Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Page Size | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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BR93H56RF-WCE2 | ROHM Semiconductor | 0.6832 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Cut Tape (CT) | 2013 | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | 5mm | ROHS3 Compliant | 8-SOIC (0.173, 4.40mm Width) | 4.4mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.71mm | 1 | DUAL | NOT SPECIFIED | 4V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 2.7V | Not Qualified | 2/5V | 5.5V | 2Kb 128 x 16 | Non-Volatile | 0.0015mA | 2.7V~5.5V | 128X16 | 16 | 2048 bit | SERIAL | 1.25MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | SOFTWARE | 10ms | 3-WIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
FT24C512A-UTR-T | Fremont Micro Devices Ltd | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Cut Tape (CT) | 2010 | Discontinued | 1 (Unlimited) | 85°C | -40°C | ROHS3 Compliant | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 1MHz | Surface Mount | -40°C~85°C | EEPROM | 8-TSSOP | 900ns | 512Kb 64K x 8 | Non-Volatile | 1.8V~5.5V | 1MHz | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93AA66AT-I/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 2011 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 3mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | Serial | 4 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.1mm | 1 | 2mA | e3 | DUAL | 260 | 2.5V | 40 | 93AA66A | 8 | 0.65mm | 2/5V | 5.5V | 250 ns | 4Kb 512 x 8 | Non-Volatile | 1.8V~5.5V | 8 | 2MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 6ms | MICROWIRE | EEPROM | SPI | 6ms | |||||||||||||||||||||||||||||||||||||||||||||||
.png "S29GL01GT11DHB020") |
S29GL01GT11DHB020 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | Active | 3 (168 Hours) | 64 | 9mm | ROHS3 Compliant | CAN ALSO ORGANISED AS 1GX1 | 9mm | CMOS | ASYNCHRONOUS | 1.4mm | 8542.32.00.51 | 1 | BOTTOM | BALL | NOT SPECIFIED | 3V | NOT SPECIFIED | INDUSTRIAL | YES | 1mm | S-PBGA-B64 | 2.7V | 105°C | -40°C | 3.6V | AEC-Q100 | 64MX16 | 16 | 1073741824 bit | FLASH | PARALLEL | 110 ns | 2.7V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL01GS11FHSS20 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tray | 2017 | GL-S | Active | 3 (168 Hours) | ROHS3 Compliant | 64 | 64-LBGA | Surface Mount | 0°C~85°C TA | FLASH - NOR | 110ns | 1Gb 64M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 60ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C14121KV18-300BZXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2003 | Obsolete | 3 (168 Hours) | 165 | 1.8V | 1 | ROHS3 Compliant | 165 | 165-LBGA | unknown | 36 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 1 | 750mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 20 | CY7C14121 | 165 | Not Qualified | 3-STATE | 450 ps | 36Mb 2M x 18 | Volatile | 20b | 1.7V~1.9V | 18 | Synchronous | 300MHz | 0.28A | 18b | SEPARATE | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M45PE10S-VMN6P | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 2007 | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | 3.3V | 4.9mm | ROHS3 Compliant | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 1 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.75mm | 1 | 12mA | DUAL | M45PE10 | 8 | 1.27mm | 2.7V | 8 ns | 1Mb 128K x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 75MHz | 8b | 23ms | 256B | FLASH | SPI | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70914S20PF | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 80-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | IDT70914 | 80-TQFP (14x14) | 20ns | 36Kb 4K x 9 | Volatile | 4.5V~5.5V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C0852V-133AXI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2003 | Obsolete | 3 (168 Hours) | 176 | 3A991.B.2.A | 24mm | ROHS3 Compliant | Lead Free | PIPELINED ARCHITECTURE | 176-LQFP | 24mm | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Synchronous | 1.6mm | 8542.32.00.41 | 1 | QUAD | 3.3V | CY7C0852 | 176 | YES | 0.5mm | S-PQFP-G176 | 3.135V | Not Qualified | 3.465V | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 128KX36 | 36 | 4718592 bit | 133MHz | 4.4 ns | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71256L20Y | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2005 | no | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 1 | 17.9324mm | Non-RoHS Compliant | 28 | Parallel | not_compliant | 7.5184mm | CMOS | 3.556mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 5V | 30 | 28 | COMMERCIAL | YES | 1.27mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.135mA | 32KX8 | 8 | 262144 bit | 0.00012A | 20 ns | YES | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY14V101LA-BA45XIT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | Active | 3 (168 Hours) | 48 | EAR99 | 3.3V | 10mm | ROHS3 Compliant | Lead Free | 48 | 48-TFBGA | 1 Mb | Surface Mount | -40°C~85°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | 52mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3.3V | 30 | 48 | 0.75mm | 3V | SRAMs | Not Qualified | 3.6V | 1Mb 128K x 8 | Non-Volatile | 2.7V~3.6V | 128KX8 | 8 | 8b | 0.008A | 45 ns | 8b | NVSRAM | Parallel | 45ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24LC04BT-E/SN16KVAO | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | 8 | 4.9mm | 8-SOIC (0.154, 3.90mm Width) | compliant | 3.9mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.75mm | 2 | DUAL | 5V | 24LC04B | YES | 1.27mm | R-PDSO-G8 | 2.5V | 5.5V | 900ns | AEC-Q100; TS 16949 | 4Kb 512 x 8 | Non-Volatile | 2.5V~5.5V | 256X8 | 8 | 2048 bit | SERIAL | 400kHz | 5ms | I2C | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
EDF8164A3PF-JD-F-D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | FBGA | -30°C~85°C TC | SDRAM - Mobile LPDDR3 | 8Gb 128M x 64 | Volatile | 1.14V~1.95V | 933MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61QDPB42M18A-400M3I | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | 165 | 3A991.B.2.A | 17mm | Non-RoHS Compliant | 165 | 165-LBGA | 15mm | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, QUADP | 1.4mm | 8542.32.00.41 | 1 | BOTTOM | 1.8V | 165 | YES | 1mm | 1.71V | Not Qualified | 1.5/1.81.8V | 1.89V | 3-STATE | 8.4ns | 36Mb 2M x 18 | Volatile | 0.95mA | 1.71V~1.89V | 2MX18 | 18 | 37748736 bit | 400MHz | 0.32A | SEPARATE | 1.7V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
RM25C32C-BSNC-B | Adesto Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tube | 2013 | Mavriq™ | Not For New Designs | 1 (Unlimited) | 8 | 3.3V | 4.925mm | ROHS3 Compliant | Lead Free | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 32 kb | 3.9mm | Surface Mount | 0°C~70°C TA | CBRAM | SYNCHRONOUS | 1.75mm | 1 | DUAL | NOT SPECIFIED | NOT SPECIFIED | YES | 1.27mm | 2.7V | 3.6V | 6.5 ns | 32kb 32B Page Size | Non-Volatile | 2.7V~3.6V | 32KX1 | 1 | 5MHz | SPI | CBRAM® | SPI | 100μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS62WV102416ALL-35TLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | yes | Active | 3 (168 Hours) | 48 | 1.8V | 1 | ROHS3 Compliant | No | 48 | 48-TFSOP (0.724, 18.40mm Width) | 16 Mb | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1 | 30mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 1.8V | 40 | 48 | YES | 0.5mm | 2.2V | 3-STATE | 16Mb 1M x 16 | Volatile | 20b | 1.65V~2.2V | 16 | Asynchronous | 35 ns | 16b | COMMON | SRAM | Parallel | 35ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1061G-10BV1XIT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | 2012 | yes | Active | 3 (168 Hours) | 48 | 3A991.B.2.A | 8mm | ROHS3 Compliant | 48 | 48-VFBGA | 6mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1mm | 8542.32.00.41 | 1 | BOTTOM | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 0.75mm | 4.5V | 5.5V | 16Mb 1M x 16 | Volatile | 4.5V~5.5V | 1MX16 | 16 | 16777216 bit | 10 ns | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q128FVEIF TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | SpiFlash® | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S16800E-6BLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | yes | Obsolete | 3 (168 Hours) | 54 | EAR99 | 3.3V | 1 | 8mm | RoHS Compliant | No | 54 | AUTO/SELF REFRESH | 54-TFBGA | 128 Mb | Surface Mount | -40°C~85°C TA | SDRAM | 1.2mm | 1 | 150mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3.3V | 10 | 54 | 0.8mm | 3V | 3.6V | 3-STATE | 5.4ns | 128Mb 8M x 16 | Volatile | 14b | 3V~3.6V | 8MX16 | 16 | 16b | 166MHz | 0.002A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
