Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "W29GL128CL9C TR") |
W29GL128CL9C TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 56-TFBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 8M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 90ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS45S16320F-6TLA1 | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tube | Active | 3 (168 Hours) | 54 | EAR99 | 1 | 22.22mm | ROHS3 Compliant | 54 | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 1 | DUAL | 3.3V | YES | 0.8mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 5.4ns | AEC-Q100 | 512Mb 32M x 16 | Volatile | 0.18mA | 3V~3.6V | 32MX16 | 16 | 536870912 bit | 167MHz | 0.004A | COMMON | 8192 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F256G08CKCABH2-10:A TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 100-TBGA | Surface Mount | 0°C~70°C TA | FLASH - NAND | 100-TBGA (12x18) | 256Gb 32G x 8 | Non-Volatile | 2.7V~3.6V | 100MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
TH58NVG4S0HTA20 | Toshiba America Electronic Components | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | icon-pbfree yes | unknown | FLASH | 3.3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IS43R86400D-5B | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Last Time Buy | 3 (168 Hours) | 60 | EAR99 | 1 | 13mm | AUTO/SELF REFRESH | 60-TFBGA | 8mm | Surface Mount | 0°C~70°C TA | SDRAM - DDR | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | 2.6V | YES | 0.8mm | R-PBGA-B60 | 2.5V | 2.7V | 700ps | 512M 64M x 8 | Volatile | 2.5V~2.7V | 64MX8 | 8 | 536870912 bit | 200MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS43TR16128C-107MBLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | 96 | EAR99 | 1 | 13mm | ROHS3 Compliant | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 96-TFBGA | 9mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | SYNCHRONOUS | 1.2mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.5V | 10 | YES | 0.8mm | R-PBGA-B96 | 1.425V | 1.575V | 195ps | 2Gb 128M x 16 | Volatile | 1.425V~1.575V | 128MX16 | 16 | 2147483648 bit | 933MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1312CV18-250BZC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2003 | Obsolete | 3 (168 Hours) | 165 | 1.8V | 2 | 15mm | Non-RoHS Compliant | Contains Lead | 165 | PIPELINED ARCHITECTURE | 165-LBGA | not_compliant | 18 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 1.4mm | 1 | 800mA | e0 | Tin/Lead (Sn/Pb) | BOTTOM | 220 | 1.8V | NOT SPECIFIED | CY7C1312 | 165 | 1mm | 1.7V | Not Qualified | 1.9V | 3-STATE | 450 ps | 18Mb 1M x 18 | Volatile | 19b | 1.7V~1.9V | 1MX18 | 18 | Synchronous | 250MHz | 0.4A | 18b | SEPARATE | 1.7V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q32DWZPIG TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2014 | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 8-WSON (6x5) | 32Mb 4M x 8 | Non-Volatile | 1.7V~1.95V | 104MHz | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61NLP25618A-200TQLI | ISSI, Integrated Silicon Solution Inc | 16.6212 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tray | yes | Active | 2 (1 Year) | 100 | 3.3V | 2 | ROHS3 Compliant | No | 100 | PIPELINED ARCHITECTURE | 100-LQFP | 4 Mb | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 1.6mm | 1 | 210mA | e3 | Matte Tin (Sn) - annealed | QUAD | 260 | 3.3V | 40 | 100 | YES | 0.65mm | 3.135V | 3.465V | 3-STATE | 3.1ns | 4.5Mb 256K x 18 | Volatile | 18b | 3.135V~3.465V | 18 | Synchronous | 200MHz | 0.035A | 18b | COMMON | 3.14V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q257FVFIG | Winbond Electronics | 9.2440 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tube | SpiFlash® | Obsolete | 3 (168 Hours) | 16 | 10.31mm | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | 7.49mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.64mm | 1 | DUAL | 3V | YES | 1.27mm | R-PDSO-G16 | 2.7V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 256MX1 | 1 | 268435456 bit | SERIAL | 104MHz | 3V | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR95020-WDW6TP | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2005 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | e3/e2 | TIN/TIN COPPER | DUAL | 260 | 10 | BR95020 | 8 | YES | 0.65mm | R-PDSO-G8 | Not Qualified | 