Items : %s%s
DAC
Contact Plating
- Copper, Silver, Tin
- Copper, Tin
- Gold
- Gold, Silver
- Gold, Tin
- Lead, Silver, Tin
- Lead, Tin
- Silver
- Tin
ECCN Code
- 3A001.A.2.C
- 3A001.A.5.B
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 111 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 3 Weeks
- 35 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
JESD-609 Code
- e0
- e1
- e2
- e3
- e4
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 12 hours ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 2 weeks ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- CONTACT ADI (Last Updated: 1 month ago)
- CONTACT ADI (Last Updated: 1 week ago)
- CONTACT ADI (Last Updated: 2 weeks ago)
- CONTACT ADI (Last Updated: 3 months ago)
- LAST TIME BUY (Last Updated: 2 weeks ago)
- LIFEBUY (Last Updated: 3 days ago)
- NRND (Last Updated: 1 week ago)
- NRND (Last Updated: 4 days ago)
- NRND (Last Updated: 5 days ago)
- NRND (Last Updated: 6 days ago)
- OBSOLETE (Last Updated: 1 week ago)
- OBSOLETE (Last Updated: 2 weeks ago)
- OBSOLETE (Last Updated: 4 days ago)
- OBSOLETE (Last Updated: 5 days ago)
- Production (Last Updated: 1 day ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 1 week ago)
- PRODUCTION (Last Updated: 2 days ago)
- PRODUCTION (Last Updated: 2 weeks ago)
- PRODUCTION (Last Updated: 3 days ago)
- PRODUCTION (Last Updated: 3 months ago)
- PRODUCTION (Last Updated: 3 weeks ago)
- PRODUCTION (Last Updated: 4 days ago)
- PRODUCTION (Last Updated: 4 months ago)
- PRODUCTION (Last Updated: 4 weeks ago)
- PRODUCTION (Last Updated: 5 days ago)
- PRODUCTION (Last Updated: 6 days ago)
Manufacturer Package Identifier
- DGS (S-PDSO-10)
- PWP(R-PDSO-G24)
- RU-28
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 2
- 2 (1 Year)
- 3
- 3 (168 Hours)
- 4
- 4 (72 Hours)
- 5 (48 Hours)
Mount
- Surface Mount
- Surface Mount, Through Hole
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 10
- 100
- 108
- 12
- 124
- 14
- 144
- 16
- 160
- 164
- 165
- 169
- 18
- 196
- 20
- 23
- 24
- 28
- 32
- 36
- 38
- 40
- 44
- 48
- 49
- 5
- 52
- 56
- 6
- 64
- 68
- 72
- 74
- 8
- 80
- 88
- 9
Number of Terminations
- 10
- 100
- 108
- 12
- 124
- 14
- 144
- 16
- 160
- 164
- 165
- 169
- 18
- 196
- 20
- 24
- 28
- 32
- 36
- 38
- 40
- 42
- 44
- 48
- 49
- 5
- 52
- 56
- 6
- 64
- 68
- 72
- 74
- 8
- 80
- 88
- 9
Operating Temperature
- -10°C~70°C
- -10°C~85°C
- -20°C~85°C
- -25°C~85°C
- -30°C~85°C
- -40°C~100°C
- -40°C~105°C
- -40°C~115°C
- -40°C~125°C
- -40°C~125°C TA
- -40°C~125°C TJ
- -40°C~85°C
- -40°C~85°C TA
- -40°C~95°C
- -55°C~105°C
- -55°C~125°C
- 0°C~70°C
- 0°C~75°C
- 0°C~85°C
- 105°C
Package / Case
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
- 10-VFDFN Exposed Pad, CSP
- 10-WFDFN Exposed Pad
- 100-LFBGA, CSPBGA
- 100-LQFP
- 100-TQFP Exposed Pad
- 108-BGA, CSPBGA
- 12-TSSOP (0.118, 3.00mm Width)
- 12-UFBGA, WLCSP
- 12-UFDFN Exposed Pad
- 12-WFDFN Exposed Pad
- 12-WQFN Exposed Pad
- 124-LBGA, CSPBGA
- 14-DIP (0.300, 7.62mm)
- 14-LSSOP (0.173, 4.40mm Width)
- 14-SOIC (0.154, 3.90mm Width)
- 14-TSSOP (0.173, 4.40mm Width)
- 14-VFDFN Exposed Pad
- 14-VFQFN Exposed Pad
- 14-WFDFN Exposed Pad
- 144-FBGA, FCBGA
