Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Max Power Dissipation | Supplier Device Package | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | I/O Type | Programming Voltage | Page Size | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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S99ML04G10044 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 14 Weeks | Tray | Discontinued | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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28328261 A | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Last Time Buy | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7142LA55C | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tube | Active | 1 (Unlimited) | Non-RoHS Compliant | 48-DIP (0.600, 15.24mm) | Through Hole | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT7142 | 16Kb 2K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W632GU8MB09I | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 78 | EAR99 | 1 | 10.5mm | ROHS3 Compliant | AUTO/SELF REFRESH | 78-VFBGA | 8mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.35V | YES | 0.8mm | R-PBGA-B78 | 1.283V | 1.45V | 20ns | 2Gb 256M x 8 | Volatile | 1.283V~1.45V | 256MX8 | 8 | 2147483648 bit | 1.067GHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S34ML01G200BHV000 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | ML-2 | Discontinued | 3 (168 Hours) | 63 | 11mm | ROHS3 Compliant | 63 | 63-VFBGA | 1 Gb | Surface Mount | -40°C~105°C TA | FLASH - NAND | ASYNCHRONOUS | 1mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 0.8mm | 2.7V | 3.6V | 1Gb 128M x 8 | Non-Volatile | 28b | 2.7V~3.6V | 128MX8 | 8 | 3V | 2kB | FLASH | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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R1LV1616RBG-5SI#S0 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tape & Reel (TR) | 2007 | yes | Obsolete | 1 (Unlimited) | 48 | ROHS3 Compliant | Lead Free | 48 | 48-TFBGA | Surface Mount | -40°C~85°C TA | CMOS | ASYNCHRONOUS | BOTTOM | R1LV1616R | 48 | YES | 0.75mm | Not Qualified | 3/3.3V | 3-STATE | 16Mb 1M x 16 | Volatile | 0.04mA | 2.7V~3.6V | 1MX16 | 16 | 16777216 bit | 0.000006A | 55 ns | COMMON | 2.7V | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V416S15YGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2013 | yes | Active | 3 (168 Hours) | 44 | 85°C | -40°C | 3.3V | 1 | 28.6mm | RoHS Compliant | Lead Free | No | 44 | Parallel | 3.6V | 3V | 4 Mb | 10.2mm | 2.9mm | CMOS | 3.683mm | 1 | 170mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 44 | INDUSTRIAL | SRAMs | 3-STATE | 15 ns | 512kB | RAM, SDR, SRAM - Asynchronous | 18b | Asynchronous | 0.02A | 16b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||
| GD25Q64CYIGR | GigaDevice Semiconductor (HK) Limited | 1.0124 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MX25R6435FM2IL0 | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | MXSMIO™ | Active | 3 (168 Hours) | 8 | 5.28mm | ROHS3 Compliant | Lead Free | ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 5.23mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.16mm | 1 | e3 | Matte Tin (Sn) | DUAL | 260 | 1.8V | 40 | YES | 1.27mm | R-PDSO-G8 | 1.65V | 3.6V | 64Mb 8M x 8 | Non-Volatile | 1.65V~3.6V | 16MX4 | 4 | 67108864 bit | 80MHz | 2 | 3V | FLASH | SPI | 100μs, 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DS24B33+T&R | Maxim Integrated | 2.8305 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Through Hole | Tape & Reel (TR) | 2012 | Active | 1 (Unlimited) | 85°C | -40°C | ROHS3 Compliant | Tin | No | 3 | TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) | Serial | 5.25V | Unknown | 2.8V | 4 kb | Through Hole | -40°C~85°C TA | EEPROM | DS24B33 | TO-92-3 | 2μs | 4Kb 256 x 16 | Non-Volatile | 2.8V~5.25V | EEPROM | 1-Wire® | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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RMLV0408EGSB-4S2#HA0 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | yes | Discontinued | 3 (168 Hours) | 32 | ROHS3 Compliant | 32-SOIC (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | CMOS | ASYNCHRONOUS | 1 | DUAL | 3V | RMLV0408 | 32 | YES | R-PDSO-G32 | 2.7V | 3.6V | 4Mb 512K x 8 | Volatile | 2.7V~3.6V | 512KX8 | 8 | 4194304 bit | 