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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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Items : %s%s

SoC

Additional Feature

  • ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
  • ALSO OPERATES AT 0.85V
  • ALSO OPERATES AT 0.92-0.98 V SUPPLY
  • ALSO OPERATES WITH 0.85 VOLT
  • GPIO WITH FOUR 32-BIT BANKS
  • IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)
  • IT ALSO OPERATES AT 0.95V NOMINAL VCC
  • LG-MIN, WD-MIN
  • LG-MIN,WD-MIN
  • PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

Contact Plating

  • Copper, Silver, Tin

ECCN Code

  • 3A001.A.2.C
  • 3A991
  • 3A991.D
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 15 Weeks
  • 16 Weeks
  • 2 Weeks
  • 22 Weeks
  • 25 Weeks
  • 26 Weeks
  • 3 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks
  • 99 Weeks

HTS Code

  • 8542.31.00.01
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e3

Lifecycle Status

  • IN PRODUCTION (Last Updated: 1 month ago)
  • IN PRODUCTION (Last Updated: 2 days ago)
  • IN PRODUCTION (Last Updated: 2 weeks ago)
  • IN PRODUCTION (Last Updated: 3 days ago)
  • IN PRODUCTION (Last Updated: 3 weeks ago)
  • OBSOLETE (Last Updated: 1 month ago)
  • OBSOLETE (Last Updated: 2 days ago)
  • OBSOLETE (Last Updated: 3 weeks ago)

Max Operating Temperature

  • 100°C
  • 125°C
  • 85°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1 (Unlimited)
  • 1 (Unlimited)
  • 2A (4 Weeks)
  • 3
  • 3 (168 Hours)
  • 3 (168 Hours)
  • 4 (72 Hours)
  • Not Applicable

Mount

  • Surface Mount

Number of Pins

  • 1152
  • 1156
  • 144
  • 2
  • 208
  • 225
  • 256
  • 288
  • 325
  • 400
  • 484
  • 485
  • 676
  • 896
  • 900

Number of Terminals

  • 1517

Number of Terminations

  • 1152
  • 144
  • 208
  • 225
  • 256
  • 288
  • 325
  • 400
  • 484
  • 485
  • 536
  • 625
  • 672
  • 676
  • 780
  • 784
  • 896
  • 900

Operating Temperature

  • -30°C~85°C
  • -40°C~100°C TJ
  • -40°C~125°C TJ
  • -40°C~85°C
  • -55°C~125°C TJ
  • 0°C~100°C TJ
  • 0°C~85°C TJ

Package / Case

  • 100-LQFP
  • 1152-BBGA, FCBGA
  • 1156-BBGA, FCBGA
  • 144-LQFP
  • 1517-BBGA, FCBGA
  • 1760-BBGA, FCBGA
  • 1924-BBGA, FCBGA
  • 208-BFQFP
  • 225-LFBGA, CSPBGA
  • 2397-BBGA, FCBGA
  • 256-LBGA
  • 256-LFBGA
  • 288-TFBGA, CSPBGA
  • 2912-BBGA, FCBGA
  • 325-TFBGA, CSPBGA
  • 400-LFBGA
  • 400-LFBGA, CSPBGA
  • 449-BGA
  • 484-BBGA, FCBGA
  • 484-BFBGA
  • 484-BFBGA, FCBGA
  • 484-BGA
  • 484-FBGA
  • 484-FBGA, FCBGA
  • 484-LFBGA, CSPBGA
  • 536-LFBGA, CSPBGA
  • 625-BFBGA, FCBGA
  • 64-LQFP
  • 672-BBGA, FCBGA
  • 672-FBGA
  • 676-BBGA, FCBGA
  • 676-BGA
  • 780-BBGA, FCBGA
  • 784-BFBGA, FCBGA
  • 896-BBGA, FCBGA
  • 896-BGA
  • 900-BBGA, FCBGA
  • BGA
  • Module

Packaging

  • Bulk
  • Tape & Reel (TR)
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Obsolete

Pbfree Code

  • no
  • yes

Peak Reflow Temperature (Cel)

