Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Lead Pitch | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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AT28BV256-20JU-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 1997 | Active | 2 (1 Year) | 32 | 13.97mm | ROHS3 Compliant | 32-LCC (J-Lead) | 11.43mm | Surface Mount | -40°C~85°C TC | CMOS | ASYNCHRONOUS | 3.556mm | 1 | QUAD | 3V | YES | 1.27mm | R-PQCC-J32 | 2.7V | 3.6V | 200ns | 256Kb 32K x 8 | Non-Volatile | 2.7V~3.6V | 32KX8 | 8 | 262144 bit | 3V | EEPROM | Parallel | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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25LC160A-I/WF15K | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 1 (Unlimited) | ROHS3 Compliant | Die | Surface Mount | -40°C~85°C TA | EEPROM | 25LC160A | Die | 16Kb 2K x 8 | Non-Volatile | 2.5V~5.5V | 10MHz | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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580536-002-00 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 1 (Unlimited) | ROHS3 Compliant | SOIC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24LC512-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tube | 2007 | yes | Active | 3 (168 Hours) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | I2C, Serial | No SVHC | 512 kb | 1.75mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 5mA | e3 | DUAL | 260 | 4.5V | 40 | 24LC512 | 8 | YES | 1.27mm | 900ns | 512Kb 64K x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||
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CG8651AAT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 15 Weeks | Obsolete | Vendor Undefined | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71V3556S100BQ8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 165 | 70°C | 0°C | Non-RoHS Compliant | 165 | Parallel | not_compliant | 100MHz | CMOS | SYNCHRONOUS | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 3.3V | COMMERCIAL | YES | 1mm | SRAMs | Not Qualified | 3.3V | 3-STATE | RAM, SRAM | 0.25mA | 128KX36 | 36 | 4718592 bit | 0.04A | 5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71V256SA15Y | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Rail/Tube | 1997 | no | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 3.3V | 1 | Non-RoHS Compliant | 28 | Parallel | 3.6V | not_compliant | 3V | 256 kb | CMOS | 3.556mm | 1 | 85mA | e0 | DUAL | J BEND | 225 | 3.3V | 30 | 28 | COMMERCIAL | SRAMs | Not Qualified | 3-STATE | 15 ns | RAM, SRAM - Asynchronous | 15b | 32KX8 | 8 | Asynchronous | 0.002A | 8b | YES | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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70T3339S200BCG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2010 | yes | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 2.5V | 2 | 17mm | RoHS Compliant | Lead Free | No | 256 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 2.6V | 2.4V | 9 Mb | 200MHz | 17mm | 1.4mm | CMOS | 1.7mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 30 | 256 | COMMERCIAL | YES | 1mm | SRAMs | 3-STATE | 3.4 ns | 200MHz | 1.1MB | RAM, SDR, SRAM | 38b | 0.015A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
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70V3399S133BFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel | 2014 | yes | 3 (168 Hours) | 208 | 85°C | -40°C | 3.3V | 2 | RoHS Compliant | No | 208 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | Parallel | 2.3 Mb | 133MHz | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | INDUSTRIAL | YES | 0.8mm | 3.15V | SRAMs | 3.45V | 3-STATE | RAM, SRAM | 34b | 0.48mA | 18 | 0.04A | COMMON | 3.15V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71T75802S166BGG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel | 2012 | yes | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 2.5V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 18 Mb | 166MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 119 | COMMERCIAL | YES | 2.375V | SRAMs | 2.625V | 3-STATE | RAM, SRAM | 20b | 0.245mA | 0.04A | 3.5 ns | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||||||||||||||||||
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70V07L25PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 80 | EAR99 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | 80 | TQFP | Parallel | 3.6V | 3V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 140mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 80 | INDUSTRIAL | 0.65mm | SRAMs | Not Qualified | 3-STATE | 25 ns | 32kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.003A | 8b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||