45 ns | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q16DVZPJP | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | yes | Obsolete | 3 (168 Hours) | 8 | 6mm | ROHS3 Compliant | 8-WDFN Exposed Pad | 5mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 1 | e3 | MATTE TIN | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 8 | YES | 1.27mm | R-PDSO-N8 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 16Mb 2M x 8 | Non-Volatile | 0.03mA | 2.7V~3.6V | 16MX1 | 1 | 16777216 bit | SERIAL | 104MHz | 0.000025A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI - Quad I/O | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||
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MR25H40CDC | Everspin Technologies Inc. | 25.1344 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Surface Mount | Tray | 2014 | Not For New Designs | 3 (168 Hours) | 8 | EAR99 | 3.3V | 6mm | ROHS3 Compliant | Lead Free | No | 8 | 8-VDFN Exposed Pad | SPI, Serial | 4 Mb | 5mm | Surface Mount | 37.393021mg | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | 1.05mm | 1 | 42mA | DUAL | 3.3V | 8 | 1.27mm | 3V | 3.6V | 9 ns | 4Mb 512K x 8 | Non-Volatile | 3V~3.6V | 8 | 40MHz | 8b | RAM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT46V16M8P-75:D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2007 | Obsolete | 2 (1 Year) | 66 | EAR99 | 2.5V | 1 | 22.22mm | ROHS3 Compliant | Lead Free | 66 | AUTO/SELF REFRESH | 66-TSSOP (0.400, 10.16mm Width) | unknown | 128 Mb | Surface Mount | 0°C~70°C TA | SDRAM - DDR | SYNCHRONOUS | 1.2mm | 8542.32.00.02 | 1 | 130mA | e3 | Matte Tin (Sn) | DUAL | 260 | 2.5V | 30 | MT46V16M8 | 66 | 0.65mm | 2.3V | Not Qualified | 2.7V | 3-STATE | 750ps | 128Mb 16M x 8 | Volatile | 14b | 2.3V~2.7V | 16MX8 | 8 | 133MHz | 0.003A | COMMON | 4096 | DRAM | Parallel | 15ns | 248 | 248 | ||||||||||||||||||||||||||||||||||||||||||
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AS7C38096A-10TIN | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 2012 | Active | 3 (168 Hours) | 85°C | -40°C | 3.3V | 1 | 18.62mm | ROHS3 Compliant | Lead Free | No | 44 | 44-TSOP (0.400, 10.16mm Width) | Parallel | 3.6V | 2.7V | 8 Mb | 1MHz | 1.05mm | 10.363mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 44-TSOP2 | 10ns | 8Mb 1M x 8 | Volatile | 20b | 3V~3.6V | SRAM | Parallel | 10ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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K4F6E3S4HM-MGCJ | Samsung | 7.8053 |
Min: 1 Mult: 1 |
0.00000000 | download | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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M29F040B70N6 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | 2002 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 5V | ROHS3 Compliant | 32 | 32-TFSOP (0.724, 18.40mm Width) | Parallel | 5.5V | 4.5V | 4 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 15mA | M29F040 | 32-TSOP | 70ns | 4Mb 512K x 8 | Non-Volatile | 19b | 4.5V~5.5V | Asynchronous | 8b | FLASH | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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NM27C240V120 | ON Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 44-LCC (J-Lead) | Surface Mount | 0°C~70°C TA | EPROM - OTP | NM27C240 | 120ns | 4Mb 256K x 16 | Non-Volatile | 4.5V~5.5V | EPROM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V631S10BFG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 208-LFBGA | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT70V631 | 208-FPBGA (15x15) | 10ns | 4.5Mb 256K x 18 | Volatile | 3.15V~3.45V | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| GD25VQ40CTIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 4Mb 512K x 8 | Non-Volatile | 2.3V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SM668GE8-AC | Silicon Motion, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MR25H256CDF | Everspin Technologies Inc. | 1.7643 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Surface Mount | Tray | 2013 | Not For New Designs | 3 (168 Hours) | 8 | EAR99 | 6mm | ROHS3 Compliant | Lead Free | No | 8 | 8-VDFN Exposed Pad | SPI, Serial | 256 kb | Surface Mount | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | 0.9mm | 1 | 27mA | DUAL | 3V | 1.27mm | 2.7V | 3.6V | 600mW | 10 ns | 256Kb 32K x 8 | Non-Volatile | 2.7V~3.6V | 8 | 8b | 40MHz | 8b | RAM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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M25PX32-VMP6F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2013 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-VDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | M25PX32 | 8-VDFPN (6x5) (MLP8) | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 75MHz | FLASH | SPI | 15ms, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71V256SA12YI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2010 | 28 | EAR99 | 85°C | -40°C | 17.9324mm | Non-RoHS Compliant | 28 | Parallel | 7.5184mm | CMOS | 3.556mm | 8542.32.00.41 | 1 | e0 | TIN LEAD | DUAL | J BEND | 225 | 3.3V | 30 | 28 | INDUSTRIAL | YES | 1.27mm | 3V | Not Qualified | 3.6V | RAM, SRAM - Asynchronous | 32KX8 | 8 | 262144 bit | 12 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71V124SA10YI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | 3 (168 Hours) | 32 | 3A991.B.2.B | 85°C | -40°C | 20.955mm | Non-RoHS Compliant | 32 | Parallel | not_compliant | 10.16mm | CMOS | 3.683mm | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 3.3V | 30 | 32 | INDUSTRIAL | YES | 1.27mm | 3.15V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.15mA | 128KX8 | 8 | 1048576 bit | 0.01A | 10 ns | COMMON | 3.15V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| GD25WD20CEIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-XFDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2Mb 256K x 8 | Non-Volatile | 1.65V~3.6V | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT49F040A-55TU | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1997 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 32-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TC | AT49F040 | 55ns | 4Mb 512K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 40μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25Q64CPIG | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 8-DIP (0.260, 6.60mm) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7052L35PQF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2009 | Discontinued | 70°C | 0°C | 5V | 4 | 24.13mm | Non-RoHS Compliant | Contains Lead | No | 132 | PQFP | Parallel | 5.5V | 4.5V | 16 kb | 24.13mm | 3.55mm | 250mA | 35 ns | RAM, SRAM | 11b | Asynchronous | 8b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS61NLP25672-200B1LI-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 2 (1 Year) | 85°C | -40°C | ROHS3 Compliant | 209 | 209-BGA | Parallel | 3.465V | 3.135V | 200MHz | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 200MHz | 209-LFBGA (14x22) | 3.1ns | 18Mb 256K x 72 | Volatile | 3.135V~3.465V | 200MHz | SRAM | Parallel |
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S34ML01G200BHV000 Cypress Semiconductor Corp
Surface Mount ML-2 Memory IC ML-2 Series 1 Gb kb 11mm mm
Price: 0.0000
RFQ -
R1LV1616RBG-5SI#S0 Renesas Electronics America
3/3.3V V 48 Pin Memory IC R1LV1616R
Price: 0.0000
RFQ -
71V416S15YGI Integrated Device Technology (IDT)
Surface Mount 44 Pin Memory IC 4 Mb kb 28.6mm mm 170mA mA 16b b
Price: 0.0000
RFQ -
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W25Q16DVZPJP Winbond Electronics
3/3.3V V SpiFlash® 8 Pin Memory IC SpiFlash® Series 6mm mm
Price: 0.0000
RFQ -
MR25H40CDC Everspin Technologies Inc.
Surface Mount 8 Pin Memory IC 4 Mb kb 6mm mm 42mA mA 8b b
Price: 25.1344
RFQ -
MT46V16M8P-75:D Micron Technology Inc.
Surface Mount 66 Pin Memory IC MT46V16M8 128 Mb kb 22.22mm mm 130mA mA
Price: 0.0000
RFQ -
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M29F040B70N6 Micron Technology Inc.
Surface Mount Memory IC M29F040 4 Mb kb 15mA mA 8b b
Price: 0.0000
RFQ -
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MR25H256CDF Everspin Technologies Inc.
Surface Mount Memory IC 256 kb kb 6mm mm 27mA mA 8b b
Price: 1.7643
RFQ -
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IDT71V124SA10YI Integrated Device Technology (IDT)
3.3V V 32 Pin Memory IC 20.955mm mm
Price: 0.0000
RFQ -
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7052L35PQF Integrated Device Technology (IDT)
Surface Mount Memory IC 16 kb kb 24.13mm mm 250mA mA 8b b
Price: 0.0000
RFQ -


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