Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Package / Case | Interface | REACH SVHC | Density | Height | Width | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Page Size | Serial Bus Type | I2C Control Byte | Reverse Pinout | Refresh Cycles | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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AS7C4096A-15TCNTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2001 | yes | Active | 3 (168 Hours) | 44 | 18.415mm | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 1.2mm | 1 | e3/e6 | PURE MATTE TIN/TIN BISMUTH | DUAL | 260 | 5V | 40 | 44 | YES | 0.8mm | R-PDSO-G44 | 4.5V | 5.5V | 4Mb 512K x 8 | Volatile | 4.5V~5.5V | 512KX8 | 8 | 4194304 bit | 15 ns | SRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
.png "EDFP112A3PB-GD-F-R") |
EDFP112A3PB-GD-F-R | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | FBGA | -30°C~85°C TA | SDRAM - Mobile LPDDR3 | 24Gb 192M x 128 | Volatile | 1.14V~1.95V | 800MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS42VM16800G-6BL-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 54-TFBGA | Surface Mount | 0°C~70°C TA | SDRAM - Mobile | 5.5ns | 128Mb 8M x 16 | Volatile | 1.7V~1.95V | 166MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX25L25645GZ2I-10G | Macronix | 3.6468 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2017 | MXSMIO™ | Not For New Designs | 3 (168 Hours) | Non-RoHS Compliant | Lead Free | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | e3 | Matte Tin (Sn) | 260 | 40 | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI | 30μs, 750μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24LC256T-I/SM | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Surface Mount | Tape & Reel (TR) | 2005 | yes | Active | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 5.26mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-SOIC (0.209, 5.30mm Width) | 2-Wire, I2C, Serial | No SVHC | 256 kb | 1.98mm | 5.24mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | DUAL | 260 | 40 | 24LC256 | 8 | 1.27mm | 2.5V | 3/5V | 5.5V | 900ns | 256Kb 32K x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | NO | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||
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MT49H32M18SJ-25E:B TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 9 Weeks | Tape & Reel (TR) | 2015 | Active | 3 (168 Hours) | ROHS3 Compliant | 144-TFBGA | Surface Mount | 0°C~95°C TC | 15ns | 576Mb 32M x 18 | Volatile | 1.7V~1.9V | 400MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
GD25VE32CVIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 32Mb 4M x 8 | Non-Volatile | 2.1V~3.6V | 104MHz | FLASH | SPI - Quad I/O | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25Q127CSIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | 2016 | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 12μs, 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25VQ80CTIG | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 8Mb 1M x 8 | Non-Volatile | 2.3V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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M25P20-VMP6GB | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2013 | yes | Obsolete | 3 (168 Hours) | 8 | 3.3V | 6mm | ROHS3 Compliant | No | 8 | 8-VDFN Exposed Pad | SPI, Serial | No SVHC | 2 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 0.9mm | 1 | 8mA | DUAL | 260 | 2.7V | 30 | M25P20 | 1.27mm | 2.7V | 8 ns | 2Mb 256K x 8 | Non-Volatile | 1b | 2.3V~3.6V | 2MX1 | 1 | Synchronous | 75MHz | 0.000005A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 256B | SPI | FLASH | SPI | 15ms, 5ms | ||||||||||||||||||||||||||||||||||||||||
 |
GD5F4GQ4RCYIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NAND | 4Gb 512M x 8 | Non-Volatile | 1.7V~2V | 120MHz | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
GD25Q20COIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2Mb 256K x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25Q80CTIG | GigaDevice Semiconductor (HK) Limited | 0.2602 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tube | 2016 | Active | 3 (168 Hours) | 8 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.75mm | 1 | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 2.7V | 3.6V | 8Mb 1M x 8 | Non-Volatile | 2.7V~3.6V | 8MX1 | 1 | 8388608 bit | SERIAL | 120MHz | 3.3V | FLASH | SPI - Quad I/O | 50μs, 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||