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W25Q32FVTCIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2016 | SpiFlash® | Obsolete | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | 24 | 24-TBGA | SPI, Serial | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | 3V | YES | 1mm | 2.7V | Not Qualified | 3/3.3V | 3.6V | 32Mb 4M x 8 | Non-Volatile | 0.02mA | 2.7V~3.6V | 32MX1 | 1 | 33554432 bit | 104MHz | 0.00002A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V65903S80PFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel | 2005 | Active | 85°C | -40°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 3.465V | 3.135V | 9 Mb | 95MHz | 14mm | 1.4mm | 60mA | 8 ns | RAM, SRAM | 19b | Synchronous | 18b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT29C256-20TI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2016 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 28-TSSOP (0.465, 11.80mm Width) | Surface Mount | -40°C~85°C TC | FLASH | AT29C256 | 28-TSOP | 200ns | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V26L25G | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Bulk | 2009 | Active | 70°C | 0°C | 3.3V | 2 | 27.94mm | RoHS Compliant | Contains Lead | No | 84 | Parallel | 3.6V | 3V | 256 kb | 27.94mm | 3.68mm | 25 ns | 32kB | RAM, SDR, SRAM | 14b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71T75802S133PFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel | 2012 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 2.5V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 2.625V | 2.375V | 18 Mb | 133MHz | 14mm | 1.4mm | CMOS | 1 | 215mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 100 | INDUSTRIAL | 0.65mm | SRAMs | 3-STATE | 4.2 ns | RAM, SRAM | 20b | Synchronous | 0.06A | 18b | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||||||||||||||||
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71T75902S75BGG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2005 | yes | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 2.5V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | 2.625V | 2.375V | 18 Mb | 100MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 275mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 30 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 7.5 ns | 100MHz | 2.3MB | RAM, SDR, SRAM | 20b | Synchronous | 0.04A | 18b | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||||||||||||||
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MT29F4G08ABAFAWP-AAT:F TR | Micron Technology Inc. | 6.6442 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~105°C TC | FLASH - NAND (SLC) | 4Gb 512M x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS43TR16128C-15HBL-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Tape & Reel (TR) | yes | Active | 3 (168 Hours) | 96 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 96-TFBGA | 9mm | Surface Mount | 0°C~95°C TC | SDRAM - DDR3 | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 1.5V | NOT SPECIFIED | YES | 0.8mm | R-PBGA-B96 | 1.425V | 1.575V | 20ns | 2Gb 128M x 16 | Volatile | 1.425V~1.575V | 128MX16 | 16 | 2147483648 bit | 667MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BR24G64FJ-3GTE2 | ROHM Semiconductor | 0.2417 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | Tin | 8 | SEATED HT-CALCULATED | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | Unknown | 64 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.65mm | 1 | DUAL | NOT SPECIFIED | NOT SPECIFIED | BR24G64 | 1.27mm | 1.6V | 5.5V | 900 ns | 64Kb 8K x 8 | Non-Volatile | 1.6V~5.5V | 8 | 400kHz | 5ms | I2C | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS61VPS204836B-250B3LI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | Active | 3 (168 Hours) | 165 | 3A991.B.2.A | 15mm | ROHS3 Compliant | 165 | 165-TBGA | 13mm | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 1.2mm | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 2.5V | 10 | 165 | YES | 1mm | 2.375V | Not Qualified | 2.5V | 2.625V | 3-STATE | 2.8ns | 72Mb 2M x 36 | Volatile | 2.375V~2.625V | 2MX36 | 36 | 75497472 bit | 250MHz | COMMON | 2.38V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT52L256M64D2QB-125 XT ES:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Obsolete | 3 (168 Hours) | ROHS3 Compliant | SDRAM - Mobile LPDDR3 | 16Gb 256M x 64 | Volatile | 1.2V | 800MHz | DRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7005L55JI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2006 | no | Active | 1 (Unlimited) | 68 | EAR99 | 85°C | -40°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | PLCC | Parallel | 5.5V | 4.5V | 64 kb | 24mm | 3.63mm | CMOS | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | INDUSTRIAL | YES | SRAMs | 5V | 3-STATE | 55 ns | 8kB | RAM, SDR, SRAM | 26b | 8KX8 | 0.004A | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V7519S200BCG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Bulk | 2013 | yes | 3 (168 Hours) | 256 | 70°C | 0°C | 3.3V | 2 | 17mm | RoHS Compliant | No | 256 | PIPELINED OR FLOW THROUGH ARCHITECTURE | BGA | Parallel | 3.45V | 1mm | 3.15V | 9 Mb | 200MHz | 17mm | 1.4mm | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 256 | COMMERCIAL | YES | 15 ns | 200MHz | 1.1MB | RAM, SDR, SRAM | 36b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1049B-17VC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2001 | no | Obsolete | 3 (168 Hours) | 36 | 3A991.B.2.A | 23.495mm | Non-RoHS Compliant | Contains Lead | 36 | 36-BSOJ (0.400, 10.16mm Width) | not_compliant | 17GHz | 10.16mm | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 3.683mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | 225 | 5V | 30 | CY7C1049 | 36 | YES | 1.27mm | 4.5V | Not Qualified | 5V | 5.5V | 3-STATE | 4Mb 512K x 8 | Volatile | 0.195mA | 4.5V~5.5V | 512KX8 | 8 | 4194304 bit | 0.008A | 17 ns | COMMON | 4.5V | SRAM | Parallel | 17ns | |||||||||||||||||||||||||||||||||||||||||||||||
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W25X80VDAIZ | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2007 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 9.14mm | ROHS3 Compliant | Lead Free | SYNCHRONOUS MODE ALSO POSSIBLE | 8-DIP (0.300, 7.62mm) | SPI, Serial | unknown | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | ASYNCHRONOUS | 4.45mm | 8542.32.00.51 | 1 | e3 | MATTE TIN | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 8 | NO | 2.54mm | R-PDIP-T8 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 8Mb 1M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 8MX1 | 1 | 8388608 bit | 75MHz | 0.00001A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||
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AT49F002T-70JI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1999 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 32-LCC (J-Lead) | Surface Mount | -40°C~85°C TC | FLASH | AT49F002 | 32-PLCC (13.97x11.43) | 70ns | 2Mb 256K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 50μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71016S12YGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2008 | yes | 3 (168 Hours) | 44 | 3A991.B.2.B | 85°C | -40°C | 28.575mm | RoHS Compliant | 44 | Parallel | unknown | 10.16mm | CMOS | 3.683mm | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 30 | 44 | INDUSTRIAL | YES | 1.27mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.21mA | 64KX16 | 16 | 1048576 bit | 0.01A | 12 ns | COMMON | 4.5V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1518AV18-250BZI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2003 | Obsolete | 3 (168 Hours) | 165 | 3A991.B.2.A | 1.8V | 17mm | Non-RoHS Compliant | Contains Lead | 165 | PIPELINED ARCHITECTURE | 165-LBGA | not_compliant | 72 Mb | 15mm | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, DDR II | 1.4mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | 220 | 1.8V | NOT SPECIFIED | CY7C1518 | 165 | YES | 1mm | 1.7V | Not Qualified | 1.9V | 3-STATE | 450 ps | 72Mb 4M x 18 | Volatile | 0.8mA | 1.7V~1.9V | 4MX18 | 18 | 250MHz | COMMON | 1.7V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||
| IS42S32800G-7BI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | 90 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 90-TFBGA | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 8542.32.00.24 | 1 | 143MHz | BOTTOM | 3.3V | 90 | YES | 0.8mm | R-PBGA-B90 | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 5.4 ns | 256Mb 8M x 32 | Volatile | 0.27mA | 3V~3.6V | 8MX32 | 32 | 268435456 bit | 32b | 0.003A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 |
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24LC512-I/SN Microchip Technology
8 Pin Memory IC 24LC512 512 kb kb 4.9mm mm 5mA mA
Price: 0.0000
RFQ -
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IDT71V256SA15Y Integrated Device Technology (IDT)
Surface Mount 28 Pin Memory IC 256 kb kb 85mA mA 8b b
Price: 0.0000
RFQ -
70T3339S200BCG Integrated Device Technology (IDT)
256 Pin Memory IC 9 Mb kb 17mm mm
Price: 0.0000
RFQ -
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