Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Alternate Memory Width | I/O Type | Programming Voltage | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
IDT71256SA20PZI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 28 | EAR99 | 85°C | -40°C | 1 | 11.8mm | Non-RoHS Compliant | TSSOP | Parallel | not_compliant | 8mm | CMOS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 240 | 5V | 20 | 28 | INDUSTRIAL | YES | 0.55mm | R-PDSO-G28 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.145mA | 32KX8 | 8 | 262144 bit | 0.015A | 20 ns | YES | COMMON | 4.5V | ||||||||||||||||||||||||||||||||||||||||
 |
70V3589S166DRG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | 2009 | yes | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 28mm | RoHS Compliant | Lead Free | No | 208 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | PQFP | Parallel | 3.45V | 3.15V | 2.3 Mb | 166MHz | 28mm | 3.5mm | CMOS | 4.1mm | 1 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | 30 | 208 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 20 ns | 256kB | RAM, SDR, SRAM | 32b | 0.5mA | 64KX36 | 0.03A | COMMON | |||||||||||||||||||||||||||||||||||||||
 |
7054S35PRF8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 128-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Quad Port, Asynchronous | IDT7054 | 128-TQFP (14x20) | 35ns | 32Kb 4K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 35ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3577S75BQG | Integrated Device Technology (IDT) | 7.7031 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | Bulk | 2005 | yes | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | FLOW THROUGH ARCHITECTURE | FBGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 117MHz | 13mm | 1.2mm | CMOS | 1 | 255mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | COMMERCIAL | SRAMs | 3-STATE | 7.5 ns | 117MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||
 |
7007S35PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 80 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 295mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 80 | COMMERCIAL | 0.65mm | SRAMs | 5V | 3-STATE | 35 ns | 32kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.015A | 8b | COMMON | |||||||||||||||||||||||||||||||||||
 |
IDT71V416YS10PHI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Rail/Tube | 2008 | 3 (168 Hours) | 44 | 85°C | -40°C | 3.3V | 1 | Non-RoHS Compliant | 44 | TSOP | Parallel | 3.6V | not_compliant | 3V | 4 Mb | CMOS | 200mA | e0 | DUAL | GULL WING | 3.3V | INDUSTRIAL | 0.8mm | SRAMs | Not Qualified | 3-STATE | 10 ns | RAM, SRAM - Asynchronous | 18b | 16 | Asynchronous | 0.02A | 16b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
W632GU8KB-12 TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 78-TFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | 20ns | 2Gb 256M x 8 | Volatile | 1.283V~1.45V | 800MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3556SA133BGGI | Integrated Device Technology (IDT) | 10.4595 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2006 | yes | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 133MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 310mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 4.2 ns | 133MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.045A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||
 |
71V3578YS133PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2015 | 3 (168 Hours) | 100 | 3A991 | 70°C | 0°C | 20mm | RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | 133MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | FLAT | 260 | 3.3V | 30 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-F100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.25mA | 256KX18 | 18 | 4718592 bit | 0.03A | 4.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||||
.png "6116LA25TDB") |
6116LA25TDB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Bulk | 2013 | no | Active | 1 (Unlimited) | 24 | 125°C | -55°C | 5V | 1 | 32.51mm | RoHS Compliant | Contains Lead | No | 24 | CDIP | Parallel | 5.5V | 4.5V | 16 kb | 7.62mm | 3.56mm | CMOS | 5.08mm | 1 | 85mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 240 | 5V | 24 | MILITARY | 2.54mm | SRAMs | 5V | 3-STATE | 25 ns | MIL-STD-883 Class B | 2kB | RAM, SDR, SRAM - Asynchronous | 11b | 2KX8 | Asynchronous | 0.0003A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||
 |
7009L15PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | Active | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 1 Mb | 14mm | 1.4mm | 340mA | 15 ns | 128kB | RAM, SDR, SRAM | 34b | Asynchronous | 8b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761S183PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 4.5 Mb | 183MHz | 14mm | 1.4mm | CMOS | 1 | 340mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 3.3 ns | 183MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||
 |
71342SA55PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 32 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 64 | COMMERCIAL | 0.8mm | SRAMs | 5V | 3-STATE | 55 ns | 4kB | RAM, SDR, SRAM | 24b | 4KX8 | Asynchronous | 0.015A | 8b | COMMON | |||||||||||||||||||||||||||||||||
|
70P245L65BYGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | 2011 | yes | Discontinued | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 2 | 6mm | RoHS Compliant | Lead Free | No | 100 | TFBGA | Parallel | 3V | 1.8V | 64 kb | 6mm | 1mm | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 30 | 100 | INDUSTRIAL | YES | 0.5mm | SRAMs | 3-STATE | 65 ns | 8kB | RAM, SDR, SRAM | 24b | 0.07mA | 4KX16 | 0.000008A | COMMON | |||||||||||||||||||||||||||||||||||||||||
 |
71V3577S85BQG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2005 | yes | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | FLOW THROUGH ARCHITECTURE | FBGA | Parallel | 4.5 Mb | 13mm | 1.2mm | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | COMMERCIAL | YES | SRAMs | 3.465V | 3-STATE | RAM, SRAM | 17b | 87MHz | 0.03A | 8.5 ns | COMMON | |||||||||||||||||||||||||||||||||||||||||||
