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Transistor Sockets

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Connector Type Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case Reach Compliance Code Lead Pitch Height Width Mounting Type Weight Operating Temperature Voltage - Rated DC Voltage - Rated AC HTS Code Contact Resistance Insulation Resistance Type Lead Length JESD-609 Code Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Body Length or Diameter Body Breadth Insulation Material Mounting Style Number of Rows PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch Dielectric Withstanding Voltage Contact Finish Termination Feature Pitch Current Rating (Amps) Termination Type PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Device Type Used On Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Contact Configuration
210-13-320-41-001000 210-13-320-41-001000 Mill-Max Manufacturing Corp. 9.1407
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0.00000000 3 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Tube 210 yes Active 1 (Unlimited) Solder EAR99 Gold 20 25.4mm ROHS3 Compliant Copper 20 LOW PROFILE 4.19mm 10.2mm Through Hole -55°C~125°C 8536.90.40.00 DIP, 0.3 (7.62mm) Row Spacing e4 Closed Frame 3A 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 20 (2 x 10) Beryllium Copper Brass Alloy 0.125 3.18mm 0.100 2.54mm
28-6554-16 28-6554-16 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 55 yes Active 1 (Unlimited) Solder 28 EAR99 Nickel Boron 28 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole 1000000000Ohm DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 2.54mm 200°C 1.99 inch 0.9 inch RECTANGULAR 0.47 inch BELLOWED TYPE 0.1 inch 1000VAC V Closed Frame 1A 0.6 mm UL94 V-0 0.100 2.54mm Nickel Boron 50.0μin 1.27μm 50.0μin 1.27μm 28 (2 x 14) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
550-80-169-17-101101 550-80-169-17-101101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 550 Active 1 (Unlimited) Solder EAR99 Tin 169 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm PGA e3 Open Frame 1A UL94 V-0 0.100 2.54mm 169 (17 x 17) Beryllium Copper Brass 0.164 4.16mm 0.100 2.54mm
115-44-648-41-003000 115-44-648-41-003000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks PLASTIC yes Active EAR99 125°C -55°C Straight 17.78mm 48 60.96mm ROHS3 Compliant NOT SPECIFIED Tin 3A LOW PROFILE 150V 100V 8536.90.40.00 10mOhm 10GOhm e3 Polychlorinated 2 2.54mm 15.24 mm IC SOCKET DIP48
D01-9950442 D01-9950442 Harwin Inc. 0.0000
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0.00000000 download 19 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled Tube 2010 D01-995 yes Active 1 (Unlimited) Wire Wrap EAR99 Gold 4 ROHS3 Compliant UL94 V-0 1A 4 SIL Through Hole -55°C~125°C 10mOhm 10000000000Ohm SIP 12.954mm e3 0.1 inch 0.193 inch 0.1 inch 1000VAC V UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 196.9μin 5.00μm 4 (1 x 4) Beryllium Copper Brass 0.510 12.95mm 0.100 2.54mm
116-83-422-41-002101 116-83-422-41-002101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 116 yes Active 1 (Unlimited) Solder EAR99 Gold 22 ROHS3 Compliant UL94 V-0 1A 22 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.4 (10.16mm) Row Spacing 3.175mm e3 Elevated, Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 22 (2 x 11) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
APA-640-T-C APA-640-T-C Samtec Inc. 0.0000
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0.00000000 3 Weeks Through Hole POLYESTER Bulk yes Active Not Applicable EAR99 Male TIN OVER NICKEL (50) Straight 40 ROHS3 Compliant BRASS STANDARD: UL 94V-0 not_compliant e3 2 Tin (Sn) - with Nickel (Ni) barrier 2.54mm IC SOCKET
515-93-128-13-041001 515-93-128-13-041001 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 128 Non-RoHS Compliant NOT SPECIFIED LOW PROFILE 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA128
511-13-056-09-041003 511-13-056-09-041003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 56 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) IC SOCKET PGA56
24-6518-102 24-6518-102 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2007 518 yes Active 1 (Unlimited) Solder 24 EAR99 Gold 24 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 2.54mm Through Hole DIP, 0.6 (15.24mm) Row Spacing 3.175mm e3 0.7 inch 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Open Frame 0.6 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 24 (2 x 12) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
510-13-168-17-101002 510-13-168-17-101002 Mill-Max Manufacturing Corp. 35.0600
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Min: 1

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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 168 ROHS3 Compliant NOT SPECIFIED 1A PGA SOCKET 8536.90.40.00 10000000000Ohm e4 2.54mm 125°C -55°C 1.7 inch 1.7 inch STRAIGHT RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch 1000VAC V Gold (Au) - with Nickel (Ni) barrier SOLDER 0.1 mm IC SOCKET PGA168 17X17
612-41-304-41-001000 612-41-304-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 download 3 Weeks Active ROHS3 Compliant IC SOCKET
115-47-322-41-003000 115-47-322-41-003000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