  • 225
  • 235
  • 245
  • 250
  • 260
  • NOT SPECIFIED

Published

  • 1997
  • 2000
  • 2001
  • 2002
  • 2003
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • Arria 10 SX
  • Arria V ST
  • Arria V SX
  • Automotive, AEC-Q100, Cyclone® V SE
  • Automotive, AEC-Q100, SmartFusion®2
  • Automotive, AEC-Q100, Zynq®-7000 XA
  • BCM7405
  • Cyclone® V SE
  • Cyclone® V ST
  • Cyclone® V SX
  • Sipeed MAIX-I
  • SmartFusion®
  • SmartFusion®2
  • Stratix® 10 SX
  • Zynq® UltraScale+™ MPSoC CG
  • Zynq® UltraScale+™ MPSoC EG
  • Zynq® UltraScale+™ MPSoC EV
  • Zynq®-7000

Subcategory

  • Field Programmable Gate Arrays
  • Other Microprocessor ICs
  • Other uPs/uCs/Peripheral ICs

Supplier Device Package

  • 1152-FBGA, FC (35x35)
  • 1152-FCBGA (35x35)
  • 144-TQFP (20x20)
  • 1517-FBGA, FC (40x40)
  • 1517-FCBGA (40x40)
  • 208-PQFP (28x28)
  • 256-FPBGA (17x17)
  • 288-CSP (11x11)
  • 325-CSPBGA (11x11)
  • 400-CSPBGA (17x17)
  • 400-VFBGA (17x17)
  • 484-CSPBGA (19x19)
  • 484-FBGA (19x19)
  • 484-FCBGA (19x19)
  • 484-FPBGA (23x23)
  • 485-CSBGA (19x19)
  • 485-FCBGA (19x19)
  • 672-UBGA (23x23)
  • 676-FBGA (27x27)
  • 676-FCBGA (27x27)
  • 784-FCBGA (23x23)
  • 896-FBGA (31x31)
  • 900-FCBGA (31x31)

Surface Mount

  • YES

Technology

  • CMOS

Terminal Finish

  • MATTE TIN
  • Matte Tin (Sn)
  • Pure Matte Tin (Sn)
  • TIN LEAD
  • TIN LEAD SILVER
  • TIN LEAD/TIN LEAD SILVER
  • TIN SILVER COPPER
  • Tin/Lead (Sn/Pb)
  • Tin/Lead/Silver (Sn/Pb/Ag)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form

