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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
User

Items : %s%s

Microprocessors

Additional Feature

  • 16 MIPS; BURST BUS; 5 PIPELINE STAGES
  • 24MHZ NOMINAL CLOCK AVAILABLE
  • ADDRESSABLE REGISTER (ARA)
  • ALSO OPERATES AT 1V NOMINAL SUPPLY
  • ALSO OPERATES AT 1V SUPPLY NOM
  • ALSO OPERATES AT 2.85 V MINIMUM SUPPLY
  • ALSO OPERATES AT 3.3 V
  • ALSO OPERATES AT 5V SUPPLY
  • ALSO OPERATES AT 600 MHZ
  • ALSO OPERATES AT MIN 0.912 V
  • ALSO REQUIRES 1.8V OR 2.5V SUPPLY
  • ALSO REQUIRES 1.8V OR 3.3V SUPPLY
  • ALSO REQUIRES 2.5V AND 3.3V SUPPLY
  • ALSO REQUIRES 2.5V OR 3.3V SUPPLY
  • ALSO REQUIRES 3.3V I/O SUPPLY
  • ALSO REQUIRES 3.3V SUPPLY
  • ALSO REQUIRES 3V OR 3.3V SUPPLY
  • ALSO REQUIRES 5V SUPPLY
  • ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY.
  • BARREL SHIFTER
  • BURST BUS
  • BURST BUS; 5 PIPELINE STAGES
  • CAN ALSO OPERATE WITH 5V SUPPLY
  • DRAM MEMORY REFRESH COUNTER
  • DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER
  • DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS
  • DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
  • DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE
  • DRAM REFRESH COUNTER
  • DYNAMIC BUS SIZING;UPTO 9.2 MIPS
  • IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY
  • IT ALSO OPERATES IN 600 MHZ AT 0.9V SUPPLY
  • IT ALSO OPERATES IN 800 MHZ AT 0.9V SUPPLY
  • LOW POWER TAKEN FROM SLEEP MODE
  • OPERATING CASE TEMPERATURE 0 TO 100 C
  • OPERATING CASE TEMPERATURE 0 TO 85 C
  • OPERATING CASE TEMPERTURE 0 TO 100 C
  • OPERATING CASE TEMPERTURE 0 TO 85 C
  • OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; 20 MIPS MAX; 7.5 MIPS SUSTAINED; BURST BUS
  • OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS
  • OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; BURST BUS
  • PIPELINED ARCHITECTURE
  • REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS
  • REGISTER SCOREBOARDING; BURST BUS
  • REQUIRES 3.3V SUPPLY FOR I/O
  • SEATED HGT-CALCULATED

Connector Type

  • Connector
  • IDC
  • Pin

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Silver, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.A.3
  • 3A991
  • 3A991.A.1
  • 3A991.A.2
  • 5A002
  • 5A002.A
  • 5A002.A.1
  • 5A002.A.4
  • 5A991
  • 5A992
  • 5A992.C
  • 5A992C
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 111 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 15 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 19 Weeks
  • 2 Weeks
  • 20 Weeks
  • 21 Weeks
  • 22 Weeks
  • 23 Weeks
  • 24 Weeks
  • 25 Weeks
  • 26 Weeks
  • 3 Weeks
  • 4 Weeks
  • 5 Weeks
  • 52 Weeks
  • 53 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks
  • 99 Weeks

HTS Code

  • 8542.31.00.01
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e3/e4
  • e4
  • e6
  • e8

Lifecycle Status

  • ACTIVE (Last Updated: 1 day ago)
  • ACTIVE (Last Updated: 1 week ago)
  • ACTIVE (Last Updated: 2 days ago)
  • ACTIVE (Last Updated: 2 weeks ago)
  • ACTIVE (Last Updated: 23 hours ago)
  • ACTIVE (Last Updated: 3 days ago)
  • ACTIVE (Last Updated: 3 weeks ago)
  • ACTIVE (Last Updated: 4 days ago)
  • ACTIVE (Last Updated: 5 days ago)
  • ACTIVE (Last Updated: 6 days ago)
  • ACTIVE (Last Updated: 7 months ago)
  • NRND (Last Updated: 1 week ago)
  • NRND (Last Updated: 2 days ago)
  • NRND (Last Updated: 2 weeks ago)
  • NRND (Last Updated: 3 days ago)
  • NRND (Last Updated: 4 days ago)
  • NRND (Last Updated: 5 days ago)