 |
MT29F1G01ABAFDWB-IT:F TR | Micron Technology Inc. | 3.0848 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-UDFN | Surface Mount | -40°C~85°C TA | FLASH - NAND | 1Gb 1G x 1 | Non-Volatile | 2.7V~3.6V | FLASH | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V67703S85BG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 9 Mb | 87MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 190mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | COMMERCIAL | SRAMs | 3-STATE | 8.5 ns | 87MHz | 1.1MB | RAM, SDR, SRAM | 18b | 256KX36 | Synchronous | 0.05A | 36b | COMMON | |||||||||||||||||||||||||||||||||||
 |
70V37L15PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2009 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | INTERRUPT FLAG | TQFP | Parallel | 3.6V | 3V | 576 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | YES | 0.5mm | SRAMs | 3-STATE | 15 ns | 72kB | RAM, SDR, SRAM | 30b | 0.003A | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||
|
70V3399S166BFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tape & Reel | 2013 | yes | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | RoHS Compliant | No | 208 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | Parallel | 3.45V | 3.15V | 2.3 Mb | 166MHz | CMOS | 500mA | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 208 | COMMERCIAL | YES | 0.8mm | SRAMs | 3-STATE | 3.6 ns | 166MHz | 256kB | RAM, SDR, SRAM | 34b | 18 | 0.03A | COMMON | ||||||||||||||||||||||||||||||||||||||||||
 |
70V24S55PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2004 | yes | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 3.6V | 3V | 64 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 180mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 55 ns | 8kB | SDR | 24b | 4KX16 | Asynchronous | 0.005A | 16b | COMMON | 3V | ||||||||||||||||||||||||||||||||||
 |
6116SA25SOGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2013 | yes | Active | 1 (Unlimited) | 24 | EAR99 | 85°C | -40°C | 5V | 1 | 15.4mm | RoHS Compliant | Lead Free | No | 24 | SOIC | Parallel | 5.5V | 4.5V | 16 kb | 7.6mm | 2.34mm | CMOS | 1 | 100mA | e3 | MATTE TIN | DUAL | GULL WING | 260 | 5V | 30 | 24 | INDUSTRIAL | SRAMs | 5V | 3-STATE | 25 ns | 2kB | RAM, SDR, SRAM - Asynchronous | 11b | 2KX8 | Asynchronous | 0.002A | 8b | COMMON | ||||||||||||||||||||||||||||||||||||
|
7025L25GB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Through Hole | Bulk | 2012 | no | Active | 1 (Unlimited) | 84 | 125°C | -55°C | 5V | 2 | 27.94mm | RoHS Compliant | Contains Lead | No | 84 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP | Parallel | 5.5V | 4.5V | 128 kb | 27.94mm | 3.68mm | CMOS | 1 | 280mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 5V | 84 | MILITARY | 3-STATE | 25 ns | MIL-PRF-38535 | RAM, SRAM | 26b | 8KX16 | Asynchronous | 0.004A | 16b | YES | COMMON | ||||||||||||||||||||||||||||||||||||||||
 |
71V67603S150BG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 9 Mb | 150MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 305mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 3.8 ns | 150MHz | 1.1MB | RAM, SDR, SRAM | 18b | 256KX36 | Synchronous | 0.07A | 36b | COMMON | |||||||||||||||||||||||||||||||||||
 |
MX25V1635FZUI | Macronix | 0.3831 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | MXSMIO™ | Active | 3 (168 Hours) | 8 | 3mm | ROHS3 Compliant | ALSO IT CAN BE CONFIGURED AS 16M X 1 BIT | 8-UFDFN Exposed Pad | 2mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.6mm | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 0.5mm | R-PDSO-N8 | 2.3V | 3.6V | 16Mb 2M x 8 | Non-Volatile | 2.3V~3.6V | 4MX4 | 4 | 16777216 bit | SERIAL | 80MHz | 2 | 3V | FLASH | SPI - Quad I/O | 100μs, 4ms | ||||||||||||||||||||||||||||||||||||||||||||||
 |
7008S25PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | TQFP | Parallel | 5.5V | 4.5V | 512 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 305mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 25 ns | 64kB | RAM, SDR, SRAM | 32b | 64KX8 | Asynchronous | 0.015A | 8b | COMMON | ||||||||||||||||||||||||||||||||||
 |
71T75802S100BGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2012 | no | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 2.5V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 2.625V | 2.375V | 18 Mb | 100MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 195mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | INDUSTRIAL | SRAMs | 3-STATE | 5 ns | RAM, SRAM | 20b | Synchronous | 0.045A | 18b | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||||||
 |
71V3556SA166BGG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2006 | yes | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 166MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 350mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | COMMERCIAL | SRAMs | 3-STATE | 3.5 ns | RAM, SRAM | 17b | Synchronous | 0.04A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||
 |
7008L15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2010 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 512 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | YES | 0.5mm | SRAMs | 5V | 3-STATE | 15 ns | 64kB | RAM, SDR, SRAM | 32b | 64KX8 | 0.005A | COMMON | |||||||||||||||||||||||||||||||||||||||
 |
7025L45PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2001 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | INTERRUPT FLAG; ARBITER; SEMAPHORE | TQFP | Parallel | 5.5V | 4.5V | 128 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 45 ns | 16kB | RAM, SDR, SRAM | 26b | 8KX16 | Asynchronous | 0.0015A | 16b | COMMON | 2V | ||||||||||||||||||||||||||||||||||
 |
7006S35J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 5.5V | 4.5V | 128 kb | 24mm | 3.63mm | CMOS | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 35 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 0.015A | 8b | COMMON |
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