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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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Configuration Proms for FPGAs

Additional Feature

  • 4 WIRE INTERFACE TO FLEX 8000 DEVICES
  • ALSO OPERATES AT 5V SUPPLY
  • IT CAN ALSO OPERATE AT 5V SUPPLY
  • IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
  • IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
  • USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.B.1.A
  • 3A991.B.1
  • 3A991.B.1.A
  • 3A991.B.1.B.1
  • 3A991.B.2.A
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 25 Weeks
  • 30 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks

HTS Code

  • 8542.32.00.51
  • 8542.32.00.61
  • 8542.32.00.71
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e4

Manufacturer Package Identifier

  • XCF02SVOG20C

Max Operating Temperature

  • 125°C
  • 70°C
  • 85°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • Not Applicable

Mount

  • Surface Mount
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Number of Terminals

  • 100

Number of Terminations

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Operating Temperature

  • -40°C~85°C
  • 0°C~70°C

Package / Case

  • 100-BQFP
  • 16-SOIC (0.295, 7.50mm Width)
  • 20-LCC (J-Lead)
  • 20-SOIC (0.295, 7.50mm Width)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 24-LBGA
  • 24-TBGA
  • 32-TQFP
  • 44-LCC (J-Lead)
  • 44-TQFP
  • 48-TFBGA, CSPBGA
  • 48-TFSOP (0.724, 18.40mm Width)
  • 64-TBGA
  • 8-DIP (0.300, 7.62mm)
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-TDFN
  • 88-LFBGA
  • FBGA
  • PDIP
  • PLCC
  • PQFP
  • SOIC

Packaging

  • Bulk
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Obsolete

Pbfree Code

  • no
  • yes

Published

  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2010
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • EPC
  • EPCQ
  • EPCQ-A
  • EPCQ-L
  • EPCS
  • EPCV

Subcategory

  • Flash Memories
  • OTP ROMs

Supplier Device Package

  • 100-PQFP (20x14)
  • 16-SOIC
  • 20-PLCC (9x9)
  • 20-SOIC
  • 20-TSSOP
  • 32-TQFP (7x7)
  • 44-PLCC (16.6x16.6)
  • 44-TQFP (10x10)
  • 8-LAP
  • 8-LAP (6x6)
  • 8-PDIP
  • 8-SOIC
  • 8-TSOP
  • 88-UBGA (11x8)

Surface Mount

  • NO
  • YES

Technology

  • CMOS
  • MOS

Terminal Finish

  • MATTE TIN
  • MATTE TIN (472) OVER COPPER
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • NICKEL (39) PALLADIUM (2) GOLD
  • NICKEL PALLADIUM GOLD
  • Nickel/Gold (Ni/Au)
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN LEAD
  • TIN SILVER COPPER
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn85Pb15)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Termination