Manufacturer Package Identifier

  • AM1808BZWT3
  • AM1808EZCED4
  • AM5716AABCDEA
  • AMIC120BZDNA30
  • AT91SAM9G45C-CU
  • FCBGA 760
  • LFBGA-361

Max Operating Temperature

  • 100°C
  • 105°C
  • 110°C
  • 115°C
  • 125°C
  • 150°C
  • 55°C
  • 57°C
  • 64°C
  • 65°C
  • 66°C
  • 67.4°C
  • 67°C
  • 68°C
  • 69.1°C
  • 69.8°C
  • 69°C
  • 70°C
  • 71.4°C
  • 72.6°C
  • 72.7°C
  • 72°C
  • 73°C
  • 74°C
  • 75°C
  • 76.2°C
  • 76°C
  • 77°C
  • 79°C
  • 81.3°C
  • 83°C
  • 85°C
  • 87°C
  • 88°C
  • 90°C
  • 95°C

Min Operating Temperature

  • -20°C
  • -25°C
  • -30°C
  • -40°C
  • -55°C
  • -65°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 1 (Unlimited)
  • 2
  • 2 (1 Year)
  • 2A (4 Weeks)
  • 2A (4 Weeks)
  • 3
  • 3 (168 Hours)
  • 3 (168 Hours)
  • 4
  • 4 (72 Hours)
  • 4 (72 Hours)
  • 5
  • 5 (48 Hours)
  • Not Applicable

Mount

  • Box
  • Edge
  • Socket
  • Surface Mount
  • Surface Mount, Through Hole
  • Through Hole
  • Wall

Number of Pins

  • 100
  • 1023
  • 1031
  • 1088
  • 1089
  • 114
  • 1155
  • 1156
  • 128
  • 1284
  • 1288
  • 1295
  • 132
  • 1356
  • 1366
  • 144
  • 160
  • 168
  • 176
  • 179
  • 184
  • 196
  • 2
  • 20
  • 2011
  • 204
  • 208
  • 217
  • 24
  • 240
  • 241
  • 247
  • 255
  • 256
  • 272
  • 28
  • 289
  • 292
  • 296
  • 298
  • 3
  • 304
  • 32
  • 320
  • 324
  • 352
  • 356
  • 357
  • 360
  • 361
  • 364
  • 368
  • 370
  • 388
  • 399
  • 4
  • 40
  • 413
  • 416
  • 417
  • 420
  • 423
  • 432
  • 437
  • 44
  • 441
  • 449
  • 473
  • 478
  • 479
  • 48
  • 480
  • 481
  • 483
  • 484
  • 491
  • 492
  • 495
  • 515
  • 516
  • 52
  • 520
  • 5284
  • 540
  • 544
  • 559
  • 561
  • 60
  • 603
  • 604
  • 615
  • 620
  • 64
  • 668
  • 672
  • 676
  • 68
  • 684
  • 689
  • 722
  • 740
  • 760
  • 771
  • 775
  • 783
  • 8
  • 80
  • 827
  • 831
  • 838
  • 84
  • 940
  • 956
  • 988
  • 994

Number of Terminations

  • 100
  • 1023
  • 114
  • 128
  • 1295
  • 1313
  • 132
  • 1329
  • 1366
  • 144
  • 160
  • 168
  • 169
  • 176
  • 179
  • 184
  • 196
  • 20
  • 204
  • 206
  • 208
  • 217
  • 225
  • 228
  • 233
  • 236
  • 24
  • 240
  • 241
  • 247
  • 255
  • 256
  • 265
  • 272
  • 28
  • 289
  • 297
  • 298
  • 3
  • 304
  • 32
  • 320
  • 324
  • 347
  • 352
  • 356
  • 357
  • 360
  • 361
  • 364
  • 369
  • 370
  • 372
  • 388
  • 40
  • 400
  • 404
  • 413
  • 416
  • 42
  • 420
  • 423
  • 425
  • 432
  • 437
  • 44
  • 441
  • 449
  • 457
  • 473
  • 478
  • 479
  • 48
  • 480
  • 483
  • 484
  • 486
  • 488
  • 489
  • 491
  • 492
  • 515
  • 516
  • 52
  • 520
  • 525
  • 529
  • 538
  • 541
  • 544
  • 559
  • 569
  • 576
  • 603
  • 604
  • 609
  • 620
  • 621
  • 624
  • 625
  • 64
  • 668
  • 672
  • 676
  • 68
  • 684
  • 689
  • 740
  • 760
  • 771
  • 775
  • 780
  • 783
  • 8
  • 80
  • 838
  • 84
  • 85
  • 896
  • 940
  • 956
  • 988

