
Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Mounting Type | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Halogen Free | Supplier Device Package | Number of Terminals | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Seated Height-Max | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Page Size | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
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CAT24M01HU5I-GT3 | ON Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 9 Weeks | ACTIVE (Last Updated: 2 days ago) | Surface Mount | Tape & Reel (TR) | 2006 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 3mm | ROHS3 Compliant | Lead Free | Gold | No | 8 | 8-UFDFN Exposed Pad | 1 Mb | 550μm | 2mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 5mA | e4 | DUAL | 260 | 3.3V | 40 | CAT24M01 | 8 | 0.5mm | 3/5V | 5.5V | 85°C | Halogen Free | 400ns | 1Mb 128K x 8 | Non-Volatile | 1.8V~5.5V | SERIAL | 1MHz | 0.000002A | 100 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | SPI | 1010DDMR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
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MX25L25645GZ2I-08G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Tray | 2016 | MXSMIO™ | Active | 3 (168 Hours) | Non-RoHS Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | NOT SPECIFIED | NOT SPECIFIED | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI | 30μs, 750μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q64FWSSIF TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | SpiFlash® | Last Time Buy | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64Mb 8M x 8 | Non-Volatile | 1.65V~1.95V | 104MHz | FLASH | SPI - Quad I/O, QPI | 60μs, 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71P72604S167BQG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2006 | 3 (168 Hours) | 165 | 70°C | 0°C | 1.8V | 2 | 15mm | RoHS Compliant | 165 | PIPELINED ARCHITECTURE | Parallel | 1.9V | 1.7V | 18 Mb | 167MHz | CMOS | 1 | 850mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 30 | 165 | COMMERCIAL | 1mm | SRAMs | Not Qualified | 3-STATE | 500 ps | QDR, RAM, SRAM | 18b | 36 | Synchronous | 36b | SEPARATE | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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THGBMFG8C2LBAIL | Kioxia America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | Surface Mount | 153-FBGA (11.5x13) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25Q127CSIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | 2016 | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 12μs, 2.4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TH58NYG3S0HBAI6 | Kioxia America, Inc. | 8.0442 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 3 (168 Hours) | 67 | 8mm | RoHS Compliant | 67-VFBGA | 6.5mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 1mm | 1 | BOTTOM | 1.8V | YES | 0.8mm | R-PBGA-B67 | 1.7V | 1.95V | 8Gb 1G x 8 | Non-Volatile | 1.7V~1.95V | 1GX8 | 8 | 8589934592 bit | 3V | FLASH | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AS4C16M16S-6TAN | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2012 | yes | Obsolete | 3 (168 Hours) | 54 | EAR99 | 3.3V | 1 | 22.22mm | RoHS Compliant | Lead Free | 54 | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | 256 Mb | Surface Mount | -40°C~105°C TA | SDRAM | SYNCHRONOUS | 100mA | 1.2mm | 1 | e3/e6 | PURE MATTE TIN/TIN BISMUTH | DUAL | 260 | 3.3V | 40 | 54 | YES | 0.8mm | 3V | 3.6V | 5.4ns | 256Mb 16M x 16 | Volatile | 15b | 3V~3.6V | 16MX16 | 16 | 16b | 166MHz | DRAM | Parallel | 12ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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EM6HE16EWAKG-10IH | Etron Technology, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 96-TFBGA | Surface Mount | -40°C~95°C TC | SDRAM - DDR3L | 20ns | 4Gb 256M x 16 | Volatile | 1.283V~1.45V | 933MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W632GG6MB12J | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 96 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 96-VFBGA | 7.5mm | Surface Mount | -40°C~105°C TC | SDRAM - DDR3 | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.5V | YES | 0.8mm | R-PBGA-B96 | 1.425V | 1.575V | 20ns | 2Gb 128M x 16 | Volatile | 1.425V~1.575V | 128MX16 | 16 | 2147483648 bit | 800MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25LQ20CTIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2Mb 256K x 8 | Non-Volatile | 