Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Supplier Device Package | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | Refresh Cycles | Access Mode | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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W9751G8KB-25 TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2012 | Last Time Buy | 3 (168 Hours) | ROHS3 Compliant | 60-TFBGA | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | 400ps | 512Mb 64M x 8 | Volatile | 1.7V~1.9V | 400MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W29N02GVSIAF | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Tray | 2016 | Active | 3 (168 Hours) | 48 | 18.4mm | ROHS3 Compliant | 48-TFSOP (0.488, 12.40mm Width) | 12mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 1.2mm | 1 | DUAL | 3V | YES | 0.5mm | R-PDSO-G48 | 2.7V | 3.6V | 2Gb 256M x 8 | Non-Volatile | 2.7V~3.6V | 256MX8 | 8 | 2147483648 bit | 3.3V | FLASH | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W97BH6KBVX2I | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Tray | 2016 | yes | Obsolete | 3 (168 Hours) | 134 | EAR99 | 1 | 11.5mm | ROHS3 Compliant | 134 | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | 134-VFBGA | 10mm | Surface Mount | -40°C~85°C TA | SDRAM - Mobile LPDDR2 | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.2V | YES | 0.65mm | 1.14V | 1.3V | 2Gb 128M x 16 | Volatile | 1.14V~1.95V | 128MX16 | 16 | 2147483648 bit | 400MHz | MULTI BANK PAGE BURST | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W9816G6JH-6I TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 50-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | SDRAM | 50-TSOP II | 5ns | 16Mb 1M x 16 | Volatile | 3V~3.6V | 166MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W987D2HBJX6E TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2011 | Not For New Designs | 3 (168 Hours) | ROHS3 Compliant | 90-TFBGA | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPSDR | 5.4ns | 128Mb 4M x 32 | Volatile | 1.7V~1.95V | 166MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q80DVSNIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2010 | SpiFlash® | Active | 3 (168 Hours) | 8 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 1.75mm | 3.9mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1 | e3 | Tin (Sn) | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 85°C | 8Mb 1M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 8MX1 | 1 | 8388608 bit | SERIAL | 104MHz | 0.000005A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | SPI | FLASH | SPI | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W947D2HBJX5E | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 2011 | Active | 3 (168 Hours) | 90 | EAR99 | 1.8V | 1 | 13mm | ROHS3 Compliant | 90 | AUTO/SELF REFRESH | 90-TFBGA | 128 Mb | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPDDR | SYNCHRONOUS | 1.025mm | 8542.32.00.02 | 1 | 55mA | BOTTOM | 1.8V | 90 | 0.8mm | 1.7V | Not Qualified | 1.95V | 3-STATE | 5ns | 128Mb 4M x 32 | Volatile | 14b | 1.7V~1.95V | 4MX32 | 32 | 200MHz | 0.00001A | COMMON | 4096 | DRAM | Parallel | 15ns | 24816 | 24816 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7008L15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2010 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 512 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | YES | 0.5mm | SRAMs | 5V | 3-STATE | 15 ns | 64kB | RAM, SDR, SRAM | 32b | 64KX8 | 0.005A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V3556SA150BGG | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 119-BGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V3556 | 119-PBGA (14x22) | 3.8ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 150MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1625KV18-300BZXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2003 | Obsolete | 3 (168 Hours) | 165 | 1.8V | 2 | 17mm | ROHS3 Compliant | Lead Free | No | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 144 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 1.4mm | 1 | 880mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 40 | CY7C1625 | 165 | 1mm | 1.7V | 1.9V | 450 ps | 144Mb 16M x 9 | Volatile | 23b | 1.7V~1.9V | 16MX9 | 9 | Synchronous | 300MHz | 9b | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q16JWUXIQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | SpiFlash® | Active | 8-UFDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16Mb 2M x 8 | Non-Volatile | 1.65V~1.95V | 133MHz | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25X80AVDAIZ | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 9.27mm | ROHS3 Compliant | 8-DIP (0.300, 7.62mm) | SPI, Serial | unknown | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | SYNCHRONOUS | 5.33mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 8 | NO | 2.54mm | R-PDIP-T8 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 8Mb 1M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 1MX8 | 8 | 8388608 bit | 100MHz | 0.00001A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W29GL128CH9B | Winbond Electronics | 2.0170 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tray | 2016 | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | 13mm | ROHS3 Compliant | 64 | IT ALSO OPERATES AT 3 V TO 3.6 V | 64-LBGA | 11mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.4mm | 8542.32.00.51 | 1 | BOTTOM | 3V | 64 | YES | 1mm | 2.7V | Not Qualified | 1.8/3.33/3.3V | 3.6V | 128Mb 16M x 8 8M x 16 | Non-Volatile | 0.055mA | 2.7V~3.6V | 128MX1 | 1 | 134217728 bit | 0.000005A | 100 ns | 8 | 3V | YES | YES | YES | 128 | 8/16words | YES | YES | FLASH | Parallel | 90ns | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||||
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W949D2DBJX5E | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | Active | 3 (168 Hours) | 90 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 90-TFBGA | 8mm | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPDDR | SYNCHRONOUS | 1.025mm | 1 | BOTTOM | 1.8V | YES | 0.8mm | R-PBGA-B90 | 1.7V | 1.95V | 5ns | 512Mb 16M x 32 | Volatile | 1.7V~1.95V | 16MX32 | 32 | 536870912 bit | 200MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q64FVTBJQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~105°C TA | FLASH - NOR | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q256FVBJQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~105°C TA | FLASH - NOR | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25P10VSNIG T&R | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2006 | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH | 8-SOIC | 1Mb 128K x 8 | Non-Volatile | 2.7V~3.6V | 40MHz | FLASH | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| W25Q80DVSVIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2016 | SpiFlash® | Active | 3 (168 Hours) | 8 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 3.9mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.9mm | 1 | DUAL | 3V | YES | 1.27mm | R-PDSO-G8 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 8Mb 1M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 8MX1 | 1 | 8388608 bit | 104MHz | 0.000005A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | SPI | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W9864G6KH-6 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | Active | 3 (168 Hours) | 54 | 1 | 22.22mm | ROHS3 Compliant | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 1 | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 0.8mm | R-PDSO-G54 | 3V | 3.6V | 5ns | 64Mb 4M x 16 | Volatile | 3V~3.6V | 4MX16 | 16 | 67108864 bit | 166MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q128JVEIM TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | SpiFlash® | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | FLASH | SPI - Quad I/O, QPI, DTR | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q512JVBIQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | SpiFlash® | Active | 3 (168 Hours) | 24-TBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 512Mb 64M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W632GU8MB15I | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 78 | EAR99 | 1 | 10.5mm | ROHS3 Compliant | AUTO/SELF REFRESH | 78-VFBGA | 8mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.35V | YES | 0.8mm | R-PBGA-B78 | 1.283V | 1.45V | 20ns | 2Gb 128M x 16 | Volatile | 1.283V~1.45V | 256MX8 | 8 | 2147483648 bit | 667MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24AA02SC-I/W16K | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 1 (Unlimited) | ROHS3 Compliant | Die | Surface Mount | -40°C~85°C TA | EEPROM | 24AA02 | Die | 900ns | 2Kb 256 x 8 | Non-Volatile | 1.7V~5.5V | 400kHz | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W988D2FBJX6E | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | Active | 3 (168 Hours) | 90 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 90-TFBGA | 8mm | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPSDR | SYNCHRONOUS | 1.025mm | 8542.32.00.24 | 1 | BOTTOM | 1.8V | 90 | YES | 0.8mm | R-PBGA-B90 | 1.7V | Not Qualified | 1.8V | 1.95V | 5.4ns | 256Mb 8M x 32 | Volatile | 0.075mA | 1.7V~1.95V | 8MX32 | 32 | 268435456 bit | 166MHz | 0.00001A | 16 | COMMON | 4096 | DRAM | Parallel | 15ns | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W631GG6KB-15 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Surface Mount | Tray | 2016 | Obsolete | 3 (168 Hours) | 96 | EAR99 | 1.5V | 1 | 13mm | ROHS3 Compliant | No | 96 | AUTO/SELF REFRESH | 96-TFBGA | 1 Gb | Surface Mount | 0°C~85°C TC | SDRAM - DDR3 | 1.2mm | 8542.32.00.32 | 1 | 240mA | BOTTOM | 1.5V | 96 | 0.8mm | 1.425V | 1.575V | 3-STATE | 20ns | 1Gb 64M x 16 | Volatile | 16b | 1.425V~1.575V | 64MX16 | 16 | 16b | 667MHz | 0.014A | COMMON | 8192 | DRAM | Parallel | 8 | 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q128BVBJG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~105°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | 3V | FLASH | SPI - Quad I/O | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W9725G6KB-18 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 2016 | Active | 3 (168 Hours) | 84 | EAR99 | 1.8V | 1 | 12.5mm | ROHS3 Compliant | 84 | AUTO/SELF REFRESH | 84-TFBGA | 256 Mb | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.24 | 1 | 130mA | 1.066GHz | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | 84 | 0.8mm | 1.7V | Not Qualified | 1.9V | 3-STATE | 350ps | 256Mb 16M x 16 | Volatile | 15b | 1.7V~1.9V | 16MX16 | 16 | 533MHz | 0.006A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q32FWSFIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tube | 2016 | SpiFlash® | Obsolete | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | SPI, Serial | 104MHz | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16-SOIC | 32Mb 4M x 8 | Non-Volatile | 1.65V~1.95V | 104MHz | FLASH | SPI - Quad I/O, QPI | 60μs, 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W631GU6KS-12 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 96 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 7.5mm | CMOS | SYNCHRONOUS | 1mm | 1 | BOTTOM | BALL | NOT SPECIFIED | 1.35V | NOT SPECIFIED | OTHER | YES | 0.8mm | R-PBGA-B96 | 1.283V | 85°C | 1.45V | 64MX16 | 16 | 1073741824 bit | DDR DRAM | MULTI BANK PAGE BURST | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W29GL256SH9B | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tube | 2016 | Obsolete | 3 (168 Hours) | 64 | 13mm | ROHS3 Compliant | 64 | 64-LBGA | 11mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.4mm | 1 | BOTTOM | 3V | YES | 1mm | 2.7V | Not Qualified | 3/3.3V | 3.6V | 256Mb 16M x 16 | Non-Volatile | 0.1mA | 2.7V~3.6V | 16MX16 | 16 | 268435456 bit | 0.0001A | 90 ns | 3V | YES | YES | YES | 256 | 16words | YES | YES | FLASH | Parallel | 90ns | 64K |
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W25Q80DVSNIG Winbond Electronics
3/3.3V V SpiFlash® Memory IC SpiFlash® Series 4.9mm mm
Price: 0.0000
RFQ -
W947D2HBJX5E Winbond Electronics
Surface Mount 90 Pin Memory IC 128 Mb kb 13mm mm 55mA mA
Price: 0.0000
RFQ -
7008L15PF8 Integrated Device Technology (IDT)
5V V 100 Pin Memory IC 512 kb kb 14mm mm
Price: 0.0000
RFQ -
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CY7C1625KV18-300BZXC Cypress Semiconductor Corp
Surface Mount 165 Pin Memory IC CY7C1625 144 Mb kb 17mm mm 880mA mA 9b b
Price: 0.0000
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W25X80AVDAIZ Winbond Electronics
3/3.3V V SpiFlash® 8 Pin Memory IC SpiFlash® Series 9.27mm mm
Price: 0.0000
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W25Q80DVSVIG Winbond Electronics
3/3.3V V SpiFlash® Memory IC SpiFlash® Series 4.9mm mm
Price: 0.0000
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W631GG6KB-15 Winbond Electronics
Surface Mount 96 Pin Memory IC 1 Gb kb 13mm mm 240mA mA
Price: 0.0000
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W9725G6KB-18 Winbond Electronics
Surface Mount 84 Pin Memory IC 256 Mb kb 12.5mm mm 130mA mA
Price: 0.0000
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