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M2S060TS-1FGG676I

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Manufacturer No:

M2S060TS-1FGG676I

Manufacturer:

Microsemi

HK JDW NO:

523-M2S060TS-1FGG676I

Package:

676-BGA

Datasheet:

M2S060TS-1FGG676I

Description:

676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V

Quantity:

In Stock : 999

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Product Details

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This SoC is built on ARM? Cortex?-M3 core processor(s).


This SoC is built on ARM? Cortex?-M3 core processor(s).Assigned with the package 676-BGA, this system on a chip comes from the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is a member of the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.In total, this SoC part has 387 I/Os.It is recommended to use a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.A system on a chip benefits from having 676 terminations.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.A SoC chip like this can have 387 outputs.In order to use system on chip, you will need a power supply of 1.2V.A SoC chip with 387 inputs is available.56520 logic cells are present in logic system on chips.There is a flash of 256KB.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060TS-1FGG676I System On Chip (SoC) applications.

  • High-end PLC
  • Keyboard
  • Cyber security for critical applications in the aerospace
  • Networked Media Encode/Decode
  • Level
  • Remote control
  • Personal Computers
  • Defense
  • Servo drive control module
  • Multiprocessor system-on-chips (MPSoCs)
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S060TS-1FGG676I

technical specifications, attributes, parameters and parts with similar specifications to M2S060TS-1FGG676I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 3 weeks ago)

  • Package / Case

    676-BGA

  • Surface Mount

    YES

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Series

    SmartFusion®2

  • JESD-609 Code

    e3

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    676

  • Terminal Finish

    MATTE TIN

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1.2V

  • Terminal Pitch

    1mm

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    S-PBGA-B676

  • Number of Outputs

    387

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.26V

  • Power Supplies

    1.2V

  • Supply Voltage-Min (Vsup)

    1.14V

  • Number of I/O

    387

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Number of Inputs

    387

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Primary Attributes

    FPGA - 60K Logic Modules

  • Number of Logic Cells

    56520

  • Flash Size

    256KB

  • Height Seated (Max)

    2.44mm

  • Length

    27mm

  • Width

    27mm

  • RoHS Status

    RoHS Compliant

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