- 16-CDIP (0.300, 7.62mm)
- 16-DIP (0.300, 7.62mm)
- 16-LSSOP (0.173, 4.40mm Width)
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.295, 7.50mm Width)
- 16-SSOP (0.154, 3.90mm Width)
- 16-SSOP (0.209, 5.30mm Width)
- 16-TFSOP (0.118, 3.00mm Width)
- 16-TSSOP (0.173, 4.40mm Width)
- 16-UFBGA, DSBGA
- 16-UFBGA, WLCSP
- 16-VFQFN Exposed Pad
- 16-WFQFN Exposed Pad
- 16-WFQFN Exposed Pad, CSP
- 16-WQFN Exposed Pad, CSP
- 160-LFBGA, CSPBGA
- 164-LFBGA, CSPBGA
- 165-VFBGA, CSPBGA
- 169-VFBGA, CSPBGA
- 18-CDIP (0.300, 7.62mm)
- 18-DIP (0.300, 7.62mm)
- 18-SOIC (0.295, 7.50mm Width)
- 196-LFBGA
- 20-CDIP (0.300, 7.62mm)
- 20-CLCC
- 20-DIP (0.300, 7.62mm)
- 20-LCC (J-Lead)
- 20-LSSOP (0.173, 4.40mm Width)
- 20-SOIC (0.295, 7.50mm Width)
- 20-SSOP (0.154, 3.90mm Width)
- 20-SSOP (0.209, 5.30mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 20-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 20-WFBGA, DSBGA
- 20-WFBGA, WLBGA
- 20-WFQFN Exposed Pad
- 20-WFQFN Exposed Pad, CSP
- 20-WQFN Exposed Pad
- 24-CDIP (0.300, 7.62mm)
- 24-CDIP (0.600, 15.24mm)
- 24-DIP (0.300, 7.62mm)
- 24-DIP (0.600, 15.24mm)
- 24-SOIC (0.295, 7.50mm Width)
- 24-SSOP (0.154, 3.90mm Width)
- 24-SSOP (0.209, 5.30mm Width)
- 24-TSSOP (0.173, 4.40mm Width)
- 24-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 24-VFQFN Exposed Pad
- 24-VFQFN Exposed Pad, CSP
- 24-WFQFN Exposed Pad
- 28-CDIP (0.600, 15.24mm)
- 28-DIP (0.300, 7.62mm)
- 28-DIP (0.600, 15.24mm)
- 28-LCC (J-Lead)
- 28-SOIC (0.295, 7.50mm Width)
- 28-SSOP (0.154, 3.90mm Width)
- 28-SSOP (0.209, 5.30mm Width)
- 28-TSSOP (0.173, 4.40mm Width)
- 28-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 28-VFQFN Exposed Pad, CSP
- 32-LQFP
- 32-TQFP
- 32-VFQFN Exposed Pad
- 32-VFQFN Exposed Pad, CSP
- 32-WFQFN Exposed Pad
- 32-WFQFN Exposed Pad, CSP
- 36-BSOP (0.295, 7.50mm Width)
- 36-WFBGA, WLBGA
- 38-TFSOP (0.173, 4.40mm Width)
- 38-WFQFN Exposed Pad
- 40-VFQFN Exposed Pad
- 40-VFQFN Exposed Pad, CSP
- 40-WFQFN Exposed Pad
- 40-WFQFN Exposed Pad, CSP
- 44-BSOP (0.295, 7.50mm Width)
- 44-LCC (J-Lead)
- 44-QFP
- 44-TQFP
- 48-BSSOP (0.295, 7.50mm Width)
- 48-LQFP
- 48-PowerTQFP
- 48-QFN Exposed Pad
- 48-TFSOP (0.240, 6.10mm Width)
- 48-TQFP
- 48-TQFP Exposed Pad
- 48-VFQFN Exposed Pad
- 48-VFQFN Exposed Pad, CSP
- 48-WFQFN Exposed Pad
- 48-WFQFN Exposed Pad, CSP
- 52-LQFP
- 52-WFQFN Exposed Pad
- 56-VFQFN Exposed Pad
- 56-VFQFN Exposed Pad, CSP
- 56-WFQFN Exposed Pad
- 6-TSSOP, SC-88, SOT-363
- 6-VDFN Exposed Pad
- 6-VSSOP, SC-88, SOT-363
- 6-WDFN Exposed Pad
- 6-WDFN Exposed Pad, CSP
- 64-LQFP
- 64-TQFP
- 64-VFQFN Exposed Pad
- 64-VFQFN Exposed Pad, CSP
- 64-WFQFN Exposed Pad
- 68-VFQFN Exposed Pad
- 72-VFQFN Exposed Pad
- 72-VFQFN Exposed Pad, CSP
- 74-LBGA, CSPBGA
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-TSSOP (0.173, 4.40mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- 8-UFDFN Exposed Pad, CSP
- 8-VDFN Exposed Pad
- 8-VFDFN Exposed Pad
- 8-WDFN Exposed Pad, CSP
- 8-WDFN, CSP
- 8-WFDFN
- 8-WFDFN Exposed Pad
- 8-WFDFN Exposed Pad, CSP
- 80-LQFP
- 80-TQFP Exposed Pad
- 88-VFQFN Exposed Pad, CSP
- 88-WQFN Dual Rows, Exposed Pad
- 9-UFBGA, WLCSP
- BGA
- CDIP
- D
- DFN
