Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Serial Bus Type | I2C Control Byte | Refresh Cycles | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "7016L35J") |
7016L35J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | SEMAPHORE; INTERRUPT FLAG; AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | PLCC | Parallel | 5.5V | 4.5V | 144 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 210mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 35 ns | 18kB | RAM, SDR, SRAM | 28b | 16KX9 | Asynchronous | 0.005A | 9b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7132LA25JGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2013 | yes | 52 | EAR99 | 85°C | -40°C | 5V | 2 | 19mm | RoHS Compliant | Lead Free | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 16 kb | 19mm | 3.63mm | CMOS | 1 | e3 | MATTE TIN | QUAD | J BEND | 260 | 5V | 30 | 52 | INDUSTRIAL | YES | 25 ns | 2kB | RAM, SDR, SRAM | 22b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3559S85BQG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | FLOW-THROUGH ARCHITECHTURE | Parallel | 3.465V | 3.135V | 4.5 Mb | 91MHz | 13mm | 1.2mm | CMOS | 1 | 225mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | COMMERCIAL | SRAMs | 3-STATE | 8.5 ns | RAM, SRAM | 18b | Synchronous | 0.04A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75802S133PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2012 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 2.5V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 2.625V | 2.375V | 18 Mb | 133MHz | 14mm | 1.4mm | CMOS | 1 | 195mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 30 | 100 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 4.2 ns | 133MHz | 2.3MB | RAM, SDR, SRAM | 20b | Synchronous | 0.04A | 18b | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||||||||||||||||
|
71V016SA20BF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2011 | Active | 70°C | 0°C | 3.3V | 1 | 7mm | RoHS Compliant | Contains Lead | No | 48 | Parallel | 3.6V | 3V | 1 Mb | 7mm | 1.4mm | 120mA | 20 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 16b | Asynchronous | 16b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48LC32M8A2TG-75 IT:D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2010 | no | Obsolete | 2 (1 Year) | 54 | EAR99 | 1 | 22.22mm | Non-RoHS Compliant | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | not_compliant | 10.16mm | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 8542.32.00.24 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | 235 | 3.3V | 30 | MT48LC32M8A2 | 54 | YES | 0.8mm | R-PDSO-G54 | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 5.4ns | 256Mb 32M x 8 | Volatile | 0.27mA | 3V~3.6V | 32MX8 | 8 | 268435456 bit | 133MHz | 0.002A | COMMON | 8192 | DRAM | Parallel | 15ns | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||
|
W632GU8NB-11 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 78-VFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | 20ns | 2Gb 256M x 8 | Volatile | 1.283V~1.45V | 933MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
709149S8PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 80 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 5.5V | 4.5V | 36 kb | 62.5MHz | 14mm | 1.4mm | CMOS | 1 | 320mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 80 | COMMERCIAL | 0.65mm | SRAMs | 5V | 3-STATE | 8 ns | 4.5kB | RAM, SDR, SRAM | 24b | 4KX9 | Synchronous | 0.015A | 9b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX25L8073EM2I-10G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | 2013 | MXSMIO™ | Not For New Designs | 3 (168 Hours) | 8 | 5.28mm | RoHS Compliant | CAN BE ORGNISED AS 8 MBIT X 1 | 8-SOIC (0.209, 5.30mm Width) | 5.23mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.16mm | 1 | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 40 | 8 | YES | 1.27mm | R-PDSO-G8 | 2.7V | 3.6V | 8Mb 1M x 8 | Non-Volatile | 2.7V~3.6V | 2MX4 | 4 | 8388608 bit | SERIAL | 108MHz | 2 | 2.7V | FLASH | SPI | 300μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST25WF080BT-40E/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel (TR) | SST25 | Active | 3 (168 Hours) | 8 | 4.9mm | 8-SOIC (0.154, 3.90mm Width) | compliant | 