrial Compact FlashTM Cards (CFC)
- Discrete on-board flash drive or disk-on-board (DoB) integration
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DS1314E
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