Operating Temperature

  • -10°C~70°C TA
  • -20°C~105°C TJ
  • -20°C~70°C TA
  • -20°C~75°C TA
  • -20°C~85°C TA
  • -20°C~85°C TC
  • -30°C~70°C TA
  • -40°C~100°C TA
  • -40°C~100°C TC
  • -40°C~105°C
  • -40°C~105°C TA
  • -40°C~105°C TJ
  • -40°C~110°C TC
  • -40°C~110°C TJ
  • -40°C~115°C TA
  • -40°C~125°C TA
  • -40°C~125°C TJ
  • -40°C~70°C TA
  • -40°C~85°C
  • -40°C~85°C TA
  • -40°C~85°C TC
  • -40°C~90°C TJ
  • -40°C~95°C TA
  • -40°C~95°C TC
  • -45°C~85°C TA
  • -55°C~125°C TC
  • -55°C~125°C TJ
  • -55°C~175°C TJ
  • -55°C~85°C TA
  • 0°C~100°C TC
  • 0°C~100°C TJ
  • 0°C~105°C
  • 0°C~105°C TA
  • 0°C~105°C TC
  • 0°C~125°C TA
  • 0°C~70°C
  • 0°C~70°C TA
  • 0°C~85°C TA
  • 0°C~85°C TC
  • 0°C~85°C TJ
  • 0°C~90°C TA
  • 0°C~90°C TJ
  • 0°C~95°C
  • 0°C~95°C TA
  • 0°C~95°C TJ