3.9mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.75mm | 1 | DUAL | 1.8V | YES | 1.27mm | R-PDSO-G8 | 1.65V | 1.95V | AEC-Q100; TS 16949 | 8Mb 1M x 8 | Non-Volatile | 1.65V~1.95V | 8MX1 | 1 | 8388608 bit | SERIAL | 80MHz | 1.8V | FLASH | SPI | 1ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V35761S200BQI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 165-TBGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | IDT71V35761 | 165-CABGA (13x15) | 3.1ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 200MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT29F64G08CBEFBL94C3WC1 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | Vendor Undefined | ROHS3 Compliant | Die | Surface Mount | 0°C~70°C TA | FLASH - NAND (MLC) | 64Gb 8G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT47H32M16CC-5E IT:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2008 | Obsolete | 3 (168 Hours) | 84 | EAR99 | 1 | 12.5mm | ROHS3 Compliant | AUTO/SELF REFRESH | 84-TFBGA | unknown | 12mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.28 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | MT47H32M16 | 84 | YES | 0.8mm | R-PBGA-B84 | 1.7V | Not Qualified | 1.8V | 1.9V | 3-STATE | 600ps | 512Mb 32M x 16 | Volatile | 0.34mA | 1.7V~1.9V | 32MX16 | 16 | 536870912 bit | 200MHz | 0.007A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | ||||||||||||||||||||||||||||||||||||||||||||||
 |
AT28C256-15PI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2000 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 28-DIP (0.600, 15.24mm) | Through Hole | -40°C~85°C TC | EEPROM | AT28C256 | 28-PDIP | 150ns | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | EEPROM | Parallel | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24LC014H-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Through Hole | Tube | 2008 | Active | 1 (Unlimited) | 85°C | -40°C | 5V | 10.16mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-DIP (0.300, 7.62mm) | 2-Wire, I2C, Serial | 5.5V | No SVHC | 2.5V | 1 kb | 1MHz | 4.953mm | 7.112mm | Through Hole | -40°C~85°C TA | EEPROM | 3mA | 1MHz | 24LC014H | 8-PDIP | 400ns | 1Kb 128 x 8 | Non-Volatile | 2.5V~5.5V | 1MHz | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
CY7C130-55PC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 48-DIP (0.600, 15.24mm) | Through Hole | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | 48-PDIP | 55ns | 8Kb 1K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT40A1G8WE-075E:D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tray | Last Time Buy | 3 (168 Hours) | 78 | 1 | 12mm | ROHS3 Compliant | AUTO/SELF REFRESH | 78-TFBGA | 8mm | Surface Mount | 0°C~95°C TC | SDRAM - DDR4 | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | 1.2V | YES | 0.8mm | R-PBGA-B78 | 1.14V | 1.26V | 8Gb 1G x 8 | Volatile | 1.14V~1.26V | 1GX8 | 8 | 8589934592 bit | 1.33GHz | MULTI BANK PAGE BURST | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
FM25V05-GTR | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | F-RAM™ | yes | Active | 3 (168 Hours) | 8 | EAR99 | 3.3V | 4.9mm | ROHS3 Compliant | Lead Free | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 512 kb | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | SYNCHRONOUS | 1.75mm | 1 | 3mA | e3 | Tin (Sn) | DUAL | 260 | 3.3V | 30 | FM25V05 | 8 | 1.27mm | 2V | SRAMs | Not Qualified | 3.6V | 9 ns | 512Kb 64K x 8 | Non-Volatile | 2V~3.6V | 8 | 8b | 40MHz | 0.00015A | 8b | FRAM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7009L20PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 1 Mb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 360mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 30 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 5V | 3-STATE | 20 ns | 128kB | RAM, SDR, SRAM | 34b | Asynchronous | 0.006A | 8b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7015L12PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 80 | TQFP | Parallel | 5.5V | 4.5V | 72 kb | 14mm | 1.4mm | 275mA | 80 | 12 ns | 9kB | RAM, SDR, SRAM | 26b | Asynchronous | 9b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
