Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Reach Compliance Code | Density | Frequency | Height | Width | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Supplier Device Package | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Access Mode | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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W25Q256JVBIM | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | SpiFlash® | yes | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | 24-TBGA | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1mm | R-PBGA-B24 | 2.7V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 32MX8 | 8 | 268435456 bit | SERIAL | 133MHz | 3V | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W29N02GVSIAA | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 2011 | Active | 3 (168 Hours) | 48 | 3A991.B.1.A | 3V | 18.4mm | ROHS3 Compliant | 48 | 48-TFSOP (0.724, 18.40mm Width) | 2 Gb | 1.2mm | 12mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 8542.32.00.51 | 1 | e3 | Tin (Sn) | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 0.5mm | 2.7V | 3.6V | 85°C | 2Gb 256M x 8 | Non-Volatile | 2.7V~3.6V | 2GX1 | 1 | 256B | FLASH | Parallel | 25ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "W25Q128FVSJQ TR") |
W25Q128FVSJQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~105°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q257FVFIF | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tube | 2016 | SpiFlash® | Obsolete | 3 (168 Hours) | 16 | 10.31mm | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | SPI, Serial | 7.49mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.64mm | 1 | DUAL | 3V | YES | 1.27mm | R-PDSO-G16 | 2.7V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 256MX1 | 1 | 268435456 bit | 104MHz | 3V | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25P16VSSIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2006 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 5.27mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 16 Mb | Surface Mount | -40°C~85°C TA | CMOS | 2.16mm | 1 | e3 | MATTE TIN | DUAL | 260 | 3V | 40 | 8 | YES | 1.27mm | 2.7V | 3/3.3V | 3.6V | 50 μs | 16Mb 2M x 8 | Non-Volatile | 1b | 0.032mA | 2.7V~3.6V | 16MX1 | 1 | 50MHz | 0.000005A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 7ms | ||||||||||||||||||||||||||||||||||||||||||||
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BR24G512FVT-3AGE2 | ROHM Semiconductor | 0.7880 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Surface Mount | Tape & Reel (TR) | 2014 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | Tin | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 512 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.2mm | 1 | DUAL | NOT SPECIFIED | NOT SPECIFIED | BR24G512 | 0.65mm | 1.7V | Not Qualified | 5.5V | 450 ns | 512Kb 64K x 8 | Non-Volatile | 0.0045mA | 1.7V~5.5V | 8 | 1MHz | 0.000003A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q64FVSF00 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | FLASH - NOR | 16-SOIC | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q128FWFIG TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | 2016 | SpiFlash® | Active | 3 (168 Hours) | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 1.65V~1.95V | 104MHz | FLASH | SPI - Quad I/O, QPI | 60μs, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W979H6KBVX2E TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 134-VFBGA | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPDDR2 | 512Mb 32M x 16 | Volatile | 1.14V~1.95V | 400MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q32DWSFIG TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2014 | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16-SOIC | 32Mb 4M x 8 | Non-Volatile | 1.7V~1.95V | 104MHz | FLASH | SPI | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q257FVFIF TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tape & Reel (TR) | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16-SOIC | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W29N01HVBINA | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | yes | Active | 3 (168 Hours) | 63 | 11mm | ROHS3 Compliant | 63 | 63-VFBGA | 9mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 1mm | 1 | BOTTOM | 3V | YES | 0.8mm | 2.7V | 3.6V | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | 128MX8 | 8 | 1073741824 bit | 3.3V | FLASH | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W97AH6KBVX2E | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | Active | 3 (168 Hours) | 134 | 1 | 11.5mm | ROHS3 Compliant | 134 | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | 134-VFBGA | 10mm | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPDDR2 | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.2V | YES | 0.65mm | 1.14V | 1.3V | 1Gb 64M x 16 | Volatile | 1.14V~1.95V | 64MX16 | 16 | 1073741824 bit | 400MHz | MULTI BANK PAGE BURST | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q256JVBIM TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | SpiFlash® | Active | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | FLASH | SPI - Quad I/O | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W988D6FBGX7E TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 54-TFBGA | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPSDR | 54-VFBGA (8x9) | 5.4ns | 256Mb 16M x 16 | Volatile | 1.7V~1.95V | 133MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70T3599S166DR | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 208-BFQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | IDT70T3599 | 208-PQFP (28x28) | 3.6ns | 4.5Mb 128K x 36 | Volatile | 2.4V~2.6V | 166MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q64FVSSIP | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | 5.28mm | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | 5.28mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.16mm | 1 | DUAL | 3.3V | YES | 1.27mm | S-PDSO-G8 | 3V | Not Qualified | 3/3.3V | 3.6V | 64Mb 8M x 8 | Non-Volatile | 0.04mA | 2.7V~3.6V | 64MX1 | 1 | 67108864 bit | SERIAL | 104MHz | 0.000025A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | SPI | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25X64VSFIG | Winbond Electronics | 0.5880 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 2007 | SpiFlash® | Obsolete | 3 (168 Hours) | 16 | 3A991.B.1.A | 3.3V | 10.285mm | ROHS3 Compliant | No | 16 | 16-SOIC (0.295, 7.50mm Width) | SPI, Serial | 64 Mb | Surface Mount | -40°C~85°C TA | CMOS | 2.64mm | 8542.32.00.51 | 1 | 18mA | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 40 | 16 | 1.27mm | 2.7V | 3.6V | 7 ns | 64Mb 8M x 8 | Non-Volatile | 23b | 2.7V~3.6V | 8MX8 | 8 | Synchronous | 75MHz | 0.00001A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 3ms | ||||||||||||||||||||||||||||||||||||||||||
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W25Q64FVZEIG TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W948D6FBHX6G | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 60 | EAR99 | 1 | 9mm | ROHS3 Compliant | AUTO/SELF REFRESH | 60-TFBGA | 8mm | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPDDR | SYNCHRONOUS | 1.025mm | 8542.32.00.02 | 1 | BOTTOM | 1.8V | 60 | YES | 0.8mm | R-PBGA-B60 | 1.7V | Not Qualified | 1.8V | 1.95V | 3-STATE | 5ns | 256Mb 16M x 16 | Volatile | 0.07mA | 1.7V~1.95V | 8MX16 | 16 | 134217728 bit | 166MHz | 0.00001A | COMMON | 8192 | DRAM | Parallel | 15ns | 24816 | 24816 | ||||||||||||||||||||||||||||||||||||||||||||||||
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W98AD2KBJX6E | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2016 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W987D2HBJX7E TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2011 | Not For New Designs | 3 (168 Hours) | ROHS3 Compliant | 90-TFBGA | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPSDR | 5.4ns | 128Mb 4M x 32 | Volatile | 1.7V~1.95V | 133MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W632GU8KB-15 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2016 | Discontinued | 3 (168 Hours) | 78 | EAR99 | 1 | 10.5mm | ROHS3 Compliant | AUTO/SELF REFRESH | 78-TFBGA | 8mm | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1.2mm | 8542.32.00.36 | 1 | BOTTOM | NOT SPECIFIED | 1.35V | NOT SPECIFIED | 78 | YES | 0.8mm | R-PBGA-B78 | 1.283V | Not Qualified | 1.35V | 1.45V | 3-STATE | 20ns | 2Gb 256M x 8 | Volatile | 0.33mA | 1.283V~1.45V | 256MX8 | 8 | 2147483648 bit | 667MHz | 0.019A | COMMON | 8192 | DRAM | Parallel | 8 | 8 | ||||||||||||||||||||||||||||||||||||||||||||||
