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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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Configuration Proms for FPGAs

Additional Feature

  • 4 WIRE INTERFACE TO FLEX 8000 DEVICES
  • ALSO OPERATES AT 5V SUPPLY
  • IT CAN ALSO OPERATE AT 5V SUPPLY
  • IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
  • IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
  • USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.B.1.A
  • 3A991.B.1
  • 3A991.B.1.A
  • 3A991.B.1.B.1
  • 3A991.B.2.A
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 25 Weeks
  • 30 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks

HTS Code

  • 8542.32.00.51
  • 8542.32.00.61
  • 8542.32.00.71
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e4

Manufacturer Package Identifier

  • XCF02SVOG20C

Max Operating Temperature

  • 125°C
  • 70°C
  • 85°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • Not Applicable

Mount

  • Surface Mount
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Number of Terminals

  • 100

Number of Terminations

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Operating Temperature

  • -40°C~85°C
  • 0°C~70°C

Package / Case

  • 100-BQFP
  • 16-SOIC (0.295, 7.50mm Width)
  • 20-LCC (J-Lead)
  • 20-SOIC (0.295, 7.50mm Width)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 24-LBGA
  • 24-TBGA
  • 32-TQFP
  • 44-LCC (J-Lead)
  • 44-TQFP
  • 48-TFBGA, CSPBGA
  • 48-TFSOP (0.724, 18.40mm Width)
  • 64-TBGA
  • 8-DIP (0.300, 7.62mm)
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-TDFN
  • 88-LFBGA
  • FBGA
  • PDIP
  • PLCC
  • PQFP
  • SOIC

Packaging

  • Bulk
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Obsolete

Pbfree Code

  • no
  • yes

Published

  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2010
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • EPC
  • EPCQ
  • EPCQ-A
  • EPCQ-L
  • EPCS
  • EPCV

Subcategory

  • Flash Memories
  • OTP ROMs

Supplier Device Package

  • 100-PQFP (20x14)
  • 16-SOIC
  • 20-PLCC (9x9)
  • 20-SOIC
  • 20-TSSOP
  • 32-TQFP (7x7)
  • 44-PLCC (16.6x16.6)
  • 44-TQFP (10x10)
  • 8-LAP
  • 8-LAP (6x6)
  • 8-PDIP
  • 8-SOIC
  • 8-TSOP
  • 88-UBGA (11x8)

Surface Mount

  • NO
  • YES

Technology

  • CMOS
  • MOS

Terminal Finish

  • MATTE TIN
  • MATTE TIN (472) OVER COPPER
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • NICKEL (39) PALLADIUM (2) GOLD
  • NICKEL PALLADIUM GOLD
  • Nickel/Gold (Ni/Au)
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN LEAD
  • TIN SILVER COPPER
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn85Pb15)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Termination

  • SMD/SMT
  • Through Hole

Type

  • NOR TYPE

Weight

  • 1.758804g
  • 540.001716mg
  • 665.986997mg
  • 722.005655mg
  • 930.006106mg
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations Termination ECCN Code Length RoHS Status Lead Free Radiation Hardening Number of Pins Additional Feature Package / Case Interface REACH SVHC Reach Compliance Code Density Frequency Height Width Mounting Type Weight Operating Temperature Technology Operating Supply Current Operating Mode Height Seated (Max) Number of Functions Nominal Supply Current JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Base Part Number Pin Count Surface Mount Terminal Pitch JESD-30 Code Supply Voltage-Min (Vsup) Qualification Status Power Supplies Supply Voltage-Max (Vsup) Supplier Device Package Output Characteristics Memory Size Memory Type Supply Current-Max Voltage - Supply Organization Memory Width Memory Density Memory IC Type Parallel/Serial Clock Frequency Standby Current-Max Programmable Type Data Retention Time-Min Endurance Write Protection I/O Type
    AT17LV010A-10PU AT17LV010A-10PU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Through Hole Tube 1996 yes Active 1 (Unlimited) 8 9.271mm ROHS3 Compliant No 8 ALSO OPERATES AT 5V SUPPLY 8-DIP (0.300, 7.62mm) 2-Wire, Serial No SVHC 1 Mb 33MHz 7.62mm Through Hole -40°C~85°C CMOS 5.334mm 1 10mA e3 Matte Tin (Sn) - annealed DUAL 3.3V AT17LV010A 2.54mm 3V 3.3/5V 3.6V EEPROM 3V~3.6V 4.5V~5.5V 1MX1 1 Serial EEPROM HARDWARE
    XC17512LPD8C XC17512LPD8C Xilinx Inc. 8.6498
    Add to Cart