24C65-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Tube | 2003 | yes | Active | 1 (Unlimited) | 8 | 5V | 10.16mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-DIP (0.300, 7.62mm) | 2-Wire, I2C, Serial | No SVHC | 64 kb | 4.953mm | 7.112mm | Through Hole | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | DUAL | 5V | 24C65 | 8 | 2.54mm | 5V | 6V | OPEN-DRAIN | 900ns | 64Kb 8K x 8 | Non-Volatile | 4.5V~6V | 400kHz | 0.000005A | 200 | 100000 Write/Erase Cycles | SOFTWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
24AA128-I/MF | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 6mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS | 8-VDFN Exposed Pad | 2-Wire, I2C, Serial | 128 kb | 950μm | 5mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | DUAL | 260 | 2.5V | 40 | 24AA128 | 8 | 1.27mm | 1.7V | 2/5V | 5.5V | 900ns | 128Kb 16K x 8 | Non-Volatile | 1.7V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||
 |
AT27C4096-90PI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1997 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 40-DIP (0.600, 15.24mm) | Through Hole | -40°C~85°C TC | EPROM - OTP | AT27C4096 | 90ns | 4Mb 256K x 16 | Non-Volatile | 4.5V~5.5V | EPROM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C32M16MD1-5BCN | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | 2014 | Discontinued | 3 (168 Hours) | 60 | EAR99 | 1.8V | 1 | 9mm | ROHS3 Compliant | Lead Free | 60 | AUTO/SELF REFRESH | 60-TFBGA | 512 Mb | Surface Mount | -30°C~85°C TJ | SDRAM - Mobile LPDDR | SYNCHRONOUS | 1.025mm | 8542.32.00.28 | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 0.8mm | 1.7V | 1.95V | 700ps | 512Mb 32M x 16 | Volatile | 13b | 1.7V~1.9V | 32MX16 | 16 | 200MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V416S10BEG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | 2014 | yes | Active | 3 (168 Hours) | 48 | 70°C | 0°C | 3.3V | 1 | 9mm | RoHS Compliant | Lead Free | No | 48 | TFBGA | Parallel | 3.6V | 3V | 4 Mb | 9mm | 1.2mm | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 48 | INDUSTRIAL | YES | 0.75mm | SRAMs | 3-STATE | 10 ns | 512kB | RAM, SDR, SRAM - Asynchronous | 18b | 0.2mA | 0.02A | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7024S35J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2000 | no | Active | 1 (Unlimited) | 84 | EAR99 | 70°C | 0°C | 5V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 5.5V | 4.5V | 64 kb | 29.21mm | 3.63mm | CMOS | 4.57mm | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 3-STATE | 35 ns | 8kB | RAM, SDR, SRAM | 24b | 4KX16 | Asynchronous | 0.015A | 16b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V65703S75BQ8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Contains Lead | No | 165 | Parallel | 9 Mb | 13mm | 1.2mm | CMOS | e0 | TIN LEAD | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | COMMERCIAL | YES | SRAMs | 3-STATE | RAM, SRAM | 18b | 0.275mA | 256KX36 | 0.04A | 7.5 ns | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7016L20JI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 1 (Unlimited) | 68 | EAR99 | 85°C | -40°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | PLCC | Parallel | 5.5V | 4.5V | 144 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 310mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | INDUSTRIAL | SRAMs | 5V | 3-STATE | 20 ns | RAM, SRAM | 14b | 16KX9 | Asynchronous | 0.005A | 9b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7006L25PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | yes | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Lead Free | No | 64 | TQFP | Parallel | 5.5V | 4.5V | 128 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 220mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 30 | 64 | COMMERCIAL | 0.8mm | SRAMs | 5V | 3-STATE | 25 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71024S20YI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2010 | 3 (168 Hours) | 32 | 3A991.B.2.B | 85°C | -40°C | 1 | 20.955mm | Non-RoHS Compliant | 32 | Parallel | not_compliant | 10.16mm | CMOS | 3.683mm | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 5V | 30 | 32 | INDUSTRIAL | YES | 1.27mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.14mA | 128KX8 | 8 | 1048576 bit | 0.01A | 20 ns | YES | COMMON | 4.5V |
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