
Items : %s%s
Bergquist
Bergquist, now a part of Henkel, is a leading manufacturer of thermal management materials and solutions. They offer a wide range of products including thermal interface materials, heat sinks, and insulated metal substrates. Bergquist's solutions are used in industries such as electronics, automotive, aerospace, and telecommunications, enabling efficient heat dissipation and thermal performance in electronic devices and systems. With their focus on thermal management innovation, Bergquist supports the reliable operation and longevity of electronic components and contributes to the advancement of thermal management technologies.Product Categories
Related Parts
-
HF650P-0.002-01-93
Thermal Interface Products Conductive Phase Change Material, 0.002" Thickness, Hi-Flow THF 1500P/650P
-
HF650P-0.001-01-81
Thermal Interface Products Conductive Phase Change Material, 0.001" Thickness, Hi-Flow THF 1500P/650P
-
HF650P-0.0015-01-29
Thermal Interface Products Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1500P/650P
-
HF650P-0.0015-01-42
Thermal Interface Products Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1500P/650P
-
HF650P-0.001-01-50
Thermal Interface Products Conductive Phase Change Material, 0.001" Thickness, Hi-Flow THF 1500P/650P
-
HF650P-0.0015-01-133
Thermal Interface Products Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1500P/650P
-
HF650P-0.0015-01-11
Thermal Interface Products Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1500P/650P
-
HF650P-0.0015-01-68
Thermal Interface Products Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1500P/650P
-
GPVOS-0.125-AC-0816
Thermal Interface Products GAP PAD, 8"x16" Sheet, 0.125" Thickness, 1 Side Adhesive, TGP800VOS/VO Soft
-
LBEA1805-10-30-7G
Thermal Interface Products Liquid Epoxy Adhesive, 2-Part, 7 Gallon Kit, Liqui-Bond TLB EA1800/EA 1805This product will ship to you directly from the manufacturer. You may order this product now. Mouser will notify you of the estimated ship date.
-
GF2000-00-600-200CC
Thermal Interface Products Liquid Gap Filler, 200CC Dual Cartridge, Gap Filler TGF 2000/2000, IDH 2191589
-
GF4000-00-240-200CC
Thermal Interface Products Liquid Gap Filler, 200CC Dual Cartridge, Gap Filler TGF 4000/4000, IDH 2192303
-
BP100-0.008-00-40
Thermal Interface Products Fiberglass Reinforced Adhesive Tape, 0.008" Thickness, Bond-Ply TBP 850/100
-
HF300P-0.002-00-70
Thermal Interface Products Conductive Phase Change Material, 0.002" Thickness, Hi-Flow THF 1600P/300P
Related Blogs
-
US and India Will Sign an Agreement to Boost Chips Collaboration
Friday 10 March, 2023 373
-
Intel CEO now expects chip shortage to last into 2024
Tuesday 28 June, 2022 360
-
What a DC Motor ?!
Wednesday 30 August, 2023 582
-
Battle of the Titans: LR44 Battery vs. 357—Unleashing Power for the Ages!
Friday 07 July, 2023 479
-
HKUST and other universities in the city team with US researchers to work on AI chips
Tuesday 28 June, 2022 573