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Samsung Announces Launch of First GAA Process Advanced Packaging in 2025
On July 6th, Samsung Electronics announced its plans to introduce the first Gate-All-Around (GAA) process advanced packaging technology in 2025....

In the Next 20 Years, Samsung Plans to Invest 230 Billion US Dollars in Chip Manufacturing
In the Next 20 Years, Samsung Plans to Invest 230 Billion US Dollars in Chip Manufacturing...