  • BALL
  • GULL WING

Terminal Position

  • BOTTOM
  • QUAD

Weight

  • 1.319103g
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Lifecycle Status Mount Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Max Operating Temperature Min Operating Temperature Operating Supply Voltage Length RoHS Status Lead Free Contact Plating Radiation Hardening Number of Pins Additional Feature Package / Case Interface Max Supply Voltage Reach Compliance Code Min Supply Voltage Frequency Width Operating Temperature Technology Operating Supply Current Height Seated (Max) HTS Code Max Frequency JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Base Part Number Temperature Grade Surface Mount Terminal Pitch JESD-30 Code Supply Voltage-Min (Vsup) Operating Temperature (Max) Operating Temperature (Min) Subcategory Qualification Status Power Supplies Supply Voltage-Max (Vsup) Number of Outputs Data Rate Supplier Device Package Core Architecture Speed Number of Inputs Memory Size Core Processor RAM Size Number of I/O Boundary Scan Data Bus Width Bus Compatibility Architecture uPs/uCs/Peripheral ICs Type Peripherals RAM (words) Number of Gates Primary Attributes Number of Logic Blocks (LABs) Number of Logic Elements/Cells Speed Grade Programmable Logic Type Number of Logic Cells Number of Registers Flash Size Connectivity
    M2S090-1FCSG325I M2S090-1FCSG325I Microsemi 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 10 Weeks IN PRODUCTION (Last Updated: 3 weeks ago) Tray 2015 SmartFusion®2 Active 3 (168 Hours) 325 1.2V RoHS Compliant 325 LG-MIN, WD-MIN 325-TFBGA, CSPBGA -40°C~100°C TJ CMOS e3 MATTE TIN BOTTOM BALL NOT SPECIFIED 1.2V NOT SPECIFIED YES 0.5mm Field Programmable Gate Arrays Not Qualified 180 166MHz ARM® Cortex®-M3 64KB 180 MCU, FPGA DDR, PCIe, SERDES FPGA - 90K Logic Modules 1 FIELD PROGRAMMABLE GATE ARRAY 512KB CANbus, Ethernet, I2C, SPI, UART/USART, USB
    M2S005S-1VF400 M2S005S-1VF400 Microsemi 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 12 Weeks IN PRODUCTION (Last Updated: 1 month ago) Tray 2015 SmartFusion®2 Active 3 (168 Hours) Non-RoHS Compliant 400-LFBGA 0°C~85°C TJ 400-VFBGA (17x17) 166MHz ARM® Cortex®-M3 64KB 169 MCU, FPGA DDR FPGA - 5K Logic Modules 128KB CANbus, Ethernet, I2C, SPI, UART/USART, USB
    5ASXMB5E4F31I3G 5ASXMB5E4F31I3G Intel 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Active 3 (168 Hours) RoHS Compliant FIELD PROGRAMMABLE GATE ARRAY
    10AS027H1F34I1HG 10AS027H1F34I1HG Intel 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tray Arria 10 SX Active 3 (168 Hours) RoHS Compliant 1152-BBGA, FCBGA -40°C~100°C TJ 1.5GHz Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 384 MCU, FPGA DMA, POR, WDT FPGA - 270K Logic Elements EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    A2F200M3F-1FGG256 A2F200M3F-1FGG256 Microsemi 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Surface Mount Tray 2013 SmartFusion® Active 3 (168 Hours) 85°C 0°C 1.5V RoHS Compliant Lead Free Copper, Silver, Tin No 256 256-LBGA EBI/EMI, Ethernet, I2C, SPI, UART, USART 1.575V 1.425V 100MHz 0°C~85°C TJ 3mA 120MHz A2F200 400 kbps 256-FPBGA (17x17) ARM 100MHz 4.5kB ARM® Cortex®-M3 64KB MCU - 25, FPGA - 66 MCU, FPGA DMA, POR, WDT 200000 ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 2500 1 4608 256KB EBI/EMI, Ethernet, I2C, SPI, UART/USART
