Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
AT45DB321C-CI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1997 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 24-TBGA, CSPBGA | Surface Mount | -40°C~85°C TC | FLASH | AT45DB321 | 24-CBGA (6x8) | 32Mb 528Bytes x 8192 pages | Non-Volatile | 2.7V~3.6V | 40MHz | FLASH | SPI | 15ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
FT24C02A-UTG-T | Fremont Micro Devices Ltd | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Cut Tape (CT) | 2010 | yes | Discontinued | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | unknown | 3mm | Surface Mount | -40°C~85°C | CMOS | SYNCHRONOUS | 1.1mm | 1 | e4 | NICKEL PALLADIUM GOLD | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 0.65mm | 2.5V | 5.5V | 550ns | 2Kb 256 x 8 | Non-Volatile | 1.8V~5.5V | 8 | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V06S55J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 3.3V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 3.6V | 3V | 128 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 180mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 3-STATE | 55 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 0.005A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70261S25PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 5V | 2 | 14mm | Non-RoHS Compliant | Contains Lead | 100 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | TQFP | Parallel | 5.5V | not_compliant | 4.5V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 345mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | INDUSTRIAL | 0.5mm | SRAMs | Not Qualified | 5V | 3-STATE | 25 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | Asynchronous | 0.03A | 16b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR93G66F-3AGTE2 | ROHM Semiconductor | 0.9254 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Cut Tape (CT) | Active | 1 (Unlimited) | 8 | 5mm | ROHS3 Compliant | SEATED HT-CALCULATED, ALSO AVAILABLE 1.7V-2.5V OPERATES WITH 1MHZ, 2.5V-4.5V OPERATES WITH 2MHZ | 8-SOIC (0.173, 4.40mm Width) | 4.4mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.71mm | 1 | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 4.5V | 5.5V | 4Kb 256 x 16 | Non-Volatile | 1.7V~5.5V | 256X16 | 16 | 4096 bit | SERIAL | 3MHz | 5ms | 3-WIRE | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q16DVUZIG TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | SpiFlash® | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 8-UDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16Mb 2M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL128P11FFIS13 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | GL-P | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 64 | 64-LBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 110ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR25S640FV-WE2 | ROHM Semiconductor | 0.9892 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Surface Mount | Tape & Reel (TR) | 2010 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.4mm | ROHS3 Compliant | Lead Free | 8 | SEATED HGT-NOM | 8-LSSOP (0.173, 4.40mm Width) | SPI, Serial | 64 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.35mm | 1 | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | BR25S640 | 8 | 0.65mm | 1.7V | Not Qualified | 5.5V | 64Kb 8K x 8 | Non-Volatile | 1.7V~5.5V | 8 | 20MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S34MS08G201BHB000 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Automotive, AEC-Q100, MS-2 | Discontinued | 3 (168 Hours) | 63 | 11mm | ROHS3 Compliant | 63-VFBGA | 9mm | Surface Mount | -40°C~105°C TA | FLASH - NAND | ASYNCHRONOUS | 1mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 0.8mm | R-PBGA-B63 | 1.7V | 1.95V | 8Gb 1G x 8 | Non-Volatile | 1.7V~1.95V | 1GX8 | 8 | 8589934592 bit | 1.8V | FLASH | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "25AA080D-I/S16K") |
25AA080D-I/S16K | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Active | 1 (Unlimited) | ROHS3 Compliant | Die | Surface Mount | -40°C~85°C TA | EEPROM | 25AA080D | Die | 8Kb 1K x 8 | Non-Volatile | 1.8V~5.5V | 10MHz | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24LC512-I/MF | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2005 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-VDFN Exposed Pad | 2-Wire, I2C, Serial | No SVHC | 512 kb | 950μm | 6mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 5mA | e3 | DUAL | 260 | 4.5V | 40 | 24LC512 | 8 | 1.27mm | 2.5V | 3/5V | 5.5V | 900ns | 512Kb 64K x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
