Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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IDT71V3556S166BQG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | 3 (168 Hours) | 165 | 3A991.B.2.A | 70°C | 0°C | 15mm | RoHS Compliant | 165 | Parallel | unknown | 166MHz | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | COMMERCIAL | YES | 1mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.35mA | 128KX36 | 36 | 4718592 bit | 0.04A | 3.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS6C8008-55ZINTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2008 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | unknown | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | NOT SPECIFIED | NOT SPECIFIED | 8Mb 1M x 8 | Volatile | 2.7V~5.5V | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S32800B-6BI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 2 (1 Year) | 90 | EAR99 | 1 | 13mm | Non-RoHS Compliant | 90 | AUTO/SELF REFRESH | 90-TFBGA | not_compliant | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.45mm | 8542.32.00.24 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 90 | YES | 0.8mm | 3V | Not Qualified | 3.3V | 3.6V | 5.5ns | 256Mb 8M x 32 | Volatile | 0.3mA | 3V~3.6V | 8MX32 | 32 | 268435456 bit | 32b | 166MHz | 0.002A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CAT28C256H1315 | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 28 | 11.8mm | ROHS3 Compliant | 28-TSSOP (0.465, 11.80mm Width) | 8mm | Surface Mount | 0°C~70°C TA | CMOS | ASYNCHRONOUS | 1.2mm | 1 | e3 | TIN | DUAL | 260 | 5V | NOT SPECIFIED | 28 | YES | 0.55mm | R-PDSO-G28 | 4.5V | COMMERCIAL | 5.5V | 150ns | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | 32KX8 | 8 | 262144 bit | 5ms | 5V | EEPROM | Parallel | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST25WF010-40-5I-SAF | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tube | 2005 | SST25 | yes | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.A | 1.8V | 4.9mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | No SVHC | 1 Mb | Surface Mount | -40°C~85°C TA | CMOS | 1.75mm | 1 | 10mA | e4 | NICKEL PALLADIUM GOLD | DUAL | 260 | 1.8V | 40 | SST25WF010-40 | 8 | YES | 1.27mm | 1.65V | 1.95V | 9 ns | 1Mb 128K x 8 | Non-Volatile | 1b | 1.65V~1.95V | 8 | Synchronous | 8b | 40MHz | 8b | 100 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | SPI | FLASH | SPI | 60μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "7015S25PF") |
7015S25PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 80 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 72 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 265mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 80 | COMMERCIAL | 0.65mm | SRAMs | 5V | 3-STATE | 25 ns | 9kB | RAM, SDR, SRAM | 26b | 8KX9 | Asynchronous | 0.015A | 9b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V7519S133BFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 208 | 85°C | -40°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 3.45V | 3.15V | 9 Mb | 133MHz | 15mm | 1.4mm | CMOS | 1 | 675mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 208 | INDUSTRIAL | 0.8mm | SRAMs | 3-STATE | 15 ns | RAM, SRAM | 18b | Synchronous | 0.04A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MB85RC128APNF-G-JNERE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Tape & Reel (TR) | 2015 | Not For New Designs | 1 (Unlimited) | 85°C | -40°C | RoHS Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | 1MHz | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 8-SOP | 128Kb 16K x 8 | Non-Volatile | 3V~3.6V | 1MHz | FRAM | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
71256S45DB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | 2011 | no | Active | 1 (Unlimited) | 28 | 125°C | -55°C | 5V | 1 | 37.2mm | RoHS Compliant | Contains Lead | 28 | CDIP | Parallel | 5.5V | 4.5V | 256 kb | 15.24mm | 1.65mm | CMOS | 5.08mm | 1 | 135mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 240 | 5V | NOT SPECIFIED | 28 | MILITARY | 2.54mm | SRAMs | Not Qualified | 5V | 3-STATE | 45 ns | MIL-STD-883 Class B | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 0.02A | 8b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