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W25X10VSNIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 2006 | SpiFlash® | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 1 Mb | Surface Mount | -40°C~85°C TA | CMOS | 1.72mm | 1 | 20mA | e3 | MATTE TIN | DUAL | 260 | 3V | 40 | 8 | 1.27mm | 2.7V | 3/3.3V | 3.6V | 7 ns | 1Mb 128K x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 75MHz | 0.00001A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||
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W25Q128BVEIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 2016 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.A | 3.3V | ROHS3 Compliant | No | 8 | 8-WDFN Exposed Pad | SPI, Serial | 128 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1 | 18mA | DUAL | 3V | 8 | 1.27mm | 2.7V | 3.6V | 8.5 ns | 128Mb 16M x 8 | Non-Volatile | 24b | 2.7V~3.6V | 1 | Synchronous | 104MHz | 0.000015A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI - Quad I/O | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
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W25B40VSNIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2006 | SpiFlash® | yes | Obsolete | 3 (168 Hours) | 8 | ROHS3 Compliant | Lead Free | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | Surface Mount | -40°C~85°C TA | CMOS | e3 | MATTE TIN | DUAL | 225 | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | Not Qualified | 3/3.3V | 40 μs | 4Mb 512K x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 512KX8 | 8 | 4194304 bit | 40MHz | 0.000005A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | SPI | FLASH | SPI | 15ms, 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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W27C512-45Z | Winbond Electronics | 2.8200 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2005 | Obsolete | 3 (168 Hours) | 28 | 3A991.B.1.B.2 | 5V | 37.08mm | ROHS3 Compliant | Lead Free | No | 28 | 28-DIP (0.600, 15.24mm) | 512 kb | 45GHz | 15.24mm | Through Hole | 0°C~70°C TA | CMOS | 5.33mm | 8542.32.00.51 | 1 | DUAL | 5V | 28 | NO | 2.54mm | 45ns | 512Kb 64K x 8 | Non-Volatile | 4.75V~5.25V | 64KX8 | 8 | 12V | EEPROM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W29GL064CB7A | Winbond Electronics | 1.8228 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | 8mm | ROHS3 Compliant | BOTTOM BOOT BLOCK | 48-TFBGA | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | BOTTOM | 3V | 48 | YES | 0.8mm | R-PBGA-B48 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 64Mb 8M x 8 4M x 16 | Non-Volatile | 0.055mA | 2.7V~3.6V | 64MX1 | 1 | 67108864 bit | 0.000005A | 70 ns | 8 | 3V | YES | YES | YES | 8127 | 8/16words | YES | YES | FLASH | Parallel | 70ns | 8K64K | BOTTOM | ||||||||||||||||||||||||||||||||||||||||||||
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AS4C64M8D2-25BANTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2014 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 60-TFBGA | unknown | Surface Mount | -40°C~105°C TC | SDRAM - DDR2 | NOT SPECIFIED | NOT SPECIFIED | 400ps | 512Mb 64M x 8 | Volatile | 1.7V~1.9V | 400MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W29N04GVSIAA | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | yes | Active | 3 (168 Hours) | 48 | 18.4mm | ROHS3 Compliant | 48-TFSOP (0.488, 12.40mm Width) | 12mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 1.2mm | 1 | DUAL | 3.3V | YES | 0.5mm | R-PDSO-G48 | 2.7V | 3.6V | 4Gb 512M x 8 | Non-Volatile | 2.7V~3.6V | 512MX8 | 8 | 4294967296 bit | 3.3V | FLASH | Parallel | 25ns |
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W25P16VSSIG Winbond Electronics
3/3.3V V SpiFlash® 8 Pin Memory IC SpiFlash® Series 16 Mb kb 5.27mm mm
Price: 0.0000
RFQ -
BR24G512FVT-3AGE2 ROHM Semiconductor
Surface Mount Memory IC BR24G512 512 kb kb 4.4mm mm
Price: 0.7880
RFQ -
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W25Q64FVSSIP Winbond Electronics
3/3.3V V SpiFlash® Memory IC SpiFlash® Series 5.28mm mm
Price: 0.0000
RFQ -
W25X64VSFIG Winbond Electronics
Surface Mount SpiFlash® 16 Pin Memory IC SpiFlash® Series 64 Mb kb 10.285mm mm 18mA mA 8b b
Price: 0.5880
RFQ -
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W25X10VSNIG Winbond Electronics
3/3.3V V Surface Mount SpiFlash® 8 Pin Memory IC SpiFlash® Series 1 Mb kb 20mA mA 8b b
Price: 0.0000
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W25Q128BVEIG Winbond Electronics
Surface Mount SpiFlash® 8 Pin Memory IC SpiFlash® Series 128 Mb kb 18mA mA 8b b
Price: 0.0000
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