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Transistor Sockets

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Number of Contacts RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Lead Pitch Mounting Type Operating Temperature HTS Code Contact Resistance Type Lead Length JESD-609 Code Terminal Pitch Operating Temperature (Max) Body Length or Diameter Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch Contact Finish Termination Feature Pitch Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Device Socket Type Device Type Used On Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post
20-0508-21 20-0508-21 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6 Bulk 2006 508 Active 1 (Unlimited) Wire Wrap EAR99 Gold 20 ROHS3 Compliant UL94 V-0 3A 20 STANDARD: UL 94V-0 2.54mm Through Hole -55°C~125°C SIP 9.144mm e4 2 inch 1 RECTANGULAR RND PIN-SKT UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 20 (1 x 20) Beryllium Copper Brass 0.360 9.14mm
240-4846-00-3303 240-4846-00-3303 3M 0.0000
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0.00000000 download Through Hole Polyether Imide (PEI), Glass Filled Bulk 2001 OEM Obsolete 1 (Unlimited) Solder Gold Non-RoHS Compliant 40 Through Hole -55°C~105°C 15mOhm DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing Closed Frame 1A UL94 V-0 0.100 2.54mm 250.0μin 6.35μm 250.0μin 6.35μm 40 (2 x 20) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
42-6551-16 42-6551-16 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Polyphenylene Sulfide (PPS), Glass Filled Bulk 2013 55 yes Active 1 (Unlimited) Solder EAR99 Nickel Boron 42 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing Closed Frame 1A UL94 V-0 0.100 2.54mm Nickel Boron 50.0μin 1.27μm 50.0μin 1.27μm 42 (2 x 21) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
40-6556-10 40-6556-10 Aries Electronics 0.0000
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0.00000000 download 4 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2006 6556 yes Active 1 (Unlimited) Solder 40 EAR99 Gold 40 ROHS3 Compliant UL94 V-0 Gold, Tin 3A STANDARD: UL 94V-0 Through Hole DIP, 0.6 (15.24mm) Row Spacing 3.302mm e3 2.54mm 105°C 2.59 inch 1.27 inch RECTANGULAR 0.29 inch RND PIN-SKT 0.1 inch Open Frame 0.6 mm UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm 40 (2 x 20) Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm
116-41-964-41-008000 116-41-964-41-008000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant IC SOCKET
612-87-432-41-001101 612-87-432-41-001101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 612 yes Active 1 (Unlimited) Solder EAR99 Gold 32 ROHS3 Compliant UL94 V-0 1A 32 STANDARD: UL 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.4 (10.16mm) Row Spacing 7.3914mm e3 Carrier, Open Frame UL94 V-0 0.100 2.54mm Tin Flash 32 (2 x 16) Beryllium Copper Brass 0.291 7.39mm 0.100 2.54mm
558-10-256M16-000101 558-10-256M16-000101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks FR4 Epoxy Glass Bulk 2012 558 Active 1 (Unlimited) Solder Gold ROHS3 Compliant Through Hole -55°C~125°C 10mOhm PGA Closed Frame 1A UL94 V-0 0.050 1.27mm 10.0μin 0.25μm 10.0μin 0.25μm 256 (16 x 16) Beryllium Copper Brass 0.111 2.83mm 0.050 1.27mm
117-47-620-41-005000 117-47-620-41-005000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYETHYLENE Active 20 ROHS3 Compliant IC SOCKET DIP20
40-81250-310C 40-81250-310C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 40 EAR99 Gold 40 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 40 (2 x 20) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
04-0518-10 04-0518-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2013 518 yes Active 1 (Unlimited) Solder 4 EAR99 Gold 4 ROHS3 Compliant UL94 V-0 Lead Free 3A 2.54mm Through Hole SIP 3.175mm e3 1 RECTANGULAR RND PIN-SKT Open Frame UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 4 (1 x 4) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
22-0513-11 22-0513-11 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 0513 yes Active 1 (Unlimited) Solder 22 EAR99 Gold 22 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 2.54mm Through Hole SIP 3.175mm e4 2.2 inch 1 RECTANGULAR RND PIN-SKT UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 22 (1 x 22) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
522-13-109-12-051002 522-13-109-12-051002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
523-13-196-14-000002 523-13-196-14-000002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 196 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) IC SOCKET PGA196
550-10-225-18-091101 550-10-225-18-091101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 550 Active 1 (Unlimited) Solder EAR99 Gold 224 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm PGA e4 Open Frame 1A UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 225 (18 x 18) Beryllium Copper Brass 0.164 4.16mm 0.100 2.54mm
10-2513-11H 10-2513-11H Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Lo-PRO®file, 513 yes Active 1 (Unlimited) Solder 10 EAR99 Gold 10 ROHS3 Compliant UL94 V-0 3A LOW PROFILE; UL 94V-0 2.54mm Through Hole -55°C~105°C DIP, 0.2 (5.08mm) Row Spacing 3.175mm e4 1 inch 0.3 inch 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Closed Frame UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 10 (2 x 5) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
35-0518-10H 35-0518-10H Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 518 yes Active 1 (Unlimited) Solder EAR99 Gold 35 ROHS3 Compliant UL94 V-0 3A 35 STANDARD: UL 94V-0 2.54mm Through Hole SIP 3.175mm e3 3.5 inch 1 RECTANGULAR RND PIN-SKT Open Frame UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 35 (1 x 35) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
110-91-428-41-105000 110-91-428-41-105000 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks Active Non-RoHS Compliant IC SOCKET
116-83-610-41-018101 116-83-610-41-018101 Preci-Dip 0.0000
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Mult: 1