709279S12PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 5.5V | 4.5V | 512 kb | 33.3MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 345mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 12 ns | 64kB | RAM, SDR, SRAM | 15b | Synchronous | 0.015A | 16b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V124SA12PHGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2013 | yes | Active | 3 (168 Hours) | 32 | 85°C | -40°C | 3.3V | 1 | 20.95mm | RoHS Compliant | Lead Free | No | 32 | TSOP | Parallel | 3.6V | 3V | 1 Mb | 10.16mm | 1mm | CMOS | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 30 | 32 | INDUSTRIAL | YES | SRAMs | 3-STATE | 12 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 17b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT70825S35PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 14mm | Non-RoHS Compliant | AUTOMATIC POWER-DOWN | LQFP | Parallel | not_compliant | 14mm | CMOS | ASYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 80 | COMMERCIAL | YES | 0.65mm | S-PQFP-G80 | 4.5V | Other Memory ICs | Not Qualified | 5V | 5.5V | RAM | 0.34mA | 8KX16 | 16 | 131072 bit | 0.015A | 35 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
DS2502-E64+ | Maxim Integrated | 2.8366 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Bulk | 2009 | yes | Active | 1 (Unlimited) | 3 | EAR99 | ROHS3 Compliant | Lead Free | No | TO-226-3, TO-92-3 (TO-226AA) | Serial | Through Hole | 453.59237mg | -40°C~85°C TA | EPROM - OTP | 5μA | 8542.32.00.71 | 1 | e3 | Matte Tin (Sn) | BOTTOM | 260 | 5V | 30 | DS2502 | 3 | NO | O-PBCY-T3 | 2.8V | 6V | 1Kb 128 x 8 | Non-Volatile | 2.8V~6V | 1KX1 | 1 | 1024 bit | EPROM | 1-Wire® | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7025L55PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 128 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 210mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 55 ns | 16kB | RAM, SDR, SRAM | 26b | 8KX16 | Asynchronous | 0.0015A | 16b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V639S10BF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | Parallel | 3.45V | 3.15V | 2.3 Mb | 15mm | 1.4mm | CMOS | 1 | 500mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 10 ns | 256kB | RAM, SDR, SRAM | 34b | Asynchronous | 0.015A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MB85RS512TPNF-G-JNERE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | 2015 | Active | 3 (168 Hours) | RoHS Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 8-SOP | 512Kb 64K x 8 | Non-Volatile | 1.8V~3.6V | 30MHz | FRAM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V67903S75PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 100 | 3A991.B.2.A | 85°C | -40°C | 20mm | Non-RoHS Compliant | FLOW-THROUGH ARCHITECTURE | LQFP | Parallel | not_compliant | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | INDUSTRIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.285mA | 512KX18 | 18 | 9437184 bit | 117MHz | 0.07A | 7.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7130SA55JI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 52 | EAR99 | 85°C | -40°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 8 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 190mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | INDUSTRIAL | SRAMs | 5V | 3-STATE | 55 ns | 1kB | RAM, SDR, SRAM | 20b | 1KX8 | Asynchronous | 0.03A | 8b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
93AA56CXT-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2011 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | Serial | 2 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.75mm | 1 | 2mA | e3 | DUAL | 260 | 2.5V | 40 | 93AA56C | 8 | 1.27mm | 2/5V | 5.5V | 200 ns | 2Kb 256 x 8 128 x 16 | Non-Volatile | 1.8V~5.5V | 16 | 3MHz | 0.000001A | 8 | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 6ms | MICROWIRE | EEPROM | SPI | 6ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29PL032J60BFW123 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | PL-J | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | 8.15mm | ROHS3 Compliant | 48 | TOP AND BOTTOM BOOT BLOCK | 48-VFBGA | 6.15mm | Surface Mount | -25°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1mm | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | 260 | 3V | 40 | YES | 0.8mm | 2.7V | Not Qualified | 3/3.3V | 3.6V | 32Mb 2M x 16 | Non-Volatile | 0.07mA | 2.7V~3.6V | 2MX16 | 16 | 33554432 bit | 0.000005A | 60 ns | 3V | YES | YES | YES | 1662 | 8words | YES | YES | FLASH | Parallel | 60ns | 4K32K | BOTTOM/TOP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1525KV18-250BZXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tray | 2003 | yes | Active | 3 (168 Hours) | 165 | 1.8V | 2 | 15mm | ROHS3 Compliant | Lead Free | No | 165 | PIPELINED ARCHITECTURE; IT ALSO OPERATES AT 1.5V | 165-LBGA | 72 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 1.4mm | 1 | 640mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | CY7C1525 | 165 | 1mm | 1.7V | 1.9V | 3-STATE | 450 ps | 72Mb 8M x 9 | Volatile | 22b | 1.7V~1.9V | 8MX9 | 9 | Synchronous | 250MHz | 9b | SEPARATE | 1.7V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