    XCZU2EG-2SBVA484E XCZU2EG-2SBVA484E Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 11 Weeks Tray 2013 Zynq® UltraScale+™ MPSoC EG yes Active 4 (72 Hours) ROHS3 Compliant 484-BFBGA, FCBGA 0°C~100°C TJ 8542.31.00.01 NOT SPECIFIED NOT SPECIFIED 533MHz, 600MHz, 1.3GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB 82 MCU, FPGA DMA, WDT Zynq®UltraScale+™ FPGA, 103K+ Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    M2S025-FG484I M2S025-FG484I Microsemi 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Tray SmartFusion®2 Active 3 (168 Hours) 484 23mm Non-RoHS Compliant 484-BGA not_compliant 23mm -40°C~100°C TJ CMOS 2.44mm 8542.39.00.01 e0 Tin/Lead (Sn/Pb) BOTTOM BALL NOT SPECIFIED 1.2V NOT SPECIFIED YES 1mm S-PBGA-B484 1.14V Field Programmable Gate Arrays Not Qualified 1.2V 1.26V 267 166MHz 267 ARM® Cortex®-M3 64KB 267 MCU, FPGA DDR, PCIe, SERDES FPGA - 25K Logic Modules FIELD PROGRAMMABLE GATE ARRAY 27696 256KB CANbus, Ethernet, I2C, SPI, UART/USART, USB
    M2S025-VFG256 M2S025-VFG256 Microsemi 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 11 Weeks Tray 2015 SmartFusion®2 Active 3 (168 Hours) 256 14mm RoHS Compliant LG-MIN, WD-MIN 256-LBGA 14mm 0°C~85°C TJ CMOS 1.56mm 8542.39.00.01 e3 MATTE TIN BOTTOM BALL NOT SPECIFIED 1.2V NOT SPECIFIED YES 0.8mm S-PBGA-B256 1.14V Field Programmable Gate Arrays Not Qualified 1.2V 1.26V 138 166MHz 138 ARM® Cortex®-M3 64KB 138 MCU, FPGA DDR, PCIe, SERDES FPGA - 25K Logic Modules FIELD PROGRAMMABLE GATE ARRAY 27696 256KB CANbus, Ethernet, I2C, SPI, UART/USART, USB
    M2S060T-FG676I M2S060T-FG676I Microsemi 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 10 Weeks IN PRODUCTION (Last Updated: 3 weeks ago) Tray 2015 SmartFusion®2 Active 3 (168 Hours) 676 27mm Non-RoHS Compliant 676-BGA not_compliant 27mm -40°C~100°C TJ CMOS 2.44mm 8542.39.00.01 e0 Tin/Lead (Sn/Pb) BOTTOM BALL NOT SPECIFIED 1.2V NOT SPECIFIED YES 1mm S-PBGA-B676 1.14V Field Programmable Gate Arrays Not Qualified 1.2V 1.26V 387 166MHz 387 ARM® Cortex®-M3 64KB 387 MCU, FPGA DDR, PCIe, SERDES FPGA - 60K Logic Modules FIELD PROGRAMMABLE GATE ARRAY 56520 256KB CANbus, Ethernet, I2C, SPI, UART/USART, USB
    XCZU7EV-2FFVC1156I XCZU7EV-2FFVC1156I Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 11 Weeks Tray 2016 Zynq® UltraScale+™ MPSoC EV Active 4 (72 Hours) ROHS3 Compliant 1156-BBGA, FCBGA -40°C~100°C TJ 8542.31.00.01 NOT SPECIFIED NOT SPECIFIED 533MHz, 600MHz, 1.3GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB 360 MCU, FPGA DMA, WDT Zynq®UltraScale+™ FPGA, 504K+ Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    XCZU17EG-2FFVB1517I XCZU17EG-2FFVB1517I Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 11 Weeks Tray 2016 Zynq® UltraScale+™ MPSoC EG Active 4 (72 Hours) ROHS3 Compliant 1517-BBGA, FCBGA -40°C~100°C TJ 8542.31.00.01 NOT SPECIFIED NOT SPECIFIED 533MHz, 600MHz, 1.3GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB 644 MCU, FPGA DMA, WDT Zynq®UltraScale+™ FPGA, 926K+ Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    1SX250HN3F43E2LG 1SX250HN3F43E2LG Intel 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 12 Weeks Stratix® 10 SX Active 3 (168 Hours) 1760-BBGA, FCBGA compliant 0°C~100°C TJ 1.5GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB MCU, FPGA MICROPROCESSOR CIRCUIT DMA, WDT FPGA - 2500K Logic Elements EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    10AS057K1F35I1SG 10AS057K1F35I1SG Intel 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tray Arria 10 SX Discontinued 3 (168 Hours) 35mm RoHS Compliant 1152-BBGA, FCBGA unknown 35mm -40°C~100°C TJ 3.5mm 8542.39.00.01 BOTTOM BALL 0.9V YES 1mm S-PBGA-B1152 0.87V 0.93V 1.5GHz Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 396 MCU, FPGA DMA, POR, WDT FPGA - 570K Logic Elements FIELD PROGRAMMABLE GATE ARRAY EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    M2S005-1VF400I M2S005-1VF400I Microsemi 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks IN PRODUCTION (Last Updated: 3 weeks ago) Tray 2009 SmartFusion®2 Active 3 (168 Hours) 1.2V Non-RoHS Compliant 400 400-LFBGA CAN, Ethernet, I2C, SPI, UART, USART, USB 1.26V unknown 1.14V 166MHz -40°C~100°C TJ M2S005 ARM ARM® Cortex®-M3 64KB 169 MCU, FPGA DDR FPGA - 5K Logic Modules FIELD PROGRAMMABLE GATE ARRAY 128KB CANbus, Ethernet, I2C, SPI, UART/USART, USB
