Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Voltage - Rated DC | Technology | Operating Mode | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Voltage | Supplier Device Package | Number of Terminals | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Common Flash Interface | Serial Bus Type | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "70P264L55BYGI") |
70P264L55BYGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 2009 | yes | Discontinued | 3 (168 Hours) | 81 | EAR99 | 85°C | -40°C | 1.8V | 2 | 5mm | RoHS Compliant | Lead Free | No | 81 | TFBGA | Parallel | 1.9V | 1.7V | 256 kb | 5mm | 1mm | CMOS | 1 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 1.8V | 30 | 81 | INDUSTRIAL | YES | SRAMs | 3-STATE | 55 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | 0.000006A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT45DB041A-TI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2001 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 28-TSSOP (0.465, 11.80mm Width) | Surface Mount | -40°C~85°C TC | FLASH | AT45DB041 | 28-TSOP | 4Mb 264Bytes x 2048 pages | Non-Volatile | 2.7V~3.6V | 13MHz | FLASH | SPI | 14ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
PC48F4400P0VB0E3 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2015 | Axcell™ | Discontinued | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 64 | 64-LBGA | Parallel | Surface Mount | -40°C~85°C TC | FLASH - NOR | 48F4400P0 | 64-EasyBGA (10x13) | 100ns | 512Mb 32M x 16 | Non-Volatile | 1.7V~2V | 52MHz | FLASH | Parallel | 100ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
TH58NVG5S0FTA20 | Toshiba | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2011 | Active | 48 | 70°C | 0°C | 3.3V | 18.4mm | RoHS Compliant | No | 48 | TFSOP | Parallel, Serial | 3.6V | 2.7V | 32 Gb | 12mm | CMOS | 1.2mm | 1 | DUAL | GULL WING | 3.3V | COMMERCIAL | 0.5mm | EEPROM, NAND | 4GX8 | 8 | 8b | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
PC28F512M29EWH3 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2011 | Discontinued | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 64 | 64-LBGA | Parallel | Surface Mount | -40°C~85°C TA | FLASH - NOR | 28F512M29EW | 64-FBGA (11x13) | 100ns | 512Mb 64M x 8 32M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 100ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1418BV18-250BZXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2003 | Obsolete | 3 (168 Hours) | 165 | 1.8V | 1 | ROHS3 Compliant | No | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 36 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, DDR II | 1 | 760mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 20 | CY7C1418 | 165 | 3-STATE | 450 ps | 36Mb 2M x 18 | Volatile | 21b | 1.7V~1.9V | 18 | Synchronous | 250MHz | 0.33A | 18b | COMMON | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V416L15YGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2013 | yes | Active | 3 (168 Hours) | 44 | 85°C | -40°C | 3.3V | 1 | 28.6mm | RoHS Compliant | Lead Free | No | 44 | Parallel | 3.6V | 3V | 4 Mb | 10.2mm | 2.9mm | CMOS | 1 | 160mA | e3 | MATTE TIN | DUAL | J BEND | 260 | 3.3V | 44 | INDUSTRIAL | SRAMs | 3-STATE | 15 ns | 512kB | RAM, SDR, SRAM - Asynchronous | 18b | Asynchronous | 16b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY14B101L-SP35XIT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 2009 | Obsolete | 3 (168 Hours) | 48 | EAR99 | 3.3V | 15.875mm | ROHS3 Compliant | Lead Free | 48 | 48-BSSOP (0.295, 7.50mm Width) | unknown | 1 Mb | Surface Mount | -40°C~85°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 2.794mm | 8542.32.00.41 | 1 | 60mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 3V | 20 | CY14B101 | 48 | 0.635mm | 2.7V | SRAMs | Not Qualified | 3.6V | 1Mb 128K x 8 | Non-Volatile | 2.7V~3.6V | 128KX8 | 8 | 8b | 0.003A | 35 ns | 8b | NVSRAM | Parallel | 35ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