1.65V~2.1V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W9712G6KB-25 TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | 2016 | Active | 3 (168 Hours) | ROHS3 Compliant | 84-TFBGA | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | 400ps | 128Mb 8M x 16 | Volatile | 1.7V~1.9V | 200MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SFEM064GB1EA1TO-I-HG-121-STD | Swissbit | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tray | EM-20 | Active | 3 (168 Hours) | ROHS3 Compliant | 153-VFBGA | Surface Mount | -40°C~85°C | FLASH - NAND (MLC) | 512Gb 64G x 8 | Non-Volatile | 2.7V~3.6V | 200MHz | FLASH | eMMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS49RL36160-107EBLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 14 Weeks | Tray | Active | 3 (168 Hours) | 168 | EAR99 | 1 | 13.5mm | ROHS3 Compliant | 168 | AUTO REFRESH | 168-LBGA | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.32 | 1 | 933MHz | BOTTOM | 1.35V | 168 | YES | 1mm | 1.28V | Not Qualified | 1.35V | 1.42V | 3-STATE | 8ns | 576Mb 16M x 36 | Volatile | 3mA | 1.28V~1.42V | 16MX36 | 36 | 603979776 bit | 36b | 0.125A | COMMON | DRAM | Parallel | 248 | 248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT35XU02GCBA2G12-0AUT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tape & Reel (TR) | Xccela™ - MT35X | Active | 24-TBGA | Surface Mount | -40°C~125°C | FLASH - NOR | 2Gb 256M x 8 | Non-Volatile | 1.7V~2V | 200MHz | FLASH | Xccela Bus | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25LD80CTIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 8Mb 1M x 8 | Non-Volatile | 1.65V~2V | 50MHz | FLASH | SPI - Dual I/O | 60μs, 6ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25LQ16CWIGR | GigaDevice Semiconductor (HK) Limited | 1.1042 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16Mb 2M x 8 | Non-Volatile | 1.65V~2.1V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS43DR16320D-3DBLI | ISSI, Integrated Silicon Solution Inc | 5.8957 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Surface Mount | Tray | Active | 3 (168 Hours) | 84 | EAR99 | 1.8V | 1 | 12.5mm | ROHS3 Compliant | 84 | PROGRAMMABLE CAS LATENCY | 84-TFBGA | 512 Mb | Surface Mount | -40°C~85°C TA | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.28 | 1 | 230mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | 0.8mm | 1.7V | Not Qualified | 1.9V | 3-STATE | 450ps | 512Mb 32M x 16 | Volatile | 15b | 1.7V~1.9V | 32MX16 | 16 | 333MHz | 0.025A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY7C1613KV18-333BZXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Tube | 2003 | Active | 3 (168 Hours) | 165 | 1.8V | 2 | 17mm | ROHS3 Compliant | No | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 144 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 1.4mm | 1 | 760mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 40 | CY7C1613 | 165 | 1mm | 1.7V | 1.9V | 3-STATE | 450 ps | 144Mb 8M x 18 | Volatile | 21b | 1.7V~1.9V | 8MX18 | 18 | Synchronous | 333MHz | 18b | SEPARATE | 1.7V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25Q32CNIGR | GigaDevice Semiconductor (HK) Limited | 0.9396 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-UDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MR256A08BCMA35R | Everspin Technologies Inc. | 6.6047 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel (TR) | 2011 | Active | 3 (168 Hours) | 48 | EAR99 | 8mm | ROHS3 Compliant | 48 | 48-LFBGA | Surface Mount | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | ASYNCHRONOUS | 1.35mm | 8542.32.00.71 | 1 | BOTTOM | 260 | 3.3V | 40 | 48 | YES | 0.75mm | 3V | Not Qualified | 3.3V | 3.6V | 256Kb 32K x 8 | Non-Volatile | 0.065mA | 3V~3.6V | 32KX8 | 8 | 262144 bit | 8b | 0.007A | 35 ns | RAM | Parallel | 35ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MB85RS16NPN-G-AMEWE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | 2015 | Active | 1 (Unlimited) | RoHS Compliant | 8-WFDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 8-SON | 16Kb 2K x 8 | Non-Volatile | 2.7V~3.6V | 20MHz | FRAM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25VQ32CTIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 32Mb 4M x 8 | Non-Volatile | 2.3V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TC58NVG1S3HBAI4 | Kioxia America, Inc. | 1.1240 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 3 (168 Hours) | 63 | 11mm | RoHS Compliant | 63-VFBGA | 9mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 1mm | 1 | BOTTOM | 3.3V | YES | 0.8mm | R-PBGA-B63 | 2.7V | 3.6V | 2Gb 256M x 8 | Non-Volatile | 2.7V~3.6V | 256MX8 | 8 | 2147483648 bit | 3.3V | FLASH | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT45DB321E-SHF-T | Adesto Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel (TR) | 1997 | yes | Active | 1 (Unlimited) | 8 | 5.29mm | ROHS3 Compliant | Lead Free | Gold | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 32 Mb | Surface Mount | -40°C~85°C TC | CMOS | 22mA | 2.16mm | 1 | 22mA | e4 | DUAL | 260 | 3V | NOT SPECIFIED | 8 | 1.27mm | 2.3V | 3.6V | 7 ns | 32Mb 528Bytes x 8192 pages | Non-Volatile | 22b | 2.3V~3.6V | 32MX1 | 1 | Synchronous | 8b | 85MHz | 8b | 3V | 528B | FLASH | SPI | 8μs, 4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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THGBMHG6C1LBAIL | Kioxia America, Inc. | 7.9787 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | e•MMC™ | Obsolete | 3 (168 Hours) | 153-WFBGA | Surface Mount | -25°C~85°C TA | FLASH - NAND | 64Gb 8G x 8 | Non-Volatile | 2.7V~3.6V | 52MHz | FLASH | eMMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY7C199-15ZC | CYPRESS SEMICONDUCTOR CORP | 6.1683 |
Min: 1 Mult: 1 |
0.00000000 | [object Object] | EAR99 | 1 | 11.8mm | Non-RoHS Compliant | AUTOMATIC POWER-DOWN | not_compliant | 8mm | CMOS | ASYNCHRONOUS | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 240 | 5V | 30 | 28 | COMMERCIAL | YES | 0.55mm | R-PDSO-G28 | 4.5V | 70°C | SRAMs | Not Qualified | 5V | 5.5V | 28 | 3-STATE | 0.155mA | 32KX8 | 8 | 262144 bit | STANDARD SRAM | 1.2mm | PARALLEL | 0.01A | 15 ns | YES | COMMON | 4.5V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MX25L6406EZNI-12G | Macronix | 1.9192 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tray | 2010 | MX25xxx05/06 | Not For New Designs | 3 (168 Hours) | 8 | 3A991.B.1.A | 3.6V | 8mm | ROHS3 Compliant | Lead Free | 8-WDFN Exposed Pad | SPI, Serial | 64 Mb | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 8 | YES | 1.27mm | R-PDSO-N8 | 2.7V | Not Qualified | 3/3.3V | 64Mb 8M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 32MX2 | 2 | 86MHz | 0.00002A | 1 | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | SPI | FLASH | SPI | 300μs, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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TH58NVG4S0FTA20 | Toshiba | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2012 | Active | 70°C | 0°C | 3.3V | RoHS Compliant | No | 48 | TFSOP | Parallel, Serial | 3.6V | 2.7V | 16 Gb | EEPROM, NAND | 8b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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F128BFHTPTTL75A | SHARP/Socle Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Discontinued | 3 (168 Hours) | 56 | 18.4mm | RoHS Compliant | Lead Free | 56-TFSOP (0.724, 18.40mm Width) | unknown | 75GHz | 14mm | Surface Mount | -40°C~85°C TA | CMOS | ASYNCHRONOUS | 1.19mm | 1 | DUAL | 3V | YES | 0.5mm | R-PDSO-G56 | 2.7V | Not Qualified | 3.3V | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.3V | 8MX16 | 16 | 134217728 bit | 75 ns | 2.7V | FLASH | Parallel | 75ns |
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CAT24M01HU5I-GT3 ON Semiconductor
3/5V V Surface Mount 8 Pin Memory IC CAT24M01 1 Mb kb 3mm mm 5mA mA
Price: 0.0000
RFQ -
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IDT71P72604S167BQG Integrated Device Technology (IDT)
Surface Mount 165 Pin Memory IC 18 Mb kb 15mm mm 850mA mA 36b b
Price: 0.0000
RFQ -
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IS49RL36160-107EBLI ISSI, Integrated Silicon Solution Inc
1.35V V 168 Pin Memory IC 13.5mm mm
Price: 0.0000
RFQ -
MT35XU02GCBA2G12-0AUT TR Micron Technology Inc.
Xccela™ - MT35X Memory IC Xccela™ - MT35X Series
Price: 0.0000
RFQ -
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IS43DR16320D-3DBLI ISSI, Integrated Silicon Solution Inc
Surface Mount Memory IC 512 Mb kb 12.5mm mm 230mA mA
Price: 5.8957
RFQ -
CY7C1613KV18-333BZXC Cypress Semiconductor Corp
Surface Mount 165 Pin Memory IC CY7C1613 144 Mb kb 17mm mm 760mA mA 18b b
Price: 0.0000
RFQ -
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AT45DB321E-SHF-T Adesto Technologies
Surface Mount 8 Pin Memory IC 32 Mb kb 5.29mm mm 22mA mA 8b b
Price: 0.0000
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MX25L6406EZNI-12G Macronix
3/3.3V V MX25xxx05/06 8 Pin Memory IC MX25xxx05/06 Series 64 Mb kb 8mm mm
Price: 1.9192
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