Package / Case

  • 100-BFQFP
  • 100-BQFP
  • 100-LQFP
  • 100-QFP
  • 1020-BBGA, FCBGA
  • 1023-BBGA, FCBGA
  • 1023-BCBGA, FCCBGA
  • 1023-BFBGA, FCBGA
  • 1031-BFBGA, FCBGA
  • 1089-BFBGA, FCBGA
  • 114-BCPGA
  • 114-BPGA
  • 1150-LGA Module
  • 1151-LGA Module
  • 1155-LGA Module
  • 128-BPGA
  • 128-BQFP
  • 128-LQFP
  • 1292-BBGA, FCBGA
  • 1292-BFBGA, FCBGA
  • 1295-BBGA, FCBGA
  • 132-BCQFP
  • 132-BPGA Exposed Pad
  • 132-BQFP Bumpered
  • 132-QFP
  • 1366-LGA
  • 144-BCQFP
  • 144-BQFP
  • 144-LBGA
  • 144-LQFP
  • 144-TQFP
  • 168-PGA
  • 169-LFBGA
  • 176-LFBGA
  • 176-LQFP Exposed Pad
  • 179-BEPGA
  • 179-PGA
  • 182-BEPGA
  • 184-BCQFP
  • 1932-BBGA, FCBGA
  • 196-LFBGA
  • 196-TFBGA, CSBGA
  • 2011-LGA Module
  • 2011-LGA, FC
  • 204-TFBGA
  • 206-BPGA
  • 208-BFQFP
  • 208-BFQFP Exposed Pad
  • 208-LQFP
  • 208-QFP
  • 211-VFLGA
  • 217-LFBGA
  • 225-LFBGA
  • 233-TFBGA
  • 240-BFCQFP
  • 240-BFQFP
  • 241-BEPGA
  • 247-LFBGA
  • 255-BBGA, FCBGA
  • 255-BCBGA Exposed Pad
  • 255-BCBGA, FCCBGA
  • 256-BBGA
  • 256-BGA
  • 256-LBGA
  • 256-LFBGA
  • 256-LQFP
  • 256-MAPBGA
  • 256-TFBGA
  • 257-TFBGA
  • 265-LFBGA
  • 272-BBGA
  • 272-LFBGA
  • 289-BGA
  • 289-LFBGA
  • 289-TFBGA
  • 292-LFBGA
  • 297-LFBGA
  • 298-LFBGA
  • 304-LBGA Exposed Pad
  • 320-LFBGA
  • 324-BGA
  • 324-LFBGA
  • 324-TFBGA
  • 352-BBGA
  • 352-LBGA
  • 354-LFBGA
  • 357-BBGA
  • 357-BGA
  • 360-BBGA Exposed Pad
  • 360-BBGA, FCBGA
  • 360-BCBGA
  • 360-BCBGA, FCCBGA
  • 360-CBGA, FCCBGA
  • 360-CLGA, FCCLGA
  • 361-LFBGA
  • 361-TFBGA
  • 364-LFBGA
  • 3647-LGA Module
  • 369-LFBGA
  • 40-DIP (0.600, 15.24mm)
  • 40-DIP (0.620, 15.75mm)
  • 400-LFBGA
  • 404-LFBGA
  • 416-BGA
  • 416-LFBGA
  • 423-LFBGA, FCBGA
  • 425-FBGA
  • 432-LBGA
  • 432-TFBGA
  • 44-LCC (J-Lead)
  • 44-LQFP
  • 448-BFBGA
  • 448-FBGA Exposed Pad
  • 448-LFBGA
  • 449-FBGA
  • 457-FBGA
  • 457-LFBGA
  • 473-LFBGA
  • 480-LBGA Exposed Pad
  • 483-BCBGA, FCCBGA
  • 484-BBGA Exposed Pad
  • 486-LFBGA
  • 486-LFBGA, FCBGA
  • 488-TFBGA
  • 489-LFBGA
  • 491-LFBGA
  • 492-BBGA
  • 515-VFBGA, FCBGA
  • 515-WFBGA, FCBGA
  • 516-BBGA
  • 516-BBGA Exposed Pad
  • 520-FBGA, FCBGA
  • 520-LFBGA
  • 525-FBGA, FCBGA
  • 529-FBGA
  • 529-LFBGA
  • 538-LFBGA, FCBGA
  • 541-LFBGA
  • 561-FBGA
  • 569-LFBGA
  • 620-BBGA Exposed Pad
  • 621-FBGA, FCBGA
  • 624-FBGA, FCBGA
  • 624-LFBGA
  • 624-LFBGA, FCBGA
  • 625-BFBGA, FCBGA
  • 64-CDIP (0.900, 22.86mm)
  • 64-DIP (0.750, 19.05mm)
  • 64-LQFP
  • 64-QFP
  • 668-BBGA Exposed Pad
  • 672-LBGA
  • 68-BCPGA
  • 68-CPGA
  • 68-LCC (J-Lead)
  • 684-BFBGA, FCBGA
  • 689-BBGA Exposed Pad
  • 740-LBGA
  • 760-BFBGA, FCBGA
  • 760-LFBGA
  • 780-BBGA, FCBGA
  • 780-BFBGA
  • 780-BFBGA, FCBGA
  • 780-FBGA
  • 780-FBGA, FCBGA
  • 783-BBGA, FCBGA
  • 784-BBGA, FCBGA
  • 80-BQFP
  • 84-LCC (J-Lead)
  • 896-BFBGA, FCBGA
  • 988-PGA Module
  • 994-BCBGA, FCCBGA
  • BGA
  • CDIP
  • DIP
  • FBGA
  • FCBGA
  • LCC
  • LGA
  • LQFP
  • MAPBGA
  • Module
  • PDIP
  • PLCC
  • PQFP
  • QFN
  • QFP
  • SOIC
  • TFBGA
  • TQFP

Packaging

  • Box
  • Box|Tray
  • Bulk
  • Cut Tape (CT)
  • Each
  • Tape & Reel
  • Tape & Reel (TR)
  • Tape and Reel
  • Tray
  • Tray|Box
  • Tube

Part Status

  • Active
  • Discontinued
  • Last Time Buy
  • LTB
  • Not For New Designs
  • NRND
  • Obsolete
  • Preliminary
  • Unconfirmed