CY7C1515KV18-300BZI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tray | 2003 | Active | 3 (168 Hours) | 165 | 1.8V | 2 | 15mm | Non-RoHS Compliant | Contains Lead | No | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 72 Mb | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, QDR II | 1.4mm | 1 | 790mA | e0 | Tin/Lead (Sn/Pb) | BOTTOM | 235 | 1.8V | 20 | CY7C1515 | 165 | 1mm | 1.7V | 1.9V | 3-STATE | 450 ps | 72Mb 2M x 36 | Volatile | 19b | 1.7V~1.9V | 36 | Synchronous | 300MHz | 36b | SEPARATE | 1.7V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S27KL0642DPBHI030 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | HyperRAM™ KL | Active | 24-VBGA | Surface Mount | -40°C~85°C TA | PSRAM (Pseudo SRAM) | 64Mb 8M x 8 | Volatile | 2.7V~3.6V | 166MHz | PSRAM | HyperBus | 36ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
DS28DG02E-3C+T | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | Obsolete | 1 (Unlimited) | 28 | EAR99 | 5V | 9.7mm | ROHS3 Compliant | 28-TSSOP (0.173, 4.40mm Width) Exposed Pad | SPI, Serial | 4.4mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.1mm | 8542.32.00.51 | 1 | e3 | MATTE TIN | DUAL | 260 | 3.3V | NOT SPECIFIED | DS28DG02 | 28 | YES | 0.65mm | R-PDSO-G28 | 2.2V | Not Qualified | 2Kb 256 x 8 | Non-Volatile | 0.0008mA | 2.2V~5.25V | 256X8 | 8 | 2048 bit | 2MHz | 0.0001A | 40 | 200000 Write/Erase Cycles | HARDWARE | 3V | SPI | EEPROM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CAT28F020GI-12T | ON Semiconductor | 1.4136 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2007 | Obsolete | 3 (168 Hours) | 32 | EAR99 | 5V | 13.97mm | RoHS Compliant | Lead Free | Tin | 32 | 32-LCC (J-Lead) | unknown | 2 Mb | Surface Mount | -40°C~85°C TA | CMOS | 3.55mm | 1 | 30mA | e3 | QUAD | 245 | 5V | 40 | CAT28F020 | 32 | 1.27mm | Not Qualified | 5V | 7V | 2Mb 256K x 8 | Non-Volatile | 18b | 4.5V~5.5V | 256KX8 | 8 | Asynchronous | 8b | 0.0001A | 120 ns | 8b | 100000 Write/Erase Cycles | NO | NO | YES | FLASH | Parallel | 120ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M95M01-DFCS6TP/K | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | ACTIVE (Last Updated: 7 months ago) | Surface Mount | Cut Tape (CT) | Active | 1 (Unlimited) | 8 | EAR99 | 2.56mm | ROHS3 Compliant | Lead Free | No | 8 | 8-UFBGA, WLCSP | SPI, Serial | 1 Mb | Surface Mount | -40°C~85°C TA | CMOS | 1 | 5mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 1.8V | M95M01 | 0.5mm | 1.7V | 5.5V | 25 ns | 1Mb 128K x 8 | Non-Volatile | 1.7V~5.5V | 8 | 16MHz | 0.000001A | 200 | 4000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS42S32400E-6BLI-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | 85°C | -40°C | 3.3V | RoHS Compliant | 90 | 90-TFBGA | Parallel | 3.6V | 3V | 128 Mb | 166MHz | Surface Mount | -40°C~85°C TA | SDRAM | 180mA | 166MHz | 90-TFBGA (8x13) | 5.4ns | 128Mb 4M x 32 | Volatile | 14b | 3V~3.6V | 32b | 166MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL127SABBHBC03 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tape & Reel (TR) | 2016 | Automotive, AEC-Q100, FL-S | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | 24-TBGA | 6mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1mm | R-PBGA-B24 | 2.7V | 3.6V | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 16MX8 | 8 | 134217728 bit | SERIAL | 108MHz | 1 | 3V | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST25VF020-20-4C-QAE-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2004 | SST25 | Active | 3 (168 Hours) | 8 | 3.3V | ROHS3 Compliant | No | 8 | 8-WDFN Exposed Pad | SPI, Serial | 2 Mb | Surface Mount | 0°C~70°C TA | CMOS | 10mA | e3 | Matte Tin (Sn) - annealed | DUAL | SST25VF020 | 1.27mm | 23 ns | 2Mb 256K x 8 | Non-Volatile | 18b | 2.7V~3.6V | 8 | Synchronous | 8b | 20MHz | 0.000015A | 8b | 100 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | SPI | FLASH | SPI | 20μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CAT34C02VP2I-GT4 | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | no | Obsolete | 1 (Unlimited) | 8 | 3mm | ROHS3 Compliant | 8-WFDFN Exposed Pad | 2mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.8mm | 1 | e4 | NICKEL PALLADIUM GOLD | DUAL | 260 | 5V | 40 | 8 | YES | 0.5mm | R-PDSO-N8 | 1.7V | COMMERCIAL | 5.5V | 900ns | 2Kb 256 x 8 | Non-Volatile | 1.7V~5.5V | 256X8 | 8 | 2048 bit | SERIAL | 400kHz | 5ms | I2C | EEPROM | I2C | 5ms |
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