M28W320HSU70ZA6E | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 64 | 64-VFBGA | Parallel | Surface Mount | -40°C~85°C TA | FLASH - NOR | M28W320 | 64-TFBGA (10.5x6.39) | 70ns | 32Mb 2M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX25R8035FM1IL0 | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2017 | MXSMIO™ | Active | 3 (168 Hours) | 8 | 4.9mm | ROHS3 Compliant | Lead Free | IT IS ALSO CONFIGURED AS 8M X 1 | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.75mm | 1 | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 1.65V | 3.6V | 8Mb 1M x 8 | Non-Volatile | 1.65V~3.6V | 2MX4 | 4 | 8388608 bit | SERIAL | 33MHz | 2 | 1.8V | FLASH | SPI | 100μs, 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FS512SAGNFI011 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tube | FS-S | Active | 3 (168 Hours) | 8 | 3A991.B.1.A | 8mm | ROHS3 Compliant | IT ALSO HAVE MEMORY WIDTH X1 | 8-WDFN Exposed Pad | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-N8 | 1.7V | 2V | 512Mb 64M x 8 | Non-Volatile | 1.7V~2V | 128MX4 | 4 | 536870912 bit | SERIAL | 133MHz | 2 | 1.8V | FLASH | SPI - Quad I/O, QPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
EM68B16CWQK-25H | Etron Technology, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 84-TFBGA | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | 400ps | 512M 32M x 16 | Volatile | 1.7V~1.9V | 400MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MTFC2GMXEA-WT | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2014 | e•MMC™ | Obsolete | 3 (168 Hours) | 85°C | -25°C | ROHS3 Compliant | 153 | 153-WFBGA | MMC | 16 Gb | Surface Mount | -25°C~85°C TA | 3.3V | FLASH - NAND | MTFC2G | 3.3V | 153-WFBGA (11.5x13) | 16Gb 2G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
6116LA15SOGI8 | Integrated Device Technology Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 1 (Unlimited) | RoHS Compliant | compliant | CMOS | ASYNCHRONOUS | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 5V | INDUSTRIAL | YES | 1.27mm | R-PDSO-G24 | 85°C | -40°C | SRAMs | Not Qualified | 5V | 24 | 3-STATE | 0.14mA | 2KX8 | 8 | 16384 bit | STANDARD SRAM | PARALLEL | 0.00002A | 15 ns | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST39VF800A-70-4C-B3KE-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel (TR) | 2000 | SST39 MPF™ | yes | Active | 3 (168 Hours) | 48 | 3A991.B.1.A | 3.3V | ROHS3 Compliant | Lead Free | No | 48 | 48-TFBGA | 8 Mb | Surface Mount | 0°C~70°C TA | CMOS | 8542.32.00.51 | 30mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 40 | SST39VF800A | YES | 0.8mm | 70ns | 8Mb 512K x 16 | Non-Volatile | 19b | 2.7V~3.6V | 512KX16 | 16 | Asynchronous | 16b | 0.00002A | 16b | YES | YES | YES | 256 | YES | FLASH | Parallel | 20μs | 2K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL128P0XNFI001 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Surface Mount | Tube | 2013 | FL-P | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.A | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-WDFN Exposed Pad | SPI | No SVHC | 128 Mb | 800μm | Surface Mount | -40°C~85°C TA | FLASH - NOR | g1015 \ 16-038.30 | 1 | 22mA | e3 | DUAL | 260 | 3V | 40 | 1.27mm | 2.7V | 3/3.3V | 3.6V | 85°C | 8 ns | 128Mb 16M x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 8b | SERIAL | 104MHz | 0.00002A | 1b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | 256B | SPI | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3319S166BCG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Bulk | 2009 | yes | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 3.3V | 2 | 17mm | RoHS Compliant | Lead Free | No | 256 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 3.45V | 3.15V | 4.5 Mb | 166MHz | 17mm | 1.4mm | CMOS | 1.7mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 256 | COMMERCIAL | YES | 1mm | SRAMs | 3-STATE | 3.6 ns | 166MHz | 512kB | RAM, SDR, SRAM | 36b | 0.5mA | 0.03A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT35XL01GBBA4G12-0SIT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Tape & Reel (TR) | Xccela™ - MT35X | Active | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~85°C | FLASH - NOR | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | FLASH | Xccela Bus | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V24L20PFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2005 | yes | Active | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 3.6V | 3V | 64 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | INDUSTRIAL | YES | 0.5mm | SRAMs | 3-STATE | 20 ns | 8kB | RAM, SDR, SRAM | 24b | 0.195mA | 4KX16 | 0.005A | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT24C1024B-PU | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Tube | 1997 | Obsolete | 1 (Unlimited) | 85°C | -40°C | 3.3V | 10.16mm | ROHS3 Compliant | No | 8 | 8-DIP (0.300, 7.62mm) | 2-Wire, I2C, Serial | 3.6V | No SVHC | 1.8V | 1 Mb | 1MHz | 4.953mm | 7.112mm | Through Hole | -40°C~85°C TA | EEPROM | 3mA | 400kHz | AT24C1024 | 8-PDIP | 550ns | 1Mb 128K x 8 | Non-Volatile | 1.8V~3.6V | 1MHz | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S99GL256P10TFI020 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Last Time Buy | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V06S55J | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 68-LCC (J-Lead) | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT70V06 | 128Kb 16K x 8 | Volatile | 3V~3.6V | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V67803S150PF8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | IDT71V67803 | 3.8ns | 9Mb 512K x 18 | Volatile | 3.135V~3.465V | 150MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL064LABNFB011 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tube | Automotive, AEC-Q100, FL-L | Active | 3 (168 Hours) | 8 | 4mm | ROHS3 Compliant | IT ALSO HAVE X1 MEMORY WIDTH | 8-WFDFN Exposed Pad | 4mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 0.6mm | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 0.8mm | S-PDSO-N8 | 2.7V | 3.6V | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 16MX4 | 4 | 67108864 bit | SERIAL | 108MHz | 2 | 3V | FLASH | SPI - Quad I/O, QPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
EM6GE16EWAKG-10IH | Etron Technology, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 96-TFBGA | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | 20ns | 4Gb 256M x 16 | Volatile | 1.425V~1.575V | 933MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
N25Q064A13E12A0F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~125°C TA | FLASH - NOR | 24-T-PBGA (6x8) | 64Mb 16M x 4 | Non-Volatile | 2.7V~3.6V | 108MHz | FLASH | SPI | 8ms, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
EM6GE16EWAKG-10H | Etron Technology, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 96-TFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3 | 20ns | 4Gb 256M x 16 | Volatile | 1.425V~1.575V | 933MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
AT24C256-10PU-1.8 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 8-DIP (0.300, 7.62mm) | Through Hole | -40°C~85°C TA | EEPROM | AT24C256 | 8-PDIP | 900ns | 256Kb 32K x 8 | Non-Volatile | 1.8V~3.6V | 400kHz | EEPROM | I2C | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT6116SA25SOI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 24-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | IDT6116 | 24-SOIC | 25ns | 16Kb 2K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 25ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V65802S100BG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | 3 (168 Hours) | 119 | 3A991.B.2.A | 70°C | 0°C | 22mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | BGA | Parallel | not_compliant | 100MHz | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 119 | COMMERCIAL | YES | 1.27mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.25mA | 512KX18 | 18 | 9437184 bit | 0.04A | 5 ns | COMMON |
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70P264L55BYGI Integrated Device Technology (IDT)
81 Pin Memory IC 256 kb kb 5mm mm
Price: 0.0000
RFQ -
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PC48F4400P0VB0E3 Micron Technology Inc.
Axcell™ Memory IC Axcell™ Series 48F4400P0
Price: 0.0000
RFQ -
-
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CY7C1418BV18-250BZXC Cypress Semiconductor Corp
Surface Mount 165 Pin Memory IC CY7C1418 36 Mb kb 760mA mA 18b b
Price: 0.0000
RFQ -
71V416L15YGI8 Integrated Device Technology (IDT)
Surface Mount 44 Pin Memory IC 4 Mb kb 28.6mm mm 160mA mA 16b b
Price: 0.0000
RFQ -
CY14B101L-SP35XIT Cypress Semiconductor Corp
Surface Mount 48 Pin Memory IC CY14B101 1 Mb kb 15.875mm mm 60mA mA 8b b
Price: 0.0000
RFQ -
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MTFC2GMXEA-WT Micron Technology Inc.
e•MMC™ Memory IC e•MMC™ Series MTFC2G 16 Gb kb
Price: 0.0000
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