70 ns | 2Kb 256 x 8 | Non-Volatile | 0.002mA | 2.5V~5.5V | 2KX1 | 1 | 2048 bit | 5MHz | 0.000001A | 40 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL512N11FFA023 | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Automotive, AEC-Q100, GL-N | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 64-LBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64-FBGA (13x11) | 110ns | 512Mb 64M x 8 32M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 110ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M28W640HST70ZA6F | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | 2016 | Obsolete | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 64 | 64-VFBGA | Parallel | Surface Mount | -40°C~85°C TA | FLASH - NOR | M28W640 | 64-TFBGA (10.5x6.39) | 70ns | 64Mb 4M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
HTEE25608D | Honeywell Aerospace | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 19 Weeks | Tube | 2013 | Active | 1 (Unlimited) | 56 | 38.1mm | RoHS Compliant | 56 | 56-BCPGA | Parallel, Serial | 19.05mm | Through Hole | -55°C~225°C TA | CMOS | SYNCHRONOUS | 6.8mm | 1 | PERPENDICULAR | 5V | NO | 2.54mm | 4.75V | 5.25V | 150ns | 256Kb 32K x 8 | Non-Volatile | 4.75V~5.25V | 32KX8 | 8 | 262144 bit | 5MHz | 5V | EEPROM | Parallel, SPI | 90ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71P71804S200BQG | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 165-TBGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, DDR II | IDT71P71 | 165-CABGA (13x15) | 7.88ns | 18Mb 1M x 18 | Volatile | 1.7V~1.9V | 200MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61WV102416ALL-20MLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | Active | 3 (168 Hours) | 48 | 1.8V | 1 | ROHS3 Compliant | 48 | 48-TFBGA | 16 Mb | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1 | BOTTOM | NOT SPECIFIED | NOT SPECIFIED | YES | 0.75mm | 2.2V | 16Mb 1M x 16 | Volatile | 20b | 1.65V~2.2V | 16 | 20 ns | SRAM | Parallel | 20ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS7C32096A-10TIN | Alliance Memory, Inc. | 5.4469 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | 2001 | Active | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 44 | 44-TSOP (0.400, 10.16mm Width) | Parallel | 3.6V | 3V | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 44-TSOP2 | 10ns | 2Mb 256K x 8 | Volatile | 3V~3.6V | SRAM | Parallel | 10ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS25LQ040B-JKLE-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 8 | 6mm | ROHS3 Compliant | 8-WDFN Exposed Pad | SPI, Serial | 5mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-N8 | 2.3V | 3.6V | 4Mb 512K x 8 | Non-Volatile | 2.3V~3.6V | 4MX1 | 1 | 4194304 bit | 104MHz | 3V | FLASH | SPI - Quad I/O | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT29F4G01ABBFDM70A3WC1 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Bulk | Active | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR93G66FVT-3GE2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Cut Tape (CT) | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | ALSO OPERATES AT 1.7V WITH 1MHZ AND 2.5V AT 2MHZ | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.2mm | 1 | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 0.65mm | R-PDSO-G8 | 4.5V | 5.5V | 4Kb 256 x 16 | Non-Volatile | 1.7V~5.5V | 256X16 | 16 | 4096 bit | SERIAL | 3MHz | 8 | 5ms | 3-WIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3557S80PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | FLOW-THROUGH ARCHITECHTURE | TQFP | Parallel | 3.465V | 3.135V | 4.5 Mb | 95MHz | 14mm | 1.4mm | CMOS | 1 | 250mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 8 ns | 100MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.04A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S16800F-6B-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 54-TFBGA | Surface Mount | 0°C~70°C TA | SDRAM | 5.4ns | 128Mb 8M x 16 | Volatile | 3V~3.6V | 166MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42VS16100C1-10TLI-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 2 (1 Year) | 85°C | -40°C | RoHS Compliant | 50 | 50-TSOP (0.400, 10.16mm Width) | Parallel | 1.9V | 1.7V | 100MHz | Surface Mount | -40°C~85°C TA | SDRAM | 100MHz | 50-TSOP II | 7ns | 16Mb 1M x 16 | Volatile | 1.7V~1.9V | 16b | 100MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
