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Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Contact Finish - Mating Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case Lead Pitch Height Width Mounting Type Operating Temperature HTS Code Contact Resistance Insulation Resistance Type Lead Length JESD-609 Code Terminal Pitch Operating Temperature (Max) Body Length or Diameter Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch Dielectric Withstanding Voltage Contact Finish Termination Feature Pitch Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Device Socket Type Device Type Used On Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post
14-8810-310C 14-8810-310C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 14 EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 14 (2 x 7) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
84-PGM11010-10 84-PGM11010-10 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2009 PGM Active 1 (Unlimited) Solder 105°C -55°C Gold ROHS3 Compliant UL94 V-0 Gold 3A Through Hole -55°C~105°C PGA 4.191mm 3A UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.165 4.19mm 0.100 2.54mm
04-7445-10 04-7445-10 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 700 Elevator Strip-Line™ Active 1 (Unlimited) Solder 4 105°C -55°C Tin ROHS3 Compliant UL94 V-0 Tin 1.5A SIP 2.54mm Through Hole -55°C~105°C SIP 3.81mm 2 Elevated 2.54mm 1.5A UL94 V-0 0.100 2.54mm Tin 200.0μin 5.08μm 200.0μin 5.08μm 4 (1 x 4) Phosphor Bronze Phosphor Bronze 0.150 3.81mm 0.100 2.54mm
26-81250-610C 26-81250-610C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 26 EAR99 Gold 26 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.6 (15.24mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 26 (2 x 13) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
20-1508-31 20-1508-31 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6 Bulk 2006 508 Active 1 (Unlimited) Wire Wrap EAR99 Gold 20 ROHS3 Compliant UL94 V-0 3A 20 STANDARD: UL 94V-0 Through Hole -55°C~125°C DIP, 0.2 (5.08mm) Row Spacing 12.7mm e4 1 inch 2 RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch Closed Frame 0.1 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 20 (2 x 10) Beryllium Copper Brass 0.500 12.70mm 0.100 2.54mm
522-13-132-13-041002 522-13-132-13-041002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
32-6572-10 32-6572-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 57 yes Active 1 (Unlimited) Solder 32 EAR99 Tin 32 ROHS3 Compliant UL94 V-0 1A STANDARD: UL 94V-0 Through Hole 1000000000Ohm DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 2.794mm e3 2.54mm 105°C 2.19 inch 0.9 inch RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V Closed Frame 0.6 mm UL94 V-0 0.100 2.54mm 200.0μin 5.08μm 200.0μin 5.08μm 32 (2 x 16) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
510-91-179-18-095001 510-91-179-18-095001 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (10) OVER NICKEL (100) 179 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier IC SOCKET PGA179
02-0518-11 02-0518-11 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 518 yes Active 1 (Unlimited) Solder EAR99 Gold 2 ROHS3 Compliant UL94 V-0 3A 2 STANDARD: UL 94V-0 2.54mm Through Hole SIP 3.175mm e4 1 RECTANGULAR RND PIN-SKT Open Frame UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 2 (1 x 2) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
225-PLS18003-12 225-PLS18003-12 Aries Electronics 0.0000
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0.00000000 5 Weeks Polyphenylene Sulfide (PPS) PLS yes Active 1 (Unlimited) Solder 225 EAR99 Gold 225 Non-RoHS Compliant Through Hole PGA, ZIF (ZIP) e3 Closed Frame 1A UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm 225 (15 x 15) Beryllium Copper Beryllium Copper 0.125 3.18mm 0.100 2.54mm
123-83-312-41-001101 123-83-312-41-001101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 123 Active 1 (Unlimited) Wire Wrap Gold 12 ROHS3 Compliant UL94 V-0 1A 12 Through Hole -55°C~125°C 10mOhm 10000000000Ohm DIP, 0.3 (7.62mm) Row Spacing 12.954mm 2.54mm 0.597 inch 0.398 inch RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch 1400VAC V Open Frame 0.3 mm UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 12 (2 x 6) Beryllium Copper Brass 0.510 12.95mm 0.100 2.54mm
612-41-636-41-001000 612-41-636-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 download 3 Weeks Active ROHS3 Compliant IC SOCKET
551-90-056-09-041005 551-90-056-09-041005 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 TIN LEAD (200) OVER NICKEL (150) 56 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier IC SOCKET PGA56