    XC7Z045-3FFV676E XC7Z045-3FFV676E Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 10 Weeks Bulk 2009 Zynq®-7000 Active 4 (72 Hours) ROHS3 Compliant 676-BBGA, FCBGA 0°C~100°C TJ 1GHz Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 MCU, FPGA DMA Kintex™-7 FPGA, 350K Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    1SX280HU3F50I1VG 1SX280HU3F50I1VG Intel 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 12 Weeks Stratix® 10 SX Active 3 (168 Hours) 2397-BBGA, FCBGA compliant -40°C~100°C TJ 1.5GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB MCU, FPGA MICROPROCESSOR CIRCUIT DMA, WDT FPGA - 2800K Logic Elements EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    1SX250HU1F50E2VG 1SX250HU1F50E2VG Intel 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 12 Weeks Stratix® 10 SX Active 3 (168 Hours) 2397-BBGA, FCBGA compliant 0°C~100°C TJ 1.5GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB MCU, FPGA MICROPROCESSOR CIRCUIT DMA, WDT FPGA - 2500K Logic Elements EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    XCZU7EV-1FFVC1156E XCZU7EV-1FFVC1156E Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 11 Weeks Tray 2016 Zynq® UltraScale+™ MPSoC EV Active 4 (72 Hours) ROHS3 Compliant 1156-BBGA, FCBGA 0°C~100°C TJ 8542.31.00.01 NOT SPECIFIED NOT SPECIFIED 500MHz, 600MHz, 1.2GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB 360 MCU, FPGA DMA, WDT Zynq®UltraScale+™ FPGA, 504K+ Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    M2S005-1FG484 M2S005-1FG484 Microsemi 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks IN PRODUCTION (Last Updated: 3 weeks ago) Tray 2009 SmartFusion®2 Active 3 (168 Hours) 85°C 0°C Non-RoHS Compliant 484-BGA CAN, Ethernet, I2C, SPI, UART, USART, USB 166MHz 0°C~85°C TJ M2S005 484-FPBGA (23x23) ARM 166MHz ARM® Cortex®-M3 64KB 209 MCU, FPGA DDR FPGA - 5K Logic Modules 128KB CANbus, Ethernet, I2C, SPI, UART/USART, USB
    BCM85622IFSBG BCM85622IFSBG Broadcom 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 Active 1 (Unlimited) ROHS3 Compliant
    XCZU11EG-3FFVB1517E XCZU11EG-3FFVB1517E Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 11 Weeks Tray 2016 Zynq® UltraScale+™ MPSoC EG Active 4 (72 Hours) ROHS3 Compliant 1517-BBGA, FCBGA 0°C~100°C TJ 8542.31.00.01 NOT SPECIFIED NOT SPECIFIED 600MHz, 667MHz, 1.5GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB 488 MCU, FPGA DMA, WDT Zynq®UltraScale+™ FPGA, 653K+ Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    XC7Z030-2FBG484E XC7Z030-2FBG484E Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 10 Weeks Tray 2009 Zynq®-7000 Active 4 (72 Hours) 484 EAR99 23mm ROHS3 Compliant No 484 484-BBGA, FCBGA CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 800MHz 0°C~100°C TJ CMOS 2.54mm 8542.39.00.01 e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL 250 1V 30 XC7Z030 YES 1mm 0.95V 1.05V ARM Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ 256KB 130 YES 32b CAN; ETHERNET; I2C; SPI; UART; USB MCU, FPGA DMA 256000 Kintex™-7 FPGA, 125K Logic Cells -2 CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    M2S005-VFG256 M2S005-VFG256 Microsemi 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 11 Weeks IN PRODUCTION (Last Updated: 1 month ago) Tray 2015 SmartFusion®2 Active 3 (168 Hours) 256 14mm RoHS Compliant LG-MIN, WD-MIN 256-LFBGA 14mm 0°C~85°C TJ CMOS 1.56mm 8542.39.00.01 e3 MATTE TIN BOTTOM BALL NOT SPECIFIED 1.2V NOT SPECIFIED YES 0.8mm S-PBGA-B256 1.14V Field Programmable Gate Arrays Not Qualified 1.2V 1.26V 161 166MHz 161 ARM® Cortex®-M3 64KB 161 MCU, FPGA DDR FPGA - 5K Logic Modules FIELD PROGRAMMABLE GATE ARRAY 6060 128KB CANbus, Ethernet, I2C, SPI, UART/USART, USB