- DIP
- LCC
- LFCSP EP
- LQFP
- MSOP
- PDIP
- PLCC
- PQFP
- Q
- QFN
- QFN EP
- SC
- SC-74A, SOT-753
- SOIC
- SOIC W
- SOP
- SOT-23
- SOT-23-5
- SOT-23-5 Thin, TSOT-23-5
- SOT-23-6
- SOT-23-6 Thin, TSOT-23-6
- SOT-23-8
- SOT-23-8 Thin, TSOT-23-8
- SSOP
- TFSOP
- TSOT
- TSSOP
Packaging
- Box
- Bulk
- Cut Tape
- Cut Tape (CT)
- Digi-Reel®
- Rail/Tube
- Strip
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
Pbfree Code
- no
- yes
Published
- 1993
- 1995
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
Resistance
- -2Ohm
Series
- AD5770R
- Automotive
- Automotive, ADI0012
- Automotive, AEC-Q100
- Automotive, AEC-Q100, microPOWER™
- Automotive, AEC-Q100, SpeedPlus™
- CommsDAC™
- DAC8775
- DACPORT®
- denseDAC
- iCMOS®
- LOGDAC®
- microPOWER™
- nanoDAC+®
- nanoDAC®
- SoftSpan™
- SpeedPlus™
- TrimDAC®
- TxDAC+®
- TxDAC®
Supplier Device Package
- 10-MSOP
- 12-DFN (4x3)
- 14-TDFN-EP (3x3)
- 16-PDIP
- 16-TSSOP
- 18-PDIP
- 20-LFCSP-WQ (4x4)
- 20-PDIP
- 20-PLCC (9x9)
- 20-QFN (5x4)
- 20-SOIC
- 20-TSSOP
- 24-SOIC
- 24-TSSOP
- 24-TSSOP-EP
- 28-PDIP
- 28-SSOP
- 32-TQFN-EP (5x5)
- 36-CSP (2.53x2.37)
- 40-LFCSP-VQ (6x6)
- 48-LFCSP-VQ (7x7)
- 48-LQFP (7x7)
- 72-LFCSP-VQ (10x10)
- 8-LFCSP-UD (2x2)
- 8-MSOP
- 8-TSSOP
- 8-uMAX
- 8-uSOP
- 9-WLCSP (1.52 x 1.69)
- SC-70-6
- SOT-23-8
Surface Mount
- NO
- YES
Terminal Finish
- Gold (Au)
- Gold (Au) - with Nickel (Ni) barrier
- GOLD OVER NICKEL
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- NICKEL PALLADIUM GOLD
- Nickel/Palladium/Gold (Ni/Pd/Au)
- TIN
- Tin (Sn)
- TIN LEAD
- TIN SILVER COPPER
- Tin/Copper (Sn97.5Cu2.5)
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn85Pb15)
- Tin/Lead/Silver (Sn/Pb/Ag)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Termination
- SMD/SMT
- Through Hole
Weight
- 1.053808g
- 1.098005g
- 1.1991g
- 1.627801g
- 117.508773mg
- 133.412856mg
- 134.490138mg
- 137.410139mg
- 139.989945mg
- 140.30179mg
- 143.193441mg
- 155.100241mg
- 16.300976mg
- 169.898692mg
- 172.39345mg
- 174.689761mg
- 18.795734mg
- 18.99418mg
- 181.692094mg
- 190.990737mg
- 2.063789g
- 2.26799g
- 2.386605g
- 200.686274mg
- 209.304529mg
- 211.997734mg
- 22.906415mg
- 227.391525mg
- 23.303308mg
- 23.700201mg
- 241.793083mg
- 25.996513mg
- 266.712314mg
- 28.009329mg
- 338.011364mg
- 342.689036mg
- 356.09836mg
- 4.113913g
- 4.535924g
- 420.395078mg
- 43.204673mg
- 440.409842mg
- 505.386949mg
- 528.605208mg
- 537.308512mg
- 540.001716mg
- 600.301152mg
- 61.887009mg
- 62.709145mg
- 62.99264mg
- 624.398247mg
- 639.990485mg
- 65.99769mg
- 665.986997mg
- 72.206235mg
- 72.603129mg
- 72.801575mg
- 73.793809mg
- 730.794007mg
- 75.891673mg
- 76.997305mg
- 78.187985mg
- 927.99329mg
- 930.006106mg
- 951.693491mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Height | Width | Mounting Type | Weight | Operating Temperature | Technology | Height Seated (Max) | Number of Functions | Nominal Supply Current | Max Input Voltage | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Output Type | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Signal to Noise Ratio (SNR) | Subcategory | Qualification Status | Power Supplies | Max Power Dissipation | Polarity | Input Offset Voltage (Vos) | Min Input Voltage | Power Dissipation | Power Consumption | Screening Level | Resolution | Number of Bits | Supply Current-Max | Differential Output | Supply Type | Number of Converters | Negative Supply Voltage-Nom | Sampling Rate | Conversion Rate | Integral Nonlinearity (INL) | Number of D/A Converters | Differential Nonlinearity | Converter Type | Linearity Error-Max (EL) | Settling Time | Architecture | Reference Type | Data Interface | Input Bit Code | Input Format | Analog Output Voltage-Max | Analog Output Voltage-Min | Voltage - Supply, Analog | Voltage - Supply, Digital | INL/DNL (LSB) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MCP48FEB01T-E/UN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tape & Reel (TR) | 2016 | Active | 1 (Unlimited) | 10 | 3mm | ROHS3 Compliant | 10 | 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) | 3mm | Surface Mount | -40°C~125°C | 1 | DUAL | GULL WING | 5.5V | MCP48FEB01 | Voltage - Buffered | YES | 0.5mm | 1 B | 8 | No | 0.5 LSB | 1 | D/A CONVERTER | 7.8μs (Typ) | R-2R | External, Internal, Supply | SPI | BINARY | SERIAL | 5.46V | 2.7V~5.5V | 2.7V~5.5V | ±0.1, ±0.0125 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MCP47FEB01A0T-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2016 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~125°C | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 40 | MCP47FEB01 | Voltage - Buffered | YES | 0.65mm | 8 | No | 1 | D/A CONVERTER | 6μs (Typ) | R-2R | External, Internal, Supply | I2C | BINARY | SERIAL | 5.46V | 2.7V~5.5V | 2.7V~5.5V | ±0.1, ±0.0125 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
DAC8831IDRG4 | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape and Reel | 2 (1 Year) | 14 | 85°C | -40°C | 8.65mm | RoHS Compliant | Lead Free | Gold | No | 14 | SOIC | SPI | 5.5V | 2.7V | 3.9mm | 133.412856mg | 1 | 5μA | e4 | DUAL | GULL WING | 260 | 3V | 14 | Voltage | INDUSTRIAL | YES | 92 dB | Other Converters | 3/5V | Bipolar, Unipolar | 15μW | 2 B | 16 | Single | 1 | 2 Msps | 2 Msps | 4 LSB | 1 LSB | D/A CONVERTER | 1 μs | BINARY | SERIAL | 2.5V | -2.5V | |||||||||||||||||||||||||||||||||||||||||
|
MCP47CVB11-E/UN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Tube | Active | 2 (1 Year) | 8 | 3mm | 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) | compliant | 3mm | Surface Mount | -40°C~125°C | 1 | DUAL | GULL WING | 3V | Voltage - Buffered | YES | 0.5mm | S-PDSO-G8 | 10 | No | 1 | D/A CONVERTER | 0.0244% | 16μs (Typ) | Current Source | External, Internal | I2C | BINARY | SERIAL | 1.8V~5.5V | 1.8V~5.5V | ±0.25, ±0.25 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MCP48FEB12T-E/UN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tape & Reel (TR) | 2016 | Active | 1 (Unlimited) | 10 | 3mm | ROHS3 Compliant | 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) | 3mm | Surface Mount | -40°C~125°C | 1.1mm | 1 | DUAL | GULL WING | 5.5V | MCP48FEB12 | Voltage - Buffered | YES | 0.5mm | TS 16949 | 1.25 B | 10 | No | 1.5 LSB | 2 | D/A CONVERTER | 0.1465% | 7.8μs (Typ) | R-2R | External, Internal, Supply | SPI | BINARY | SERIAL | 5.46V | 0.01V | 2.7V~5.5V | 2.7V~5.5V | ±0.4, ±0.05 | ||||||||||||||||||||||||||||||||||||||||||||||||