RMLV0416EGSB-4S2#AA1 | Renesas Electronics America | 3.7769 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | Tube | yes | Active | 3 (168 Hours) | 44 | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | CMOS | ASYNCHRONOUS | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 44 | YES | R-PDSO-G44 | 2.7V | 3.6V | 4Mb 256K x 16 | Volatile | 2.7V~3.6V | 256KX16 | 16 | 4194304 bit | 45 ns | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S99GL256P0030 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT45DB321D-MU | Adesto Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 1997 | yes | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.A | 3.3V | 6mm | RoHS Compliant | Lead Free | No | 8 | 8-VDFN Exposed Pad | SPI, Serial | No SVHC | 32 Mb | Surface Mount | -40°C~85°C TC | CMOS | 15mA | 1mm | 1 | 15mA | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 40 | 8 | 1.27mm | 2.7V | 3.6V | 6 ns | 32Mb 528Bytes x 8192 pages | Non-Volatile | 1b | 2.7V~3.6V | 32MX1 | 1 | Synchronous | 8b | 66MHz | 8b | 2.7V | 512B | FLASH | SPI | 6ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
NDT16PFJ-8KIT | Insignis Technology Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 7 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 96-VFBGA | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | 20ns | 1Gb 64M x 16 | Volatile | 1.425V~1.575V | 800MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C16M32MS-6BIN | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Discontinued | 3 (168 Hours) | 90 | 1 | 13mm | AUTO/SELF REFRESH | 90-VFBGA | compliant | 8mm | Surface Mount | -40°C~85°C TA | SDRAM - Mobile SDRAM | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.8V | YES | 0.8mm | R-PBGA-B90 | 1.7V | 1.95V | 5.4ns | 512Mb 16M x 32 | Volatile | 1.7V~1.95V | 16MX32 | 32 | 536870912 bit | 166MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL064N90TFI040 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Surface Mount | Tray | 2008 | GL-N | Active | 3 (168 Hours) | 48 | 3A991.B.1.A | 18.4mm | ROHS3 Compliant | Lead Free | Tin | No | 48 | 48-TFSOP (0.724, 18.40mm Width) | No SVHC | 64 Mb | 1.2mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | 8542.32.00.51 | 1 | 50mA | e3 | DUAL | 260 | 3V | 40 | 0.5mm | 2.7V | 3/3.3V | 3.6V | 85°C | 64Mb 8M x 8 4M x 16 | Non-Volatile | 2.7V~3.6V | 4MX16 | 16 | Asynchronous | 16b | 0.000005A | 90 ns | 8 | 3V | YES | YES | YES | 8127 | 8/16words | YES | YES | FLASH | Parallel | 90ns | 8K64K | BOTTOM | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V25761SA183BG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 119-BGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | IDT71V25761 | 119-PBGA (14x22) | 5.5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 183MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT29F256G08APEDBJ6-12:D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2016 | Obsolete | 3 (168 Hours) | 3.3V | ROHS3 Compliant | Surface Mount | 0°C~70°C TA | FLASH - NAND | 132-LBGA (12x18) | 256Gb 32G x 8 | Non-Volatile | 2.7V~3.6V | 83MHz | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
DS2030Y-100# | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | yes | Obsolete | 3 (168 Hours) | 256 | 27mm | ROHS3 Compliant | 256-BGA | 27mm | Surface Mount | -40°C~85°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 8.72mm | 1 | e1 | TIN SILVER COPPER | BOTTOM | 245 | 5V | 30 | 256 | YES | 1.27mm | S-PBGA-B256 | 4.5V | COMMERCIAL | 5.5V | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | 32KX8 | 8 | 262144 bit | 100 ns | NVSRAM | Parallel | 100ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT28EW01GABA1HPC-0SIT | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tray | Active | 3 (168 Hours) | 64 | 13mm | ROHS3 Compliant | 64-LBGA | 11mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.4mm | 1 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | 260 | 3V | 30 | YES | 1mm | R-PBGA-B64 | 2.7V | 3.6V | 95ns | 1Gb 128M x 8 64M x 16 | Non-Volatile | 2.7V~3.6V | 64MX16 | 16 | 1073741824 bit | 3V | FLASH | Parallel | 60ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL128LAGMFM003 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | 2016 | Automotive, AEC-Q100, FL-L | Active | 3 (168 Hours) | 16 | 10.3mm | ROHS3 Compliant | IT ALSO HAVE MEMORY WIDTH X 1 | 16-SOIC (0.295, 7.50mm Width) | 7.5mm | Surface Mount | -40°C~125°C TA | FLASH - NOR | SYNCHRONOUS | 2.65mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G16 | 2.7V | 3.6V | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 32MX4 | 4 | 134217728 bit | SERIAL | 133MHz | 2 | 3V | FLASH | SPI - Quad I/O, QPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
NDL26PFG-9MIT | Insignis Technology Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 96-TFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | 20ns | 2Gb 128M x 16 | Volatile | 1.283V~1.45V | 933MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q16BVSSIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 2010 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 3.3V | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 16 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2.16mm | 1 | 18mA | DUAL | 3V | 8 | 1.27mm | 2.7V | 3.6V | 6 ns | 16Mb 2M x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 104MHz | 0.000005A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | 256B | SPI | FLASH | SPI - Quad I/O | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61VPS102436B-166B3LI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | Active | 3 (168 Hours) | 165 | 3A991.B.2.A | 15mm | ROHS3 Compliant | 165-TBGA | 13mm | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 1.2mm | 8542.32.00.41 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 260 | 2.5V | 10 | 165 | YES | 1mm | R-PBGA-B165 | 2.375V | Not Qualified | 2.5V | 2.625V | 3-STATE | 3.5ns | 36Mb 1M x 36 | Volatile | 0.34mA | 2.375V~2.625V | 1MX36 | 36 | 37748736 bit | 166MHz | 0.12A | COMMON | 2.38V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70261L15PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | YES | 0.5mm | SRAMs | 5V | 3-STATE | 15 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | 0.005A | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
25AA320AT-I/MNY | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 3mm | ROHS3 Compliant | Lead Free | No | 8 | 8-WFDFN Exposed Pad | SPI, Serial | 32 kb | 2mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 5mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 2.5V | 40 | 25AA320A | 8 | 0.5mm | 160 ns | TS 16949 | 32Kb 4K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93C56C-E/SN | Microchip Technology | 0.3480 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | Serial | 2 kb | 3.9mm | Surface Mount | -40°C~125°C TA | CMOS | 1.75mm | 1 | 2mA | e3 | DUAL | 260 | 5V | 40 | 93C56C | 8 | 1.27mm | 5V | 200 ns | 2Kb 256 x 8 128 x 16 | Non-Volatile | 4.5V~5.5V | 16 | 3MHz | 0.000005A | 8 | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 2ms | MICROWIRE | EEPROM | SPI | 2ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
BR24T08FV-WE2 | ROHM Semiconductor | 0.3589 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | yes | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | Copper, Tin | 8 | 8-LSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 8 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.35mm | 1 | e3 | Matte Tin (Sn) | DUAL | 225 | 2.5V | NOT SPECIFIED | BR24T08 | 0.65mm | 1.6V | Not Qualified | 5.5V | 900 ns | 8Kb 1K x 8 | Non-Volatile | 0.002mA | 1.6V~5.5V | 8 | 400kHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DMMR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT46V16M16TG-75:F | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2009 | Obsolete | 2 (1 Year) | 66 | EAR99 | 2.5V | 1 | 22.22mm | Non-RoHS Compliant | Contains Lead | No | 66 | AUTO/SELF REFRESH | 66-TSSOP (0.400, 10.16mm Width) | 256 Mb | Surface Mount | 0°C~70°C TA | SDRAM - DDR | 1.2mm | 8542.32.00.24 | 1 | 185mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 235 | 2.5V | 30 | MT46V16M16 | 66 | 0.65mm | 2.3V | 2.7V | 3-STATE | 750ps | 256Mb 16M x 16 | Volatile | 15b | 2.3V~2.7V | 16MX16 | 16 | 16b | 133MHz | 0.004A | COMMON | 8192 | DRAM | Parallel | 15ns | 248 | 248 |
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