Pbfree Code

  • no
  • yes

Published

  • 1993
  • 1994
  • 1995
  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2002
  • 2003
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • AT91SAM
  • Automotive, AEC-Q100
  • Broadwell
  • Broadwell-EP
  • C29x Crypto
  • Conroe
  • EP7
  • EP9
  • eZ80® Acclaim!®
  • Haswell
  • i.MX1
  • i.MX21
  • i.MX23
  • i.MX25
  • i.MX27
  • i.MX28
  • i.MX31
  • i.MX35
  • i.MX50
  • i.MX51
  • i.MX53
  • i.MX6
  • i.MX6D
  • i.MX6DL
  • i.MX6DP
  • i.MX6G
  • i.MX6Q
  • i.MX6QP
  • i.MX6S
  • i.MX6SL
  • i.MX6SLL
  • i.MX6SX
  • i.MX6UL
  • i.MX6Y
  • i.MX7D
  • i.MX7S
  • i.MX7ULP
  • i.MX8MD
  • i.MX8MM
  • i.MX8MN
  • i.MX8MQ
  • i.MXL
  • i.MXS
  • i186
  • i386
  • i486
  • i960
  • Interprise™
  • Ivy Bridge
  • Ivy Bridge-EP
  • Kaby Lake
  • M680x0
  • M683xx
  • Merom
  • Mobile Celeron
  • Mobile Pentium II
  • MPC52xx
  • MPC6xx
  • MPC74xx
  • MPC7xx
  • MPC82xx
  • MPC83xx
  • MPC85xx
  • MPC86xx
  • MPC8xx
  • OMAP-35xx
  • OMAP-59xx
  • OMAP-L1x
  • Penryn
  • QorIQ P1
  • QorIQ P2
  • QorIQ P3
  • QorIQ P4
  • QorIQ P5
  • QorIQ Qonverge B
  • QorIQ Qonverge BSC
  • QorIQ T1
  • QorIQ T2
  • QorIQ T4
  • QorIQ®
  • QorIQ® Layerscape
  • QorlQ LS1
  • Rabbit®
  • RZ/A1H
  • RZ/A1L
  • RZ/A1LC
  • RZ/A1LU
  • RZ/A1M
  • RZ/N1D
  • RZ/N1L
  • RZ/N1S
  • SA-110
  • SAC™
  • SAM9CN
  • SAM9G
  • SAM9M
  • SAM9N
  • SAM9X
  • SAM9X60
  • SAM9XE
  • SAMA5D2
  • SAMA5D3
  • SAMA5D4
  • Sandy Bridge
  • Sandy Bridge-EP
  • SCC
  • SIAP™
  • Sitara™
  • Skylake
  • SPEAr®
  • STM32MP1
  • Vybrid, VF3xx
  • Vybrid, VF3xxR
  • Vybrid, VF5xx
  • Vybrid, VF5xxR
  • Vybrid, VF6xx
  • Wolfdale
  • Yonah
  • Yorkfield
  • Z180
  • Z80
  • ZIP™