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 2000 no Obsolete Not Applicable 8 EAR99 9.3599mm Non-RoHS Compliant Contains Lead 8 USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS 8-DIP (0.300, 7.62mm) not_compliant 7.62mm Through Hole 0°C~70°C CMOS SYNCHRONOUS 4.5974mm 1 e0 DUAL 225 3.3V 30 XC17512L 8 NO 2.54mm 3V Not Qualified 3.3V 3.6V 3-STATE 512kb 0.005mA 3V~3.6V 512KX1 1 CONFIGURATION MEMORY SERIAL 15MHz 0.00005A OTP COMMON
    AT17C010-10CI AT17C010-10CI Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1997 Obsolete 3 (168 Hours) Non-RoHS Compliant 8-TDFN Surface Mount -40°C~85°C AT17C010 8-LAP (6x6) 1Mb 4.5V~5.5V Serial EEPROM
    XC17S30XLPDG8C XC17S30XLPDG8C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1999 Obsolete 1 (Unlimited) 8 Through Hole EAR99 9.3599mm RoHS Compliant 8 8-DIP (0.300, 7.62mm) Serial No SVHC unknown 7.62mm Through Hole 0°C~70°C CMOS SYNCHRONOUS 4.5974mm 1 e3 Matte Tin (Sn) DUAL 250 3.3V 30 XC17S30XL 8 NO 2.54mm 3V Not Qualified 3.3V 3.6V 3-STATE 300kb PROM 0.005mA 3V~3.6V 1 10MHz 0.00005A OTP COMMON
    XC17S200AVQ44I XC17S200AVQ44I Rochester Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tray no Obsolete 3 (168 Hours) 44 10mm Non-RoHS Compliant 44-TQFP unknown 10mm Surface Mount -40°C~85°C CMOS SYNCHRONOUS 1.2mm 1 e0 TIN LEAD QUAD GULL WING 225 3.3V 30 44 YES 0.8mm S-PQFP-G44 3V COMMERCIAL 3.6V 2Mb 3V~3.6V 1335840X1 1 1335840 bit CONFIGURATION MEMORY SERIAL OTP
    AT17N002-10TQC AT17N002-10TQC Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tray 1997 Obsolete 3 (168 Hours) Non-RoHS Compliant 44-TQFP Surface Mount 0°C~70°C AT17N002 44-TQFP (10x10) 2Mb 3V~3.6V Serial EEPROM
    AT17LV256-10PU AT17LV256-10PU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Through Hole Tube 1997 yes Active 1 (Unlimited) 8 10.16mm ROHS3 Compliant Lead Free No 8 IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO 8-DIP (0.300, 7.62mm) 2-Wire No SVHC 256 kb 12.5MHz 5.334mm 7.11mm Through Hole 930.006106mg -40°C~85°C CMOS 10mA 1 10mA e3 Matte Tin (Sn) - annealed DUAL 3.3V AT17LV256 2.54mm 3V 3.3V 3.6V 256Kb EEPROM 3V~3.6V 4.5V~5.5V 256KX1 0.00015A Serial EEPROM 90 100000 Write/Erase Cycles HARDWARE
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