Items : %s%s
Bergquist
Bergquist, now a part of Henkel, is a leading manufacturer of thermal management materials and solutions. They offer a wide range of products including thermal interface materials, heat sinks, and insulated metal substrates. Bergquist's solutions are used in industries such as electronics, automotive, aerospace, and telecommunications, enabling efficient heat dissipation and thermal performance in electronic devices and systems. With their focus on thermal management innovation, Bergquist supports the reliable operation and longevity of electronic components and contributes to the advancement of thermal management technologies.Product Categories
Related Parts
-
HF650P-0.0015-01-130
Thermal Interface Products Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1500P/650P
-
TGP3000ULM-0.160-02-0816
Thermal Interface Products GAP PAD, 3W/mK, 8"x16" Sheet, 0.160" Thickness, TGP3000ULM/3000ULM, IDH 2633458
-
BP100-0.011-00-35
Thermal Interface Products Fiberglass Reinforced Adhesive Tape, 0.011" Thickness, Bond-Ply TBP 850/100
-
SP1100ST-0.012-02-32
Thermal Interface Products Insulating, Conductive, Soft Tack, 0.012" Thickness, Sil-Pad TSP 1100ST/1100ST
-
TGF1450-07-60-50CC
Thermal Interface Products Gap Filler, 2-Part, Thermally Conductive, 50CC Dual Cartridge, TGF1450
-
SP1100ST-0.012-02-12/250
Thermal Interface Products Sil-Pad, Insulating, Conductive, Soft Tack, 0.012" Thickness, 12"x250' RollThis product will ship to you directly from the manufacturer. You may order this product now. Mouser will notify you of the estimated ship date.
-
SP800-0.005-00-99
Thermal Interface Products Insulator, Low-Pressure, 0.005" Thickness, Sil-Pad TSP1600/800
-
HF300P-0.002-00-84
Thermal Interface Products Conductive Phase Change Material, 0.002" Thickness, Hi-Flow THF 1600P/300P
-
HF650P-0.001-01-50
Thermal Interface Products Conductive Phase Change Material, 0.001" Thickness, Hi-Flow THF 1500P/650P
-
HF650P-0.0015-01-128
Thermal Interface Products Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1500P/650P
-
HF650P-0.001-01-94
Thermal Interface Products Conductive Phase Change Material, 0.001" Thickness, Hi-Flow THF 1500P/650P
-
TGF3000SF-00-1500-400CC
Thermal Interface Products Gap Filler, 2-Part, Sil-Free, Room Temp Cure, 3W/mK, 400ml Cartridge, TGF3000SF
-
TGF3000SF-00-1500-1200CC
Thermal Interface Products Gap Filler, 2-Part, Sil-Free, Room Temp Cure, 3W/mK, 1200ml Cartridge, TGF3000SF
-
GF4000-00-240-200CC
Thermal Interface Products Liquid Gap Filler, 200CC Dual Cartridge, Gap Filler TGF 4000/4000, IDH 2192303
Related Blogs
-
Microchip Introduces SiC E-Fuse for Enhanced Power Electronics ProtectionThursday 11 May, 2023 1001
-
What is Amplifier?Friday 04 August, 2023 1017
-
In-depth analysis of electronic components: a wonderful journey into the microscopic world Monday 13 January, 2025 820
-
Semiconductor, integrated circuit and chip knowledge classMonday 14 October, 2024 935
-
MediaTek MT7915 Wi-Fi 6 Wave 1+ ChipsetMonday 19 February, 2024 2414


Need Help?