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S34ML02G100BHI000 | SkyHigh Memory Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | 63 | 11mm | RoHS Compliant | 9mm | CMOS | ASYNCHRONOUS | 1mm | 1 | BOTTOM | BALL | 3.3V | INDUSTRIAL | YES | 0.8mm | R-PBGA-B63 | 2.7V | 85°C | -40°C | 3.6V | 256MX8 | 8 | 2147483648 bit | FLASH | PARALLEL | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25S512MDFIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 512Mb 64M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD5F2GQ4UEYIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NAND | 2Gb 256M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | 700μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25Q40CSIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 4Mb 512K x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD5F4GQ4UCYIGR | GigaDevice Semiconductor (HK) Limited | 6.6315 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NAND | 4Gb 512M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
DS28E01P-100+T | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 9 Weeks | Tape & Reel (TR) | 2006 | yes | Active | 1 (Unlimited) | 6 | EAR99 | 3.94mm | ROHS3 Compliant | Tin | No | 6 | 6-LSOJ (0.148, 3.76mm Width) | Serial | Unknown | 1 kb | Surface Mount | -40°C~85°C TA | CMOS | 1.5mm | 8542.32.00.51 | 1 | e3 | DUAL | 260 | 30 | DS28E01 | 6 | YES | 1.27mm | 2.8V | 3/5V | 5.25V | 2μs | 1Kb 256 x 4 | Non-Volatile | 2.85V~5.25V | 1KX1 | 1 | 40 | 50000 Write/Erase Cycles | EEPROM | 1-Wire® | ||||||||||||||||||||||||||||||||||||||||||||
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GD5F2GQ4UEYIGY | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NAND | 2Gb 256M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | 700μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25LX256EBIRY | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 256Mb 32M x 8 | Non-Volatile | 1.65V~2V | 200MHz | FLASH | SPI - Octal I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C128M8D2-25BCNTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2013 | Active | 3 (168 Hours) | 60 | 1.8V | ROHS3 Compliant | Lead Free | 60 | 60-TFBGA | 1 Gb | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | BOTTOM | 1.8V | YES | 0.8mm | Not Qualified | 3-STATE | 400ps | 1Gb 128M x 8 | Volatile | 14b | 0.25mA | 1.7V~1.9V | 128MX8 | 8 | 400MHz | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25Q127CWIGR | GigaDevice Semiconductor (HK) Limited | 2.4367 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 12μs, 2.4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MR256DL08BMA45 | Everspin Technologies Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tray | 2012 | Active | 3 (168 Hours) | 48 | EAR99 | 8mm | ROHS3 Compliant | 48 | 48-LFBGA | 8mm | Surface Mount | 0°C~70°C TA | MRAM (Magnetoresistive RAM) | ASYNCHRONOUS | 1.35mm | 8542.32.00.71 | 1 | BOTTOM | 260 | 3.3V | 40 | 48 | YES | 0.75mm | 2.7V | 3.6V | 256Kb 32K x 8 | Non-Volatile | 2.7V~3.6V | 32KX8 | 8 | 262144 bit | RAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
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GD5F1GQ4UEYIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NAND | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | 700μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD5F2GQ4UF9IGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-VLGA Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NAND | 2Gb 256M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | 700μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD5F4GQ4RBYIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NAND | 4Gb 512M x 8 | Non-Volatile | 1.7V~2V | 120MHz | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS61WV12824-8BI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Last Time Buy | 3 (168 Hours) | 119 | 22mm | 119-BBGA | 14mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 3.5mm | 8542.32.00.41 | 1 | BOTTOM | 3.3V | YES | 1.27mm | R-PBGA-B119 | 3.135V | 3.465V | 3Mb 128K x 24 | Volatile | 3.135V~3.465V | 128KX24 | 24 | 3145728 bit | 8 ns | SRAM | Parallel | 8ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25Q40CTIG | GigaDevice Semiconductor (HK) Limited | 0.4512 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tube | 2015 | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 4Mb 512K x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25Q32CTIG | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tube | Active | 3 (168 Hours) | 8 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.75mm | 1 | DUAL | 3.3V | YES | 1.27mm | R-PDSO-G8 | 2.7V | 3.6V | 32Mb 4M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 32MX1 | 1 | 33554432 bit | SERIAL | 120MHz | 0.000005A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI - Quad I/O | 50μs, 2.4ms | BOTTOM/TOP |
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24LC256T-I/SM Microchip Technology
3/5V V Surface Mount 8 Pin Memory IC 24LC256 256 kb kb 5.26mm mm 3mA mA
Price: 0.0000
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M25P20-VMP6GB Micron Technology Inc.
Surface Mount Memory IC M25P20 2 Mb kb 6mm mm 8mA mA 8b b
Price: 0.0000
RFQ -
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