Supplier Device Package

  • 100-PQFP (19x19)
  • 100-PQFP (20x14)
  • 100-QFP (14x20)
  • 100-TQFP (14x14)
  • 100-VQFP (14x14)
  • 1023-FCCBGA (33x33)
  • 1023-FCPBGA (33x33)
  • 114-PGA (34.55x34.55)
  • 1150-FCLGA
  • 1150-LGA
  • 1151-FCLGA
  • 1151-LGA
  • 1155-FCLGA
  • 1155-FCLGA (37.5x37.5)
  • 1155-LGA (37.5x37.5)
  • 1295-FCPBGA (37.5x37.5)
  • 132-CPGA
  • 132-CQFP (24x24)
  • 132-PGA (34.5x34.5)
  • 132-PQFP (24.13x24.13)
  • 132-PQFP (46x46)
  • 1366-LGA
  • 144-CQFP (26.77x26.77)
  • 144-LQFP (20x20)
  • 168-PGA
  • 176-HLQFP (24x24)
  • 179-PGA (47.24x47.24)
  • 184-CQFP (31.3x31.3)
  • 196-QFP
  • 2011-LGA
  • 206-PGA (47.25x47.25)
  • 208-LQFP
  • 208-PQFP (28x28)
  • 208-SQFP (28x28)
  • 211-FCLGA (9.6x9.6)
  • 217-LFBGA (15x15)
  • 225-MAPBGA (13x13)
  • 240-FQFP (32x32)
  • 241-PGA (47.24x47.24)
  • 255-CI-CGA (21x21)
  • 255-FCCBGA (21x21)
  • 255-PBGA (21x21)
  • 256-BGA (17x17)
  • 256-CABGA (17x17)
  • 256-MAPBGA (17x17)
  • 256-PBGA (17x17)
  • 256-PBGA (23x23)
  • 272-PBGA (27x27)
  • 289-BGA (19x19)
  • 289-MAPBGA (14x14)
  • 292-LFBGA (17x17)
  • 298-NFBGA (13x13)
  • 304-TBGA (31x31)
  • 320-LFBGA (13x13)
  • 324-NFBGA(15x15)
  • 324-TFBGA (15x15)
  • 352-TBGA (35x35)
  • 357-PBGA (25x25)
  • 360-CBGA (25x25)
  • 360-FCCBGA (25x25)
  • 360-PBGA (25x25)
  • 361-NFBGA (13x13)
  • 361-NFBGA (16x16)
  • 369-PBGA (19x19)
  • 400-MAPBGA (17x17)
  • 416-PBGA (27x27)
  • 423-FCBGA (16x16)
  • 425-TEPBGA I (19x19)
  • 432-MAPBGA (13x13)
  • 448-PBGA w/Heat Spreader (23x23)
  • 457-MAPBGA (14x14)
  • 473-MAPBGA (19x19)
  • 478-PGA
  • 480-TBGA (37.5x37.5)
  • 483-HTCE-CBGA (29x29)
  • 491-NFBGA (17x17)
  • 515-POP-FCBGA (12x12)
  • 515-POP-FCBGA (14x14)
  • 516-FPBGA (27x27)
  • 516-TEPBGA (27x27)
  • 525-FCPBGA (19x19)
  • 561-TEPBGA I (23x23)
  • 615-BGA (35.15x31.15)
  • 620-PBGA (29x29)
  • 624-FCBGA (21x21)
  • 64-QFP (14x14)
  • 668-PBGA-PGE (29x29)
  • 672-TBGA (35x35)
  • 68-PLCC (24.21x24.21)
  • 684-FCBGA (23x23)
  • 689-TEPBGA II (31x31)
  • 740-TBGA (37.5x37.5)
  • 775-LGA
  • 780-FCPBGA (23x23)
  • 783-FCPBGA (29x29)
  • 988-PGA
  • 988-PGA (37.5x37.5)
  • 994-FCCBGA (33x33)

Surface Mount

  • NO
  • YES

Terminal Finish

  • Gold (Au)
  • MATTE TIN
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • NOT SPECIFIED
  • TIN
  • Tin (Sn)
  • TIN BISMUTH
  • TIN COPPER/TIN SILVER
  • TIN LEAD
  • TIN LEAD SILVER
  • TIN SILVER
  • TIN SILVER COPPER
  • TIN SILVER COPPER OVER NICKEL
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn80Pb20)
  • Tin/Lead (Sn85Pb15)
  • Tin/Lead/Silver (Sn/Pb/Ag)
  • TIN/NICKEL PALLADIUM GOLD
  • TIN/SILVER
  • Tin/Silver (Sn/Ag)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)
  • Tin/Silver/Copper - with Nickel barrier
  • Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Termination

  • SMD/SMT

Transistor Element Material

  • SILICON

USB

  • USB 1.1 (2)
  • USB 1.1 + PHY (1), USB 2.0 + PHY (1)
  • USB 2.0 (1)
  • USB 2.0 (1), USB 3.0 (1)
  • USB 2.0 (2)
  • USB 2.0 (3)
  • USB 2.0 (3), USB 2.0 + PHY (1)
  • USB 2.0 + HSIC
  • USB 2.0 + PHY (1)
  • USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
  • USB 2.0 + PHY (2)
  • USB 2.0 + PHY (3)
  • USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
  • USB 2.0 + PHY (4)
  • USB 2.0 OTG + PHY (1)
  • USB 2.0 OTG + PHY (2)
  • USB 3.0 (2)