510-87-299-20-001101 510-87-299-20-001101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 510 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 1A 299 Through Hole -55°C~125°C 10mOhm PGA 3.175mm Open Frame UL94 V-0 0.100 2.54mm Tin Flash 299 (20 x 20) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
110-13-624-61-001000 110-13-624-61-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
110-83-328-41-105191 110-83-328-41-105191 Preci-Dip 0.0000
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0.00000000 10 Weeks Surface Mount Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 110 Active 1 (Unlimited) Solder EAR99 Gold ROHS3 Compliant UL94 V-0 1A 28 Surface Mount -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.3 (7.62mm) Row Spacing 2.9972mm Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 28 (2 x 14) Beryllium Copper Brass 0.118 3.00mm 0.100 2.54mm
11-0503-20 11-0503-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA), Nylon, Glass Filled Bulk 2006 0503 Active 1 (Unlimited) Wire Wrap 11 EAR99 Gold 11 ROHS3 Compliant UL94 HB 3A STANDARD: UL 94V-0 2.54mm Through Hole SIP 9.144mm 1 RECTANGULAR RND PIN-SKT UL94 HB 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm 11 (1 x 11) Beryllium Copper Brass 0.360 9.14mm 0.100 2.54mm
128-PLS13078-12 128-PLS13078-12 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS) Bulk 2006 PLS Active 1 (Unlimited) Solder 128 125°C -65°C Gold ROHS3 Compliant UL94 V-0 Gold 1A Through Hole -65°C~125°C PGA, ZIF (ZIP) 3.175mm Closed Frame 1A UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.125 3.18mm 0.100 2.54mm
551-10-161-15-005003 551-10-161-15-005003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (10) OVER NICKEL (150) 161 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) - with Nickel (Ni) barrier IC SOCKET PGA161
42-6554-16 42-6554-16 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 55 yes Active 1 (Unlimited) Solder 42 EAR99 Nickel Boron 42 ROHS3 Compliant UL94 V-0 Nickel 1A STANDARD: UL 94V-0 Through Hole 1000000000Ohm DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 2.794mm 2.54mm 200°C 2.69 inch 0.9 inch RECTANGULAR 0.47 inch BELLOWED TYPE 0.1 inch 1000VAC V Closed Frame 0.6 mm UL94 V-0 0.100 2.54mm Nickel Boron 50.0μin 1.27μm 50.0μin 1.27μm 42 (2 x 21) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
511-91-100-13-061003 511-91-100-13-061003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active Non-RoHS Compliant
614-83-610-41-001101 614-83-610-41-001101 Preci-Dip 0.0000
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Min: 1

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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 614 yes Active 1 (Unlimited) Solder EAR99 Gold 10 ROHS3 Compliant UL94 V-0 1A 10 STANDARD: UL 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.6 (15.24mm) Row Spacing 3.4544mm e3 Carrier, Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 10 (2 x 5) Beryllium Copper Brass 0.136 3.45mm 0.100 2.54mm
522-13-068-11-061002 522-13-068-11-061002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
515-13-081-12-071003 515-13-081-12-071003 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks Active ROHS3 Compliant
510-91-081-09-000002 510-91-081-09-000002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (10) OVER NICKEL (100) 81 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA81
346-43-131-41-013000 346-43-131-41-013000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Bulk 2011 346 yes Active 1 (Unlimited) Press-Fit EAR99 Gold 31 78.7mm ROHS3 Compliant Lead Free Copper 31 2.79mm 2.54mm Through Hole -55°C~125°C 8536.90.40.00 SIP e3 3A 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm 31 (1 x 31) Beryllium Copper Brass Alloy 0.175 4.45mm 0.100 2.54mm
511-91-120-13-061003 511-91-120-13-061003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active Non-RoHS Compliant
115-87-650-41-003101 115-87-650-41-003101 Preci-Dip 0.0000
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Min: 1

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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 115 yes Active 1 (Unlimited) Solder EAR99 Gold 50 ROHS3 Compliant UL94 V-0 1A 50 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.6 (15.24mm) Row Spacing 2.413mm e3 Open Frame UL94 V-0 0.100 2.54mm Tin Flash 50 (2 x 25) Beryllium Copper Brass 0.095 2.41mm 0.100 2.54mm
522-93-072-11-061003 522-93-072-11-061003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active Non-RoHS Compliant
515-91-273-21-125003 515-91-273-21-125003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (10) OVER NICKEL (100) 273 Non-RoHS Compliant BERYLLIUM COPPER LOW PROFILE 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA273
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