|
MCP47FEB01A2-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2016 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~125°C | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 40 | MCP47FEB01 | Voltage - Buffered | YES | 0.65mm | 8 | No | 1 | D/A CONVERTER | 6μs (Typ) | R-2R | External, Internal, Supply | I2C | BINARY | SERIAL | 5.46V | 2.7V~5.5V | 2.7V~5.5V | ±0.1, ±0.0125 | |||||||||||||||||||||||||||||||||||||||||||||||||||
|
MCP47FEB12A1T-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2016 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~125°C | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 40 | MCP47FEB12 | Voltage - Buffered | YES | 0.65mm | R-PDSO-G8 | TS 16949 | 10 | No | 2 | D/A CONVERTER | 0.1465% | 6μs (Typ) | R-2R | External, Internal, Supply | I2C | BINARY | SERIAL | 5.46V | 0.01V | 2.7V~5.5V | 2.7V~5.5V | ±0.4, ±0.05 | |||||||||||||||||||||||||||||||||||||||||||||||
|
MCP47FVB22A2-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2016 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~125°C | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 40 | MCP47FVB22 | Voltage - Buffered | YES | 0.65mm | R-PDSO-G8 | 12 | No | 2 | D/A CONVERTER | 0.1465% | 6μs (Typ) | R-2R | External, Internal, Supply | I2C | BINARY | SERIAL | 5.46V | 0.01V | 2.7V~5.5V | 2.7V~5.5V | ±1.5, ±0.2 | ||||||||||||||||||||||||||||||||||||||||||||||||
|
MCP48FVB12T-E/UN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tape & Reel (TR) | 2016 | Active | 1 (Unlimited) | 10 | 3mm | ROHS3 Compliant | 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) | 3mm | Surface Mount | -40°C~125°C | 1.1mm | 2 | e3 | MATTE TIN | DUAL | GULL WING | 260 | 40 | MCP48FVB12 | Voltage - Buffered | YES | 0.5mm | 10 | No | 2 | D/A CONVERTER | 0.0488% | 7.8μs (Typ) | R-2R | External, Internal | SPI | BINARY | SERIAL | 5.46V | 0.01V | 2.7V~5.5V | 2.7V~5.5V | ±0.4, ±0.05 | ||||||||||||||||||||||||||||||||||||||||||||||||
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MCP48FVB01T-E/UN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tape & Reel (TR) | 2016 | Active | 1 (Unlimited) | 10 | 3mm | ROHS3 Compliant | 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) | 3mm | Surface Mount | -40°C~125°C | 1 | e3 | MATTE TIN | DUAL | GULL WING | 260 | 40 | MCP48FVB01 | Voltage - Buffered | YES | 0.5mm | 8 | No | 1 | D/A CONVERTER | 7.8μs (Typ) | R-2R | External, Internal | SPI | BINARY | SERIAL | 5.46V | 2.7V~5.5V | 2.7V~5.5V | ±0.1, ±0.0125 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MCP4706A2T-E/CH | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Surface Mount | Tape & Reel (TR) | 2011 | Active | 1 (Unlimited) | 6 | 3.1mm | ROHS3 Compliant | Lead Free | 6 | SOT-23-6 | 2-Wire, I2C, Serial | 5.5V | 2.7V | 1.3mm | 1.8mm | Surface Mount | -40°C~125°C | 1 | 210μA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5.5V | 40 | MCP4706 | 6 | Voltage - Buffered | 0.95mm | Other Converters | 3/5V | 452mW | Bipolar | 1 B | 8 | No | 1 | 0.907 LSB | D/A CONVERTER | 0.3543% | 6μs (Typ) | R-2R | External, Supply | I2C | BINARY | 2.7V~5.5V | 2.7V~5.5V | ±0.125, ±0.0125 | |||||||||||||||||||||||||||||||||||||
