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  • STM32F103C8T6
  • MFI343S00177
  • STM32F407VET6
  • ATMEGA328P-PU
User

Items : %s%s

Bridge Rectifiers

Contact Plating

  • Tin

Diode Element Material

  • SILICON

ECCN Code

  • EAR99

Factory Lead Time

  • 10 Weeks
  • 12 Weeks
  • 13 Weeks
  • 18 Weeks
  • 8 Weeks
  • 9 Weeks

fmax-Min

  • 6000 MHz

JESD-609 Code

  • e3

Lifecycle Status

  • ACTIVE (Last Updated: 1 day ago)
  • ACTIVE (Last Updated: 19 hours ago)
  • ACTIVE (Last Updated: 2 days ago)
  • ACTIVE (Last Updated: 4 days ago)
  • ACTIVE (Last Updated: 4 hours ago)

Manufacturer Package Identifier

  • MiniDIP

Moisture Sensitivity Level (MSL)

  • 1 (Unlimited)

Mount

  • Surface Mount
  • Surface Mount, Through Hole
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 4

Number of Terminations

  • 4

Operating Temperature

  • -55°C~125°C TJ
  • -55°C~150°C TJ
  • -65°C~150°C TJ

Package / Case

  • 4-SIP, GBU
  • 4-SIP, GSIB-5S
  • 4-SMD, Gull Wing
  • Chip, Concave Terminals
  • TO-269AA, 4-BESOP

Packaging

  • Tape & Reel (TR)
  • Tube

Part Status

  • Active

Pbfree Code

  • no
  • yes

Prop. Delay@Nom-Sup

  • 0.27 ns

Published

  • 2006
  • 2010
  • 2011
  • 2013
  • 2014
  • 2017

Supplier Device Package

  • 4-SOIC

Surface Mount

  • YES

Terminal Finish

  • Matte Tin (Sn)
  • Tin (Sn)

Termination

  • SMD/SMT
  • Through Hole

Tolerance

  • 10%
  • 20%
  • 5%

Weight

  • 228mg
  • 270mg
  • 299.00242mg
  • 3.404012g
  • 484mg
Reset
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Packaging Published Series Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code RoHS Status Additional Feature Package / Case Mounting Type Operating Temperature Technology HTS Code JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Time@Peak Reflow Temperature-Max (s) Surface Mount JESD-30 Code Operating Temperature (Max) Operating Temperature (Min) Reference Standard Diode Element Material Number of Elements Configuration Diode Type Output Current-Max Number of Phases Rep Pk Reverse Voltage-Max Non-rep Pk Forward Current-Max Case Connection Breakdown Voltage-Min Supplier Device Package Current - Reverse Leakage @ Vr Voltage - Forward (Vf) (Max) @ If Current - Average Rectified (Io) Voltage - Peak Reverse (Max)
    GBU1002HD2G GBU1002HD2G Taiwan Semiconductor Corporation 0.0000
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