    10AS027E3F29I2LG 10AS027E3F29I2LG Altera 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 14 Weeks 2016 Active 780 29mm Non-RoHS Compliant 29mm CMOS 3.35mm 8542.39.00.01 BOTTOM BALL NOT SPECIFIED 0.9V NOT SPECIFIED INDUSTRIAL YES 1mm S-PBGA-B780 0.87V 100°C -40°C Field Programmable Gate Arrays Not Qualified 0.9V 0.93V 360 360 FIELD PROGRAMMABLE GATE ARRAY 270000
    M2S050TS-FG484I M2S050TS-FG484I Microsemi 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 10 Weeks IN PRODUCTION (Last Updated: 2 weeks ago) Tray 2015 SmartFusion®2 no Active 3 (168 Hours) 484 23mm Non-RoHS Compliant 484-BGA not_compliant 23mm -40°C~100°C TJ 2.44mm 8542.39.00.01 e0 Tin/Lead (Sn/Pb) BOTTOM BALL NOT SPECIFIED 1.2V NOT SPECIFIED YES 1mm S-PBGA-B484 1.14V 1.26V 166MHz ARM® Cortex®-M3 64KB 267 MCU, FPGA DDR, PCIe, SERDES FPGA - 50K Logic Modules FIELD PROGRAMMABLE GATE ARRAY 256KB CANbus, Ethernet, I2C, SPI, UART/USART, USB
    A2F200M3F-1PQG208I A2F200M3F-1PQG208I Microsemi 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 12 Weeks Tray 2015 SmartFusion® Active 3 (168 Hours) 100°C -40°C RoHS Compliant 208 208-BFQFP EBI/EMI, Ethernet, I2C, SPI, UART, USART 100MHz -40°C~100°C TJ 100MHz A2F200 208-PQFP (28x28) ARM 100MHz ARM® Cortex®-M3 64KB MCU - 22, FPGA - 66 MCU, FPGA DMA, POR, WDT ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 8 256KB EBI/EMI, Ethernet, I2C, SPI, UART/USART
    XCZU17EG-L2FFVD1760E XCZU17EG-L2FFVD1760E Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 11 Weeks Tray 2016 Zynq® UltraScale+™ MPSoC EG Active 4 (72 Hours) ROHS3 Compliant ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY 1760-BBGA, FCBGA 0°C~100°C TJ CMOS 8542.31.00.01 BOTTOM BALL NOT SPECIFIED 0.72V NOT SPECIFIED YES R-PBGA-B1760 0.698V 0.742V 533MHz, 600MHz, 1.3GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB 308 MCU, FPGA MICROPROCESSOR CIRCUIT DMA, WDT Zynq®UltraScale+™ FPGA, 926K+ Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    1SX250HN2F43E2VG 1SX250HN2F43E2VG Intel 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 12 Weeks Stratix® 10 SX Active 3 (168 Hours) 1760-BBGA, FCBGA compliant 0°C~100°C TJ 1.5GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ 256KB MCU, FPGA MICROPROCESSOR CIRCUIT DMA, WDT FPGA - 2500K Logic Elements EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    10AS048E3F29E2LG 10AS048E3F29E2LG Altera 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks 2016 Active 780 29mm Non-RoHS Compliant 29mm CMOS 3.35mm 8542.39.00.01 BOTTOM BALL NOT SPECIFIED 0.9V NOT SPECIFIED OTHER YES 1mm S-PBGA-B780 0.87V 100°C Field Programmable Gate Arrays Not Qualified 0.9V 0.93V 360 360 FIELD PROGRAMMABLE GATE ARRAY 480000
    XCZU7EG-L1FFVC1156I XCZU7EG-L1FFVC1156I Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 11 Weeks Tray 2016 Zynq® UltraScale+™ MPSoC EG Active 4 (72 Hours) ROHS3 Compliant ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY 1156-BBGA, FCBGA -40°C~100°C TJ CMOS 8542.31.00.01 BOTTOM BALL NOT SPECIFIED 0.72V NOT SPECIFIED YES R-PBGA-B1156 0.698V 0.742V 500MHz, 600MHz, 1.2GHz Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 256KB 360 MCU, FPGA MICROPROCESSOR CIRCUIT DMA, WDT Zynq®UltraScale+™ FPGA, 504K+ Logic Cells CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
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