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MCP47FEB12A1-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2016 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 5.5V | 1.8V | 3mm | Surface Mount | -40°C~125°C | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 40 | MCP47FEB12 | Voltage - Buffered | 0.65mm | TS 16949 | 1.25 B | 10 | No | 1.5 LSB | 2 | D/A CONVERTER | 0.1465% | 6μs (Typ) | R-2R | External, Internal, Supply | I2C | BINARY | 5.46V | 0.01V | 2.7V~5.5V | 2.7V~5.5V | ±0.4, ±0.05 | |||||||||||||||||||||||||||||||||||||||||||
 |
DAC80508MCYZFT | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Tape & Reel (TR) | yes | Active | 1 (Unlimited) | 16 | 2.39mm | RoHS Compliant | 16-UFBGA, DSBGA | compliant | 2.39mm | Surface Mount | -40°C~125°C | 0.625mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | DAC80508 | Voltage - Buffered | YES | 0.5mm | 16 | No | 8 | D/A CONVERTER | 0.0015% | 5μs | R-2R | Internal | SPI | BINARY | SERIAL | 11V | 2.7V~5.5V | 1.7V~5.5V | ±1, ±1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AD9783BCPZ | Analog Devices Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | PRODUCTION (Last Updated: 2 weeks ago) | Tray | no | Active | 3 (168 Hours) | 72 | EAR99 | 3.3V | 10mm | ROHS3 Compliant | Contains Lead | Tin | 72 | 72-VFQFN Exposed Pad, CSP | LVDS, Parallel, SPI, Serial | 3.47V | No SVHC | 3.13V | 830μm | 10mm | Surface Mount | -40°C~85°C | CMOS | 1 | 55mA | 1.2V | e3 | NO LEAD | 260 | 3.3V | 40 | AD9783 | 72 | Current - Unbuffered | YES | 0.5mm | Other Converters | Not Qualified | 315mW | Unipolar | 1.2V | 462.3mW | 2 B | 16 | Yes | Analog, Digital | 2 | 500 Msps | 600 Msps | 4 LSB | D/A CONVERTER | Quad-Switch | External, Internal | LVDS - Parallel | PARALLEL, WORD | 1V | -1V | 3.13V~3.47V | 1.7V~1.9V 3.13V~3.47V | ±4, ±2 | |||||||||||||||||||||||||||
 |
MCP4811T-E/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 17 Weeks | Surface Mount | Tape & Reel (TR) | 2006 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 5.5V | 2.7V | Surface Mount | -40°C~125°C | 1 | 330μA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 40 | MCP4811 | 8 | Voltage - Buffered | Other Converters | 820μV | 1.25 B | 10 | No | 1 | 3.5 LSB | D/A CONVERTER | 0.293% | 4.5μs (Typ) | String DAC | Internal | SPI | BINARY | 5.46V | 2.7V~5.5V | 2.7V~5.5V | ±1, ±0.2 | |||||||||||||||||||||||||||||||||||||||
|
MCP48CMB12-E/UN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Tube | Active | 2 (1 Year) | 8 | 3mm | 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) | compliant | 3mm | Surface Mount | -40°C~125°C | 1.1mm | 1 | DUAL | GULL WING | 3V | YES | 0.5mm | S-PDSO-G8 | TS 16949 | 10 | No | 2 | D/A CONVERTER | 16μs | External, Internal | I2C | BINARY | SERIAL | ±0.25, ±0.25 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MCP47FEB02A3-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2016 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 5.5V | 1.8V | 3mm | Surface Mount | -40°C~125°C | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 40 | MCP47FEB02 | Voltage - Buffered | 0.65mm | TS 16949 | 1 B | 8 | No | 0.5 LSB | 2 | D/A CONVERTER | 0.1953% | 6μs (Typ) | R-2R | External, Internal, Supply | I2C | BINARY | 5.46V | 0.01V | 2.7V~5.5V | 2.7V~5.5V | ±0.1, ±0.0125 | ||||||||||||||||||||||||||||||||||||||||||||