612-83-318-41-001101 612-83-318-41-001101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 612 yes Active 1 (Unlimited) Solder EAR99 Gold 18 ROHS3 Compliant UL94 V-0 1A 18 STANDARD: UL 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.3 (7.62mm) Row Spacing 7.3914mm e3 Carrier, Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 18 (2 x 9) Beryllium Copper Brass 0.291 7.39mm 0.100 2.54mm
115-87-636-41-001101 115-87-636-41-001101 Preci-Dip 0.0000
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0.00000000 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 115 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 1A 36 Through Hole -55°C~125°C 10mOhm DIP, 0.6 (15.24mm) Row Spacing 2.413mm Open Frame UL94 V-0 0.100 2.54mm Tin Flash 36 (2 x 18) Beryllium Copper Brass 0.095 2.41mm 0.100 2.54mm
614-93-145-15-081001 614-93-145-15-081001 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 145 Non-RoHS Compliant NOT SPECIFIED 1A LOW PROFILE 8536.90.40.00 10000000000Ohm e0 2.54mm 125°C -55°C 1.5 inch 1.5 inch STRAIGHT RECTANGULAR 0.031 inch RND PIN-SKT 0.1 inch 1000VAC V Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier SOLDER 0.1 mm IC SOCKET PGA145 15X15
832-AG10D-ES 832-AG10D-ES TE Connectivity AMP Connectors 0.0000
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0.00000000 download 8 Weeks Polyester Tube 2009 800 yes Active 1 (Unlimited) Solder EAR99 Gold 32 RoHS Compliant Through Hole -55°C~105°C 8536.69.40.40 10mOhm DIP, 0.6 (15.24mm) Row Spacing 2.54mm 1.6 inch 0.7 inch RECTANGULAR 0.18 inch RND PIN-SKT 0.1 inch Open Frame 3A 0.6 mm UL94 V-0 0.100 2.54mm 25.0μin 0.63μm 32 (2 x 16) Copper Alloy 0.125 3.18mm 0.100 2.54mm
117-91-428-41-005000 117-91-428-41-005000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYETHYLENE no Active EAR99 GOLD (10) OVER NICKEL (100) 28 Non-RoHS Compliant BERYLLIUM COPPER 8536.90.40.00 e0 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier IC SOCKET DIP28
317-43-118-41-005000 317-43-118-41-005000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
550-10-356M26-001166 550-10-356M26-001166 Preci-Dip 0.0000
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0.00000000 download 10 Weeks FR4 Epoxy Glass Bulk 2012 550 Active 1 (Unlimited) Solder Gold ROHS3 Compliant Through Hole -55°C~125°C 10mOhm BGA Closed Frame 1A UL94 V-0 0.050 1.27mm 10.0μin 0.25μm 10.0μin 0.25μm 356 (26 x 26) Beryllium Copper Brass 0.098 2.50mm 0.050 1.27mm
522-13-175-16-005002 522-13-175-16-005002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
614-83-328-41-001101 614-83-328-41-001101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 614 yes Active 1 (Unlimited) Solder EAR99 Gold 28 ROHS3 Compliant UL94 V-0 1A 28 STANDARD: UL 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.3 (7.62mm) Row Spacing 3.4544mm e3 Carrier, Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 28 (2 x 14) Beryllium Copper Brass 0.136 3.45mm 0.100 2.54mm
515-93-133-13-045003 515-93-133-13-045003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 133 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA133
AW 127-10/Z-T AW 127-10/Z-T Assmann WSW Components 0.0000
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0.00000000 23 Weeks Active 1 (Unlimited) ROHS3 Compliant e2 Tin/Nickel (Sn/Ni)
101-PLS14030-12 101-PLS14030-12 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS) Bulk 2006 PLS Active 1 (Unlimited) Solder 101 125°C -65°C Gold ROHS3 Compliant UL94 V-0 Gold 1A Through Hole -65°C~125°C PGA, ZIF (ZIP) 3.175mm Closed Frame 1A UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.125 3.18mm 0.100 2.54mm
32-6513-11H 32-6513-11H Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2007 Lo-PRO®file, 513 yes Active 1 (Unlimited) Solder 32 EAR99 Gold 32 ROHS3 Compliant UL94 V-0 Lead Free 3A LOW PROFILE; UL 94V-0 2.54mm Through Hole -55°C~105°C DIP, 0.6 (15.24mm) Row Spacing 3.175mm e4 0.7 inch 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Closed Frame 0.6 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 32 (2 x 16) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
511-13-125-14-071002 511-13-125-14-071002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 125 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) IC SOCKET PGA125
220-7201-55-1902 220-7201-55-1902 3M 0.0000
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0.00000000 download 8 Weeks Through Hole Polyethersulfone (PES), Glass Filled Bulk 1998 Textool™ Active 1 (Unlimited) Socket Solder 20 150°C -55°C Female Gold Straight 20 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 20 SOIC 2.54mm Through Hole 453.59237g -55°C~150°C 1 TΩ SOIC 2 Closed Frame 1.27mm 1A UL94 V-0 1.27 mm Gold 30.0μin 0.76μm 20 (2 x 10) Beryllium Copper Beryllium Copper 0.140 3.56mm
05-0513-10H 05-0513-10H Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 0513 yes Active 1 (Unlimited) Solder 5 EAR99 Gold 5 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 2.54mm Through Hole SIP 3.175mm e3 1 RECTANGULAR RND PIN-SKT UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 5 (1 x 5) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
510-93-100-13-061003 510-93-100-13-061003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 100 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA100
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