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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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Items : %s%s

Bridge Rectifiers

Contact Plating

  • Tin

Diode Element Material

  • SILICON

ECCN Code

  • EAR99

Factory Lead Time

  • 10 Weeks
  • 12 Weeks
  • 13 Weeks
  • 18 Weeks
  • 8 Weeks
  • 9 Weeks

fmax-Min

  • 6000 MHz

JESD-609 Code

  • e3

Lifecycle Status

  • ACTIVE (Last Updated: 1 day ago)
  • ACTIVE (Last Updated: 19 hours ago)
  • ACTIVE (Last Updated: 2 days ago)
  • ACTIVE (Last Updated: 4 days ago)
  • ACTIVE (Last Updated: 4 hours ago)

Manufacturer Package Identifier

  • MiniDIP

Moisture Sensitivity Level (MSL)

  • 1 (Unlimited)

Mount

  • Surface Mount
  • Surface Mount, Through Hole
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 4

Number of Terminations

  • 4

Operating Temperature

  • -55°C~125°C TJ
  • -55°C~150°C TJ
  • -65°C~150°C TJ

Package / Case

  • 4-SIP, GBU
  • 4-SIP, GSIB-5S
  • 4-SMD, Gull Wing
  • Chip, Concave Terminals
  • TO-269AA, 4-BESOP

Packaging

  • Tape & Reel (TR)
  • Tube

Part Status

  • Active

Pbfree Code

  • no
  • yes

Prop. Delay@Nom-Sup

  • 0.27 ns

Published

  • 2006
  • 2010
  • 2011
  • 2013
  • 2014
  • 2017

Supplier Device Package

  • 4-SOIC

Surface Mount

  • YES

Terminal Finish

  • Matte Tin (Sn)
  • Tin (Sn)

Termination

  • SMD/SMT
  • Through Hole

Tolerance

  • 10%
  • 20%
  • 5%

Weight

  • 228mg
  • 270mg
  • 299.00242mg
  • 3.404012g
  • 484mg
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Packaging Published Series Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code RoHS Status Additional Feature Package / Case Mounting Type Operating Temperature Technology HTS Code JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Time@Peak Reflow Temperature-Max (s) Surface Mount JESD-30 Code Subcategory Diode Element Material Number of Elements Configuration Diode Type Output Current-Max Number of Phases Non-rep Pk Forward Current-Max Case Connection Breakdown Voltage-Min Supplier Device Package Current - Reverse Leakage @ Vr Voltage - Forward (Vf) (Max) @ If Current - Average Rectified (Io) Voltage - Peak Reverse (Max)
    HDBLS107G C1G HDBLS107G C1G Taiwan Semiconductor Corporation 0.0000
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    		 0.00000000 download 23 Weeks Tube 2015 Automotive, AEC-Q101 Active 1 (Unlimited) ROHS3 Compliant 4-SIP, TS-6P Through Hole -55°C~150°C TJ Standard Single Phase TS-6P 10μA @ 400V 1.1V @ 6A 6A 400V
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    		 0.00000000 download 8 Weeks Tube 2015 Automotive, AEC-Q101 Active 1 (Unlimited) ROHS3 Compliant 4-DIP (0.300, 7.62mm) Through Hole -55°C~150°C TJ Standard Single Phase DBL 2μA @ 1400V 1.25V @ 1.5A 1.5A 1.4kV
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    		 0.00000000 download 10 Weeks Tube 2015 Active 1 (Unlimited) ROHS3 Compliant 4-SIP, TS-6P Through Hole -55°C~125°C TJ Standard Single Phase TS-6P 10μA @ 600V 1.1V @ 15A 15A 600V
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    		 0.00000000 download 6 Weeks Tube 2017 Active 1 (Unlimited) 4 EAR99 ROHS3 Compliant 4-ESIP Through Hole -55°C~150°C TJ Standard e3 Matte Tin (Sn) NOT SPECIFIED NOT SPECIFIED NO R-PSFM-T4 SILICON 4 BRIDGE, 4 ELEMENTS Single Phase 2A 1 135A ISOLATED 1000V 10μA @ 1000V 1V @ 4A 4A 1kV
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    		 0.00000000 download Obsolete 1 (Unlimited) 4 EAR99 ROHS3 Compliant 4-SIP, KBPF Through Hole -55°C~150°C TJ Standard e3 Matte Tin (Sn) 260 30 NO R-PSIP-T4 SILICON 4 BRIDGE, 4 ELEMENTS Single Phase 2A 1 60A 400V 5μA @ 400V 1.1V @ 2A 2A 400V
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