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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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Configuration Proms for FPGAs

Additional Feature

  • 4 WIRE INTERFACE TO FLEX 8000 DEVICES
  • ALSO OPERATES AT 5V SUPPLY
  • IT CAN ALSO OPERATE AT 5V SUPPLY
  • IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
  • IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
  • USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.B.1.A
  • 3A991.B.1
  • 3A991.B.1.A
  • 3A991.B.1.B.1
  • 3A991.B.2.A
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 25 Weeks
  • 30 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks

HTS Code

  • 8542.32.00.51
  • 8542.32.00.61
  • 8542.32.00.71
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e4

Manufacturer Package Identifier

  • XCF02SVOG20C

Max Operating Temperature

  • 125°C
  • 70°C
  • 85°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • Not Applicable

Mount

  • Surface Mount
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Number of Terminals

  • 100

Number of Terminations

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Operating Temperature

  • -40°C~85°C
  • 0°C~70°C

Package / Case

  • 100-BQFP
  • 16-SOIC (0.295, 7.50mm Width)
  • 20-LCC (J-Lead)
  • 20-SOIC (0.295, 7.50mm Width)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 24-LBGA
  • 24-TBGA
  • 32-TQFP
  • 44-LCC (J-Lead)
  • 44-TQFP
  • 48-TFBGA, CSPBGA
  • 48-TFSOP (0.724, 18.40mm Width)
  • 64-TBGA
  • 8-DIP (0.300, 7.62mm)
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-TDFN
  • 88-LFBGA
  • FBGA
  • PDIP
  • PLCC
  • PQFP
  • SOIC

Packaging

  • Bulk
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Obsolete

Pbfree Code

  • no
  • yes

Published

  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2010
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • EPC
  • EPCQ
  • EPCQ-A
  • EPCQ-L
  • EPCS
  • EPCV

Subcategory

  • Flash Memories
  • OTP ROMs

Supplier Device Package

  • 100-PQFP (20x14)
  • 16-SOIC
  • 20-PLCC (9x9)
  • 20-SOIC
  • 20-TSSOP
  • 32-TQFP (7x7)
  • 44-PLCC (16.6x16.6)
  • 44-TQFP (10x10)
  • 8-LAP
  • 8-LAP (6x6)
  • 8-PDIP
  • 8-SOIC
  • 8-TSOP
  • 88-UBGA (11x8)

Surface Mount

  • NO
  • YES

Technology

  • CMOS
  • MOS

Terminal Finish

  • MATTE TIN
  • MATTE TIN (472) OVER COPPER
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • NICKEL (39) PALLADIUM (2) GOLD
  • NICKEL PALLADIUM GOLD
  • Nickel/Gold (Ni/Au)
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN LEAD
  • TIN SILVER COPPER
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn85Pb15)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Termination

  • SMD/SMT
  • Through Hole

Type

  • NOR TYPE

Weight

  • 1.758804g
  • 540.001716mg
  • 665.986997mg
  • 722.005655mg
  • 930.006106mg
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Max Operating Temperature Min Operating Temperature Operating Supply Voltage Length RoHS Status Lead Free Contact Plating Radiation Hardening Number of Pins Additional Feature Package / Case Interface Max Supply Voltage REACH SVHC Reach Compliance Code Min Supply Voltage Density Frequency Height Width Mounting Type Weight Operating Temperature Technology Operating Supply Current Operating Mode Height Seated (Max) HTS Code Number of Functions Nominal Supply Current JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Base Part Number Pin Count Surface Mount Terminal Pitch Supply Voltage-Min (Vsup) Subcategory Qualification Status Power Supplies Supply Voltage-Max (Vsup) Supplier Device Package Output Characteristics Memory Size Memory Type Supply Current-Max Voltage - Supply Organization Memory Width Memory Density Memory IC Type Parallel/Serial Clock Frequency Standby Current-Max Access Time (Max) Programmable Type Data Retention Time-Min Endurance Write Protection I/O Type
    AT17LV128-10NC AT17LV128-10NC Rochester Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube Obsolete 1 (Unlimited) Non-RoHS Compliant 8-SOIC (0.154, 3.90mm Width) Surface Mount 0°C~70°C 8-SOIC 128kb 3V~3.6V 4.75V~5.25V Serial EEPROM
    AT17LV010A-10JC AT17LV010A-10JC Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Surface Mount Tube 1997 Obsolete 2 (1 Year) 70°C 0°C Non-RoHS Compliant Contains Lead Lead, Tin 20 20-LCC (J-Lead) 2-Wire, Serial 5.5V 4.5V 1 Mb 15MHz Surface Mount 0°C~70°C 10mA AT17LV010A 20-PLCC (9x9) 1Mb EEPROM 3V~3.6V 4.75V~5.25V Serial EEPROM
    AT17C128-10NI AT17C128-10NI Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 2000 Obsolete 1 (Unlimited) Non-RoHS Compliant 8-SOIC (0.154, 3.90mm Width) Surface Mount -40°C~85°C AT17C128 8-SOIC 128kb 4.5V~5.5V Serial EEPROM
    XC18V01VQ44I XC18V01VQ44I Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tray 1998 Obsolete 3 (168 Hours) 44 3A001.B.1.A 3.3V 10mm Non-RoHS Compliant Contains Lead No 44 44-TQFP 1 Mb 10mm Surface Mount -40°C~85°C CMOS 1.2mm 8542.39.00.01 1 e0 TIN LEAD QUAD GULL WING 225 3.3V 30 XC18V01 44 YES 0.8mm 3V Flash Memories 3.6V 0.025mA 3V~3.6V 128KX8 8 CONFIGURATION MEMORY PARALLEL/SERIAL 33MHz 0.01A 15 ns In System Programmable 10 10000 Write/Erase Cycles
    AT17N512-10PI AT17N512-10PI Rochester Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube Obsolete 1 (Unlimited) Non-RoHS Compliant 8-DIP (0.300, 7.62mm) Through Hole -40°C~85°C 8-PDIP 512kb 3V~3.6V Serial EEPROM
    XC17128ELVO8I XC17128ELVO8I Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 2000 Obsolete 1 (Unlimited) 8 EAR99 4.9276mm Non-RoHS Compliant Contains Lead 8 USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS 8-SOIC (0.154, 3.90mm Width) not_compliant 3.937mm Surface Mount -40°C~85°C CMOS SYNCHRONOUS 1 e0 DUAL GULL WING 225 3.3V 30 XC17128EL 8 YES 1.27mm 3V Not Qualified 3.3V 3.6V 3-STATE 128kb 0.005mA 3V~3.6V 1 131072 bit CONFIGURATION MEMORY SERIAL 15MHz 0.00005A OTP COMMON
    AT17LV256-10PU AT17LV256-10PU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Through Hole Tube 1997 yes Active 1 (Unlimited) 8 10.16mm ROHS3 Compliant Lead Free No 8 IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO 8-DIP (0.300, 7.62mm) 2-Wire No SVHC 256 kb 12.5MHz 5.334mm 7.11mm Through Hole 930.006106mg -40°C~85°C CMOS 10mA 1 10mA e3 Matte Tin (Sn) - annealed DUAL 3.3V AT17LV256 2.54mm 3V 3.3V 3.6V 256Kb EEPROM 3V~3.6V 4.5V~5.5V 256KX1 0.00015A Serial EEPROM 90 100000 Write/Erase Cycles HARDWARE
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