 |
MCP48CMB02-E/MG | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Active | 3 (168 Hours) | 16 | 3mm | 16-VFQFN Exposed Pad | compliant | 3mm | Surface Mount | -40°C~125°C | 1 | QUAD | 3V | YES | 0.5mm | S-PQCC-N16 | TS 16949 | 8 | No | 2 | D/A CONVERTER | 0.0391% | 16μs | External, Internal | I2C | BINARY | SERIAL | ±0.1, ±0.1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MCP47FVB11A0-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2016 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~125°C | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 40 | MCP47FVB11 | Voltage - Buffered | YES | 0.65mm | R-PDSO-G8 | 10 | No | 1 | D/A CONVERTER | 6μs (Typ) | R-2R | External, Internal, Supply | I2C | BINARY | SERIAL | 5.46V | 2.7V~5.5V | 2.7V~5.5V | ±0.4, ±0.05 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
LTC7545AKG#TRPBF | Linear Technology/Analog Devices | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | Tape & Reel (TR) | 2001 | Active | 1 (Unlimited) | 20 | EAR99 | 7.2mm | ROHS3 Compliant | 20-SSOP (0.209, 5.30mm Width) | 5.29mm | Surface Mount | 0°C~70°C | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 250 | 5V | LTC7545 | 20 | Current - Unbuffered | YES | 0.65mm | R-PDSO-G20 | 12 | No | 1 | D/A CONVERTER | 1μs | R-2R | External | Parallel | BINARY, OFFSET BINARY | 5V 14.25V~15.75V | 5V 14.25V~15.75V | ±0.5 (Max), ±1 (Max) | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MCP48CMB02-E/MF | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Active | 1 (Unlimited) | 10 | 3mm | 10-VFDFN Exposed Pad | compliant | 3mm | Surface Mount | -40°C~125°C | 1mm | 1 | DUAL | 3V | YES | 0.5mm | S-PDSO-N10 | TS 16949 | 8 | No | 2 | D/A CONVERTER | 0.0391% | 16μs | External, Internal | I2C | BINARY | SERIAL | ±0.1, ±0.1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MCP47FVB01A3T-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2016 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~125°C | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 40 | MCP47FVB01 | Voltage - Buffered | YES | 0.65mm | 8 | No | 1 | D/A CONVERTER | 6μs (Typ) | R-2R | External, Internal, Supply | I2C | BINARY | SERIAL | 5.46V | 2.7V~5.5V | 2.7V~5.5V | ±0.1, ±0.0125 | |||||||||||||||||||||||||||||||||||||||||||||||||||
.png "MCP4728AO-E/UN") |
MCP4728AO-E/UN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MAX5510ETC+T | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 9 Weeks | Tape & Reel (TR) | 2007 | yes | Active | 1 (Unlimited) | 12 | EAR99 | 4mm | ROHS3 Compliant | 12-WQFN Exposed Pad | 4mm | Surface Mount | -40°C~85°C | BICMOS | 1 | e3 | MATTE TIN | QUAD | 260 | 2.7V | MAX5510 | 12 | Voltage - Buffered | YES | Other Converters | 2/5V | 8 | 0.005mA | No | 1 | D/A CONVERTER | 0.3906% | 660μs (Typ) | External | SPI | BINARY | SERIAL | 1.8V~5.5V | 1.8V~5.5V | ±0.25, ±0.2 | |||||||||||||||||||||||||||||||||||||||||||||||
 |