  • SMD/SMT
  • Through Hole

Type

  • NOR TYPE

Weight

  • 1.758804g
  • 540.001716mg
  • 665.986997mg
  • 722.005655mg
  • 930.006106mg
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Max Operating Temperature Min Operating Temperature Operating Supply Voltage Length RoHS Status Lead Free Contact Plating Radiation Hardening Number of Pins Additional Feature Package / Case Interface Max Supply Voltage REACH SVHC Min Supply Voltage Density Frequency Height Width Mounting Type Weight Operating Temperature Technology Operating Supply Current Height Seated (Max) Number of Functions Nominal Supply Current JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Base Part Number Pin Count Surface Mount Terminal Pitch Supply Voltage-Min (Vsup) Subcategory Power Supplies Supply Voltage-Max (Vsup) Supplier Device Package Memory Size Memory Type Supply Current-Max Voltage - Supply Organization Memory Width Memory IC Type Parallel/Serial Clock Frequency Standby Current-Max Access Time (Max) Programmable Type Data Retention Time-Min Endurance Write Protection Write Cycle Time-Max (tWC)
    AT17F16A-30CU AT17F16A-30CU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 17 Weeks Surface Mount Tube 1997 yes Active 3 (168 Hours) 8 3.3V 5.99mm ROHS3 Compliant Lead Free Gold No 8 8-TDFN 2-Wire, Serial 16 Mb 10MHz 5.99mm Surface Mount -40°C~85°C CMOS 1.14mm 1 50mA e4 DUAL 260 3.3V 40 AT17F16A 1.27mm 2.97V 3.63V 2.97V~3.63V 16MX1 1 CONFIGURATION MEMORY FLASH 0.03ms
    AT17LV010A-10PU AT17LV010A-10PU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Through Hole Tube 1996 yes Active 1 (Unlimited) 8 9.271mm ROHS3 Compliant No 8 ALSO OPERATES AT 5V SUPPLY 8-DIP (0.300, 7.62mm) 2-Wire, Serial No SVHC 1 Mb 33MHz 7.62mm Through Hole -40°C~85°C CMOS 5.334mm 1 10mA e3 Matte Tin (Sn) - annealed DUAL 3.3V AT17LV010A 2.54mm 3V 3.3/5V 3.6V EEPROM 3V~3.6V 4.5V~5.5V 1MX1 1 Serial EEPROM HARDWARE
    AT17N512-10PI AT17N512-10PI Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1997 Obsolete 1 (Unlimited) 85°C -40°C Non-RoHS Compliant Contains Lead 8 8-DIP (0.300, 7.62mm) 3.6V 3V 10MHz Through Hole -40°C~85°C 5mA AT17N512 8-PDIP 512kb 3V~3.6V Serial EEPROM
    AT17N002-10TQC AT17N002-10TQC Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tray 1997 Obsolete 3 (168 Hours) Non-RoHS Compliant 44-TQFP Surface Mount 0°C~70°C AT17N002 44-TQFP (10x10) 2Mb 3V~3.6V Serial EEPROM
    AT17LV256-10PU AT17LV256-10PU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Through Hole Tube 1997 yes Active 1 (Unlimited) 8 10.16mm ROHS3 Compliant Lead Free No 8 IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO 8-DIP (0.300, 7.62mm) 2-Wire No SVHC 256 kb 12.5MHz 5.334mm 7.11mm Through Hole 930.006106mg -40°C~85°C CMOS 10mA 1 10mA e3 Matte Tin (Sn) - annealed DUAL 3.3V AT17LV256 2.54mm 3V 3.3V 3.6V 256Kb EEPROM 3V~3.6V 4.5V~5.5V 256KX1 0.00015A Serial EEPROM 90 100000 Write/Erase Cycles HARDWARE
    XC18V512SOG20C XC18V512SOG20C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 10 Weeks Tray 1999 yes Active 3 (168 Hours) 20 EAR99 3.3V 12.827mm ROHS3 Compliant No 20 20-SOIC (0.295, 7.50mm Width) 512 kb 7.5184mm Surface Mount 0°C~70°C CMOS 2.6416mm 1 e3 Matte Tin (Sn) DUAL GULL WING 260 3.3V 30 XC18V512 20 YES 1.27mm 3V Flash Memories 3.6V 0.025mA 3V~3.6V 64KX8 8 CONFIGURATION MEMORY PARALLEL/SERIAL 33MHz 0.01A 15 ns In System Programmable 20
    XCF02SVO20C XCF02SVO20C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 10 Weeks Surface Mount Tube 1999 no Active 3 (168 Hours) 20 EAR99 3.3V 6.5024mm Non-RoHS Compliant Contains Lead Lead, Tin No 20 20-TSSOP (0.173, 4.40mm Width) 4.4mm Surface Mount -40°C~85°C CMOS 1.19mm 1 e0 Tin/Lead (Sn85Pb15) DUAL GULL WING 225 3.3V 30 XCF*S 20 0.65mm 3V Flash Memories 3.6V 2Mb 0.01mA 3V~3.6V 2MX1 1 CONFIGURATION MEMORY SERIAL 0.001A In System Programmable 20
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