GD5F1GQ4UFYIGY | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NAND | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | 700μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S32800J-7BL | ISSI, Integrated Silicon Solution Inc | 5.4834 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | Active | 3 (168 Hours) | 90 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 90-TFBGA | 8mm | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 0.8mm | R-PBGA-B90 | 3V | 3.6V | 5.4ns | 256Mb 8M x 32 | Volatile | 3V~3.6V | 8MX32 | 32 | 268435456 bit | 143MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR93L66RFVJ-WE2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 3mm | ROHS3 Compliant | Lead Free | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | Serial | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.05mm | 8542.32.00.51 | 1 | e2 | TIN COPPER | DUAL | 260 | 2.5V | 10 | BR93L66 | 8 | YES | 0.65mm | S-PDSO-G8 | 1.8V | Not Qualified | 4Kb 256 x 16 | Non-Volatile | 0.0015mA | 1.8V~5.5V | 256X16 | 16 | 4096 bit | 2MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | SOFTWARE | 5ms | MICROWIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL256P11FFIV10 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Surface Mount | Tray | 2012 | GL-P | Active | 3 (168 Hours) | 64 | 13mm | ROHS3 Compliant | No | 64 | 64-LBGA | No SVHC | 256 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.4mm | 8542.32.00.51 | 1 | 110mA | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | 260 | 3V | 40 | 1mm | 2.7V | 1.8/3.33/3.3V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 1.65V~3.6V | 256MX1 | 1 | Asynchronous | 8b | 0.000005A | 110 ns | 8 | 3V | YES | YES | YES | 256 | 8/16words | YES | YES | FLASH | Parallel | 110ns | 128K | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71024S12YI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2010 | 3 (168 Hours) | 32 | 3A991.B.2.B | 85°C | -40°C | 20.955mm | Non-RoHS Compliant | 32 | Parallel | not_compliant | 10.16mm | CMOS | 3.683mm | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 5V | 30 | 32 | INDUSTRIAL | YES | 1.27mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.16mA | 128KX8 | 8 | 1048576 bit | 0.01A | 12 ns | COMMON | 4.5V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70261L15PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel | 2005 | yes | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | SEMAPHORE | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 30 | 100 | COMMERCIAL | YES | 0.5mm | SRAMs | 5V | 3-STATE | 15 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | 0.005A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IS43TR16128C-125KBL | ISSI, Integrated Silicon Solution Inc | 6.7305 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Tray | Active | 3 (168 Hours) | 96 | EAR99 | 1 | 13mm | ROHS3 Compliant | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 96-TFBGA | 9mm | Surface Mount | 0°C~95°C TC | SDRAM - DDR3 | SYNCHRONOUS | 1.2mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.5V | 10 | YES | 0.8mm | R-PBGA-B96 | 1.425V | 1.575V | 20ns | 2Gb 128M x 16 | Volatile | 1.425V~1.575V | 128MX16 | 16 | 2147483648 bit | 800MHz | DRAM | Parallel | 15ns |
-
-
IS45S16320F-6TLA1 ISSI, Integrated Silicon Solution Inc
3.3V V Memory IC 22.22mm mm
Price: 0.0000
RFQ -
-
-
-
-
CY7C1312CV18-250BZC Cypress Semiconductor Corp
Surface Mount 165 Pin Memory IC CY7C1312 18 Mb kb 15mm mm 800mA mA 18b b
Price: 0.0000
RFQ -
-
IS61NLP25618A-200TQLI ISSI, Integrated Silicon Solution Inc
100 Pin Memory IC 4 Mb kb 210mA mA 18b b
Price: 16.6212
RFQ -
-
-
S29GL512N11FFA023 Rochester Electronics, LLC
Automotive, AEC-Q100, GL-N Memory IC Automotive, AEC-Q100, GL-N Series
Price: 0.0000
RFQ -
-
-
-
-
-
-
-
-
71V3557S80PFG Integrated Device Technology (IDT)
Surface Mount 100 Pin Memory IC 4.5 Mb kb 20mm mm 250mA mA 36b b
Price: 0.0000
RFQ -
-
-
-
-
-
S29GL256P11FFIV10 Cypress Semiconductor Corp
1.8/3.33/3.3V V Surface Mount GL-P Memory IC GL-P Series 256 Mb kb 13mm mm 110mA mA
Price: 0.0000
RFQ -
IDT71024S12YI8 Integrated Device Technology (IDT)
5V V 32 Pin Memory IC 20.955mm mm
Price: 0.0000
RFQ -
70261L15PFG8 Integrated Device Technology (IDT)
5V V 100 Pin Memory IC 256 kb kb 14mm mm
Price: 0.0000
RFQ -
Need Help?