Weight

  • 1.241794g
  • 1.428504g
  • 1.486592g
  • 1.623294g
  • 1.662955g
  • 1.713814g
  • 1.724048g
  • 1.758663g
  • 1.758804g
  • 10.060849g
  • 10.163049g
  • 10.630703g
  • 10.784102g
  • 11.162596g
  • 11.227488g
  • 11.285492g
  • 11.436396g
  • 11.529496g
  • 12.834991g
  • 12.927383g
  • 12.964294g
  • 12.96659g
  • 13.095892g
  • 13.971014g
  • 14.084298g
  • 2.089502g
  • 2.094208g
  • 2.096504g
  • 2.169986g
  • 2.1737g
  • 2.267508g
  • 2.514603g
  • 2.587007g
  • 2.668711g
  • 2.784008g
  • 205.307246mg
  • 274.791928mg
  • 284.997756mg
  • 29.780891g
  • 3.193404g
  • 3.336087g
  • 3.420001g
  • 3.534392g
  • 3.663807g
  • 3.695587g
  • 3.803287g
  • 360.605934mg
  • 4.086896g
  • 4.31131g
  • 4.358994g
  • 4.374388g
  • 4.543691g
  • 4.617712g
  • 4.634155g
  • 4.634807g
  • 4.724505g
  • 4.743102g
  • 4.801956g
  • 5.177388g
  • 5.247213g
  • 5.438686g
  • 5.496887g
  • 5.503805g
  • 5.67084g
  • 5.819307g
  • 5.821943g
  • 5.854205g
  • 5.976306g
  • 530.703073g
  • 6.069208g
  • 6.610599g
  • 6.718043g
  • 685.207974mg
  • 7.349897g
  • 7.994395g
  • 789.392471mg
  • 838.692292mg
  • 9.256006g
  • 9.283193g
  • 911.607266mg
  • 919.403384mg
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    RFQ

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    		 0.00000000 Bulk 70°C 0°C 1.2V RoHS Compliant No 740 400MHz 10.784102g Halogen Free 1 400MHz 32b
    XPC855TZP66D4 XPC855TZP66D4 Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
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    		 0.00000000 download 3 357 5A991 25mm RoHS Compliant 357 BGA 25mm CMOS 2.05mm 8542.31.00.01 e0 TIN LEAD BOTTOM BALL 220 3.3V NOT SPECIFIED 357 YES 1.27mm 3.135V Other Microprocessor ICs Not Qualified 3.3V 3.465V Not Halogen Free 66 MHz 32 YES YES 32 FIXED POINT MICROPROCESSOR, RISC 66MHz 32 YES
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    RFQ

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    Mult: 1

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    MC68LC302CPU20CT MC68LC302CPU20CT Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
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    		 0.00000000 3 (168 Hours) 620 5A992 105°C 0°C 1.2V 29mm RoHS Compliant No 620 ALSO REQUIRES 2.5V AND 3.3V SUPPLY BGA 400MHz 4.358994g CMOS 2.46mm e0 Tin/Lead/Silver (Sn/Pb/Ag) BOTTOM BALL 260 1.2V 40 620 OTHER YES Microprocessors Halogen Free 1 400MHz 32 YES YES FLOATING POINT 32b MICROPROCESSOR 32 YES
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    		 0.00000000 Bulk 3 (168 Hours) 3A991 105°C 0°C 1.1V 33mm RoHS Compliant Lead Free 1.5GHz 5.177388g CMOS e2 Tin/Silver (Sn/Ag) BOTTOM BALL NOT SPECIFIED 1.1V NOT SPECIFIED YES 1mm Not Qualified 1.15V Halogen Free 2 RISC 166.66 MHz 1.5GHz 32 YES YES FLOATING POINT 32b MICROPROCESSOR 32 YES
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    		 0.00000000 download 3 620 5A002 105°C -40°C 1.2V 29mm RoHS Compliant No 620 ALSO REQUIRES 2.5V AND 3.3V SUPPLY BGA 400MHz 4.358994g CMOS 2.46mm e0 Tin/Lead/Silver (Sn/Pb/Ag) BOTTOM BALL 260 1.2V 40 620 INDUSTRIAL YES Halogen Free 1 400MHz 32 YES YES FLOATING POINT 32b MICROPROCESSOR 32 YES
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    RFQ

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    MPC850ZQ66BU MPC850ZQ66BU Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
    RFQ

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    Mult: 1

    		 0.00000000 no 95°C 0°C 3.3V RoHS Compliant Contains Lead No 256 BGA 66MHz 1.724048g Not Halogen Free 1 66MHz 8kB 32b
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