PN28F128M29EWHA | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2015 | Obsolete | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | Parallel | -40°C~85°C TA | FLASH - NOR | PN28F128M29 | 60ns | 128Mb 16M x 8 8M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 60ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3557SA85BQI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 85°C | -40°C | Non-RoHS Compliant | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C64M8D3L-12BCN | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | 2017 | Active | 3 (168 Hours) | 78 | 1 | 10.5mm | ROHS3 Compliant | AUTO/SELF REFRESH | 78-VFBGA | 8mm | Surface Mount | 0°C~95°C TA | SDRAM - DDR3 | SYNCHRONOUS | 1mm | 1 | BOTTOM | NOT SPECIFIED | 1.35V | NOT SPECIFIED | YES | 0.8mm | R-PBGA-B78 | 1.283V | 1.45V | 20ns | 512Mb 64M x 8 | Volatile | 1.283V~1.45V | 64MX8 | 8 | 536870912 bit | 800MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1480BV33-200BZXI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2004 | yes | Obsolete | 3 (168 Hours) | 3.3V | 4 | ROHS3 Compliant | Lead Free | 165 | 165-LBGA | unknown | 72 Mb | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 500mA | CY7C1480 | 3ns | 72Mb 2M x 36 | Volatile | 21b | 3.135V~3.6V | Synchronous | 200MHz | 36b | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
AT24C08-10TI-2.7 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 8-TSSOP (0.173, 4.40mm Width) | Surface Mount | -40°C~85°C TA | EEPROM | AT24C08 | 8-TSSOP | 900ns | 8Kb 1K x 8 | Non-Volatile | 2.7V~5.5V | 400kHz | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S32160A-75BL | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | yes | Obsolete | 3 (168 Hours) | 90 | EAR99 | 3.3V | 1 | 13mm | RoHS Compliant | 90 | AUTO/SELF REFRESH | 90-LFBGA | 512 Mb | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 1.45mm | 8542.32.00.28 | 1 | 185mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3.3V | 40 | 90 | 0.8mm | 3V | Not Qualified | 3.6V | 3-STATE | 6ns | 512Mb 16M x 32 | Volatile | 15b | 3V~3.6V | 16MX32 | 32 | 32b | 133MHz | 0.0024A | COMMON | 8192 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||
 |
71342LA25J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 32 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 25 ns | 4kB | RAM, SDR, SRAM | 24b | 4KX8 | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT70T633S12DD | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 4 (72 Hours) | 144 | 3A991.B.2.A | 70°C | 0°C | 2 | 20mm | Non-RoHS Compliant | TQFP | Parallel | not_compliant | 20mm | CMOS | ASYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 2.5V | 30 | 144 | COMMERCIAL | YES | 0.5mm | S-PQFP-G144 | 2.4V | SRAMs | Not Qualified | 2.52.5/3.3V | 2.6V | 3-STATE | RAM, SRAM | 0.355mA | 512KX18 | 18 | 9437184 bit | 0.01A | 12 ns | COMMON | 2.4V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71024S15TYI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2010 | no | 3 (168 Hours) | 32 | 3A991.B.2.B | 85°C | -40°C | 20.96mm | Non-RoHS Compliant | 32 | Parallel | not_compliant | 7.62mm | CMOS | 3.759mm | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 5V | 20 | 32 | INDUSTRIAL | YES | 1.27mm | SRAMs | Not Qualified | 5V | 5V | 3-STATE | RAM, SRAM - Asynchronous | 0.155mA | 128KX8 | 8 | 1048576 bit | 0.01A | 15 ns | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75802S166BGGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel | 2012 | yes | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 2.5V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 18 Mb | 166MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 119 | INDUSTRIAL | YES | 2.375V | SRAMs | 2.625V | 3-STATE | RAM, SRAM | 20b | 0.265mA | 0.06A | 3.5 ns | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||||||||||||||||||
|
AT25256B-XHL-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 15 Weeks | Surface Mount | Tape & Reel (TR) | 1997 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | Lead Free | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 256 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 1 | 10mA | DUAL | 2.5V | AT25256 | 0.65mm | 5.5V | 80 ns | 256Kb 32K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 20MHz | 5ms | SPI | EEPROM | SPI | 5ms |
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