MCP4901-E/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Surface Mount | Tube | 2010 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 3mm | ROHS3 Compliant | Lead Free | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | SPI, Serial | 5.5V | No SVHC | 2.7V | 950μm | 3mm | Surface Mount | -40°C~125°C | 1 | 175μA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 40 | MCP4901 | 8 | Voltage - Buffered | 0.65mm | Other Converters | Bipolar | 820μV | 1 B | 8 | No | 1 | 1 LSB | D/A CONVERTER | 4.5μs (Typ) | String DAC | External | SPI | BINARY | 2.7V~5.5V | 2.7V~5.5V | ±0.25, ±0.2 | ||||||||||||||||||||||||||||||||||||
 |
AD7840JN | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | no | Obsolete | 4 (72 Hours) | 24 | 30.48mm | Non-RoHS Compliant | 24-DIP (0.300, 7.62mm) | 7.62mm | Through Hole | 0°C~70°C | BICMOS | 5.33mm | 1 | e0 | TIN LEAD | DUAL | 5V | 24 | Voltage - Buffered | NO | 2.54mm | R-PDIP-T24 | COMMERCIAL | 14 | No | -5V | 1 | D/A CONVERTER | 4μs | R-2R | External, Internal | Parallel, Serial | 2'S COMPLEMENT BINARY | SERIAL, PARALLEL, WORD | 3V | -3V | ±5V | ±2 (Max), ±0.9 (Max) | |||||||||||||||||||||||||||||||||||||||||||||||||
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MCP48FEB22-E/UN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tube | 2016 | Active | 1 (Unlimited) | 10 | 3mm | ROHS3 Compliant | 10 | 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) | No SVHC | 3mm | Surface Mount | -40°C~125°C | 1.1mm | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 5.5V | 40 | MCP48FEB22 | Voltage - Buffered | YES | 0.5mm | TS 16949 | 1.5 B | 12 | No | 6 LSB | 2 | D/A CONVERTER | 0.1465% | 7.8μs (Typ) | R-2R | External, Internal, Supply | SPI | BINARY | SERIAL | 5.46V | 0.01V | 2.7V~5.5V | 2.7V~5.5V | ±1.5, ±0.2 | ||||||||||||||||||||||||||||||||||||||||||
|
MCP47FVB22A3T-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2016 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~125°C | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 40 | MCP47FVB22 | Voltage - Buffered | YES | 0.65mm | R-PDSO-G8 | 12 | No | 2 | D/A CONVERTER | 0.1465% | 6μs (Typ) | R-2R | External, Internal, Supply | I2C | BINARY | SERIAL | 5.46V | 0.01V | 2.7V~5.5V | 2.7V~5.5V | ±1.5, ±0.2 | ||||||||||||||||||||||||||||||||||||||||||||||||
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MCP4725A0T-E/CHVAO | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 6 | 2.9mm | ROHS3 Compliant | SOT-23-6 | Surface Mount | -40°C~125°C | 1 | DUAL | GULL WING | 5V | MCP4725 | Voltage - Buffered | YES | 0.95mm | R-PDSO-G6 | 12 | No | 1 | D/A CONVERTER | 0.354% | 6μs (Typ) | String DAC | Supply | I2C | BINARY | SERIAL | 5.5V | 2.7V~5.5V | 2.7V~5.5V | ±2, ±0.2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MCP47FEB01A3T-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2016 | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~125°C | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 40 | MCP47FEB01 | Voltage - Buffered | YES | 0.65mm | 8 | No | 1 | D/A CONVERTER | 6μs (Typ) | R-2R | External, Internal, Supply | I2C | BINARY | SERIAL | 5.46V | 2.7V~5.5V | 2.7V~5.5V | ±0.1, ±0.0125 |
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