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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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Configuration Proms for FPGAs

Additional Feature

  • 4 WIRE INTERFACE TO FLEX 8000 DEVICES
  • ALSO OPERATES AT 5V SUPPLY
  • IT CAN ALSO OPERATE AT 5V SUPPLY
  • IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
  • IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
  • USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.B.1.A
  • 3A991.B.1
  • 3A991.B.1.A
  • 3A991.B.1.B.1
  • 3A991.B.2.A
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 25 Weeks
  • 30 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks

HTS Code

  • 8542.32.00.51
  • 8542.32.00.61
  • 8542.32.00.71
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e4

Manufacturer Package Identifier

  • XCF02SVOG20C

Max Operating Temperature

  • 125°C
  • 70°C
  • 85°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • Not Applicable

Mount

  • Surface Mount
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Number of Terminals

  • 100

Number of Terminations

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Operating Temperature

  • -40°C~85°C
  • 0°C~70°C

Package / Case

  • 100-BQFP
  • 16-SOIC (0.295, 7.50mm Width)
  • 20-LCC (J-Lead)
  • 20-SOIC (0.295, 7.50mm Width)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 24-LBGA
  • 24-TBGA
  • 32-TQFP
  • 44-LCC (J-Lead)
  • 44-TQFP
  • 48-TFBGA, CSPBGA
  • 48-TFSOP (0.724, 18.40mm Width)
  • 64-TBGA
  • 8-DIP (0.300, 7.62mm)
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-TDFN
  • 88-LFBGA
  • FBGA
  • PDIP
  • PLCC
  • PQFP
  • SOIC

Packaging

  • Bulk
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Obsolete

Pbfree Code

  • no
  • yes

Published

  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2010
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • EPC
  • EPCQ
  • EPCQ-A
  • EPCQ-L
  • EPCS
  • EPCV

Subcategory

  • Flash Memories
  • OTP ROMs

Supplier Device Package

  • 100-PQFP (20x14)
  • 16-SOIC
  • 20-PLCC (9x9)
  • 20-SOIC
  • 20-TSSOP
  • 32-TQFP (7x7)
  • 44-PLCC (16.6x16.6)
  • 44-TQFP (10x10)
  • 8-LAP
  • 8-LAP (6x6)
  • 8-PDIP
  • 8-SOIC
  • 8-TSOP
  • 88-UBGA (11x8)

Surface Mount

  • NO
  • YES

Technology

  • CMOS
  • MOS

Terminal Finish

  • MATTE TIN
  • MATTE TIN (472) OVER COPPER
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • NICKEL (39) PALLADIUM (2) GOLD
  • NICKEL PALLADIUM GOLD
  • Nickel/Gold (Ni/Au)
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN LEAD
  • TIN SILVER COPPER
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn85Pb15)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Termination

  • SMD/SMT
  • Through Hole

Type

  • NOR TYPE

Weight

  • 1.758804g
  • 540.001716mg
  • 665.986997mg
  • 722.005655mg
  • 930.006106mg
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Operating Supply Voltage Length RoHS Status Lead Free Contact Plating Radiation Hardening Number of Pins Additional Feature Package / Case Interface REACH SVHC Density Frequency Height Width Mounting Type Weight Operating Temperature Technology Operating Supply Current Height Seated (Max) Number of Functions Nominal Supply Current JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Base Part Number Pin Count Surface Mount Terminal Pitch Supply Voltage-Min (Vsup) Subcategory Power Supplies Supply Voltage-Max (Vsup) Voltage Supplier Device Package Output Characteristics Memory Size Memory Type Supply Current-Max Voltage - Supply Organization Memory Width Memory IC Type Parallel/Serial Clock Frequency Standby Current-Max Access Time (Max) Programmable Type Data Retention Time-Min Endurance Write Protection Write Cycle Time-Max (tWC) I/O Type
    XC17S30APD8I XC17S30APD8I Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1999 no Obsolete Not Applicable 8 EAR99 3.3V 9.3599mm Non-RoHS Compliant Contains Lead No 8 8-DIP (0.300, 7.62mm) 512 kb 7.62mm Through Hole -40°C~85°C CMOS 4.5974mm 1 e0 DUAL 225 3.3V 30 XC17S30 8 NO 2.54mm 3V 3.6V 3-STATE 300kb 0.005mA 3V~3.6V 1 CONFIGURATION MEMORY SERIAL 0.00005A OTP COMMON
    AT17LV010-10JU AT17LV010-10JU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Surface Mount Tube 1997 yes Active 2 (1 Year) 20 5V 9.04mm ROHS3 Compliant Lead Free Tin No 20 IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO 20-LCC (J-Lead) 2-Wire, Serial No SVHC 1 Mb 10MHz 3.68mm 9.04mm Surface Mount 722.005655mg -40°C~85°C CMOS 10mA 1 10mA e3 QUAD J BEND 3.3V AT17LV010 1.27mm 5V EEPROM 3V~3.6V 1MX1 0.0002A Serial EEPROM 90 100000 Write/Erase Cycles HARDWARE
    XC18V01SO20C XC18V01SO20C Xilinx Inc. 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 10 Weeks Tube 1998 no Active 1 (Unlimited) 20 EAR99 3.3V 12.827mm Non-RoHS Compliant Contains Lead No 20 20-SOIC (0.295, 7.50mm Width) 1 Mb 7.5184mm Surface Mount 0°C~70°C CMOS 2.6416mm 1 e0 Tin/Lead (Sn85Pb15) DUAL GULL WING 225 3.3V 30 XC18V01 20 YES 1.27mm 3V Flash Memories 3.6V 0.025mA 3V~3.6V 128KX8 8 CONFIGURATION MEMORY PARALLEL/SERIAL 33MHz 0.01A 15 ns In System Programmable 20
    AT17LV512-10JC AT17LV512-10JC Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1997 Obsolete 2 (1 Year) Non-RoHS Compliant 20-LCC (J-Lead) Surface Mount 0°C~70°C AT17LV512 20-PLCC (9x9) 512kb 3V~3.6V 4.75V~5.25V Serial EEPROM
    XQ17V16-DIE0628 XQ17V16-DIE0628 Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 Non-RoHS Compliant
    AT17F16A-30CU AT17F16A-30CU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 17 Weeks Surface Mount Tube 1997 yes Active 3 (168 Hours) 8 3.3V 5.99mm ROHS3 Compliant Lead Free Gold No 8 8-TDFN 2-Wire, Serial 16 Mb 10MHz 5.99mm Surface Mount -40°C~85°C CMOS 1.14mm 1 50mA e4 DUAL 260 3.3V 40 AT17F16A 1.27mm 2.97V 3.63V 2.97V~3.63V 16MX1 1 CONFIGURATION MEMORY FLASH 0.03ms
    AT17LV256-10PU AT17LV256-10PU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Through Hole Tube 1997 yes Active 1 (Unlimited) 8 10.16mm ROHS3 Compliant Lead Free No 8 IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO 8-DIP (0.300, 7.62mm) 2-Wire No SVHC 256 kb 12.5MHz 5.334mm 7.11mm Through Hole 930.006106mg -40°C~85°C CMOS 10mA 1 10mA e3 Matte Tin (Sn) - annealed DUAL 3.3V AT17LV256 2.54mm 3V 3.3V 3.6V 256Kb EEPROM 3V~3.6V 4.5V~5.5V 256KX1 0.00015A Serial EEPROM 90 100000 Write/Erase Cycles HARDWARE
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