0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 116 yes Active 1 (Unlimited) Solder EAR99 Gold 10 ROHS3 Compliant UL94 V-0 1A 10 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.6 (15.24mm) Row Spacing 3.175mm e3 Elevated, Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 10 (2 x 5) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
115-87-952-41-001101 115-87-952-41-001101 Preci-Dip 0.0000
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Min: 1

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0.00000000 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 115 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 1A 52 Through Hole -55°C~125°C 10mOhm DIP, 0.9 (22.86mm) Row Spacing 2.413mm Open Frame UL94 V-0 0.100 2.54mm Tin Flash 52 (2 x 26) Beryllium Copper Brass 0.095 2.41mm 0.100 2.54mm
522-13-049-07-000003 522-13-049-07-000003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
116-83-308-41-018101 116-83-308-41-018101 Preci-Dip 0.0000
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Min: 1

Mult: 1

0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 116 yes Active 1 (Unlimited) Solder EAR99 Gold 8 ROHS3 Compliant UL94 V-0 1A 8 94V-0 Through Hole -55°C~125°C 10mOhm DIP, 0.3 (7.62mm) Row Spacing 3.175mm e3 Elevated, Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 8 (2 x 4) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
APA-316-T-K APA-316-T-K Samtec 0.0000
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0.00000000 download 3 Weeks Through Hole POLYESTER Bulk yes Active Not Applicable EAR99 Male TIN OVER NICKEL (50) Straight 16 ROHS3 Compliant BRASS STANDARD: UL 94V-0 8536.69.40.40 e3 2 TIN OVER NICKEL (50) 2.54mm IC SOCKET
510-87-101-15-101101 510-87-101-15-101101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 510 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 1A 101 Through Hole -55°C~125°C 10mOhm PGA 3.175mm Open Frame UL94 V-0 0.100 2.54mm Tin Flash 101 (15 x 15) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
32-3503-30 32-3503-30 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 503 Active 1 (Unlimited) Wire Wrap 32 EAR99 Gold 32 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 2.54mm Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 12.7mm 2 Closed Frame UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 32 (2 x 16) Beryllium Copper Phosphor Bronze 0.500 12.70mm 0.100 2.54mm
2552-111-13 2552-111-13 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Horizontal 2013 Active 1 (Unlimited) ROHS3 Compliant
69-PLS13112-12 69-PLS13112-12 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS) Bulk 2013 PLS Active 1 (Unlimited) Solder 125°C -65°C Gold ROHS3 Compliant UL94 V-0 Lead Free Gold 1A Through Hole -65°C~125°C PGA, ZIF (ZIP) 3.175mm Closed Frame 1A UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Beryllium Copper 0.125 3.18mm 0.100 2.54mm
551-10-101-13-061004 551-10-101-13-061004 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (10) OVER NICKEL (150) 101 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) - with Nickel (Ni) barrier IC SOCKET PGA101
116-93-642-61-001000 116-93-642-61-001000 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks Active Non-RoHS Compliant
116-83-316-41-012101 116-83-316-41-012101 Preci-Dip 0.0000
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Min: 1

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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 116 yes Active 1 (Unlimited) Solder EAR99 Gold Straight 16 ROHS3 Compliant UL94 V-0 1A 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.3 (7.62mm) Row Spacing 3.175mm e3 2 Elevated, Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 16 (2 x 8) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
511-13-049-07-000003 511-13-049-07-000003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 49 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) IC SOCKET PGA49
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