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Apple M5 chip is coming: TSMC SoIC packaging technology leads the future
Recently, the industry has heard an exciting news: Apple is actively developing its next-generation M series chip, M5, and plans to adopt TSMC's SoIC (System-on-Integrated-Chips) advanced packaging technology. It is expected that this M5 chip, which integrates many innovative technologies, will be r...

Milestones in the semiconductor industry: A new wave of investment for major global manufacturers
Recently, the semiconductor industry has received a number of major positive news, with several industry giants announcing major investment plans. These initiatives will significantly enhance global semiconductor manufacturing and packaging capabilities and further consolidate its key position in th...

New trends in the global chip industry: innovation, competition and future prospects
In today's era of rapid technological development, chips, as the core components of information technology, are driving the transformation and development of all industries at an unprecedented speed. From a global perspective, a series of recent big news in the chip industry not only reveals the acc...

China's Fully Independent and Controllable Chiplet High-Speed Serial Port Standard is Officially Rel
China's Fully Independent and Controllable Chiplet High-Speed Serial Port Standard is Officially Released!...

The Most Recent Chip Industry Newsletters Of 2023
The Recent Chip Industry Newsletters of 2023 ...