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Soldering Supplies and Tools
Soldering supplies and tools refer to the equipment and materials used in the process of soldering electronic components. Soldering is the process of joining two metal surfaces together using a heated metal alloy called solder. Soldering supplies and tools include soldering irons, soldering stations, soldering tips, soldering wire, flux, desoldering pumps, and soldering stands. These tools and supplies are essential for electronic technicians, hobbyists, and professionals who need to repair or assemble electronic devices. With the right soldering supplies and tools, one can achieve a strong and reliable connection between electronic components, ensuring the proper functioning of electronic devices.
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Material | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Positions | Diameter | RoHS Status | Thickness | Weight | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Pitch | Wire Gauge | Outer Dimension | Diameter - Inner | Form | Process | Melting Point | Flux Type |
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NCSW.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||||||
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NC191LT10 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 0.35 oz (10g), 5cc | Lead Free | 280°F 138°C | No-Clean | |||||||||||||||
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SMDAL200 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn96.5Ag3.5 (96.5/3.5) | Jar, 7.05 oz (200g) | Lead Free | 430°F 221°C | Water Soluble | ||||||||||||||
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RASWLF.015 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 2 oz (56.70g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | ||||||||||||||||
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BARSN62PB36AG2-8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | Non-RoHS Compliant | Bar Solder | Sn62Pb36Ag2 (62/36/2) | Bar, 0.5 lb (227g) | Leaded | 354°F 179°C | ||||||||||||||||||
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BARSN96.5AG3.0CU0.5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | ROHS3 Compliant | Bar Solder | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | Bar, 1 lb (454g) | Lead Free | 422°F~428°F 217°C~220°C | ||||||||||||||||||
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SMD4300SNL250T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | |||||||||||
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SMDLTLFP50T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.113lb 51.26g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | Lead Free | 281°F 138°C | No-Clean | ||||||||||||
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RASWLF.015 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 1 oz (28.35g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | ||||||||||||||||
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CQIRM | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | CHIPQUIK® | Active | 1 (Unlimited) | ROHS3 Compliant | Flux Remover | 37°F~77°F 3°C~25°C | 24 Months | Date of Manufacture | Pen, 0.34 oz (9.64g) | |||||||||||||||||||
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RMA591NL | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | CHIPQUIK® | Active | 1 (Unlimited) | ROHS3 Compliant | Flux - Rosin Mildly Activated (RMA) | 37°F~77°F 3°C~25°C | 24 Months | Date of Manufacture | Syringe, 0.35 oz (10g), 10cc | ||||||||||||||||||
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SMD2SWLF.015 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 2 oz (56.70g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||||||
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SMD2SWLF.020 .4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 24 AWG, 25 SWG | Tube, 0.7 oz (19.85g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | |||||||||||||||
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TS391LT500C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Cartridge, 17.64 oz (500g) | Lead Free | 281°F 138°C | No-Clean | ||||||||||||||
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SMD291SNL10T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Syringe | 2014 | Active | Not Applicable | ROHS3 Compliant | 0.077lb 34.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||||||
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NC191AX50 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||||
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TS391LT50 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | Lead Free | 281°F 138°C | No-Clean | ||||||||||||||
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NC2SW.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean | ||||||||||||||||
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RASWLF.031 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 21 AWG, 20 SWG | Spool, 8 oz (227g), 1/2 lb | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | ||||||||||||||||
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PA0203-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Stainless Steel | 2012 | Proto-Advantage PA | Active | 1 (Unlimited) | 112 | ROHS3 Compliant | 0.0040 0.102mm | LQFP | 0.026 0.65mm | 1.950 L x 1.350 W (49.53mm x 34.29mm) | 0.787 L x 0.787 W (20.00mm x 20.00mm) | ||||||||||||||||
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SMD3SW.031 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 4 oz (113.40g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | ||||||||||||||||
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SMD291SNL50T6 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | ||||||||||||||
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SMD4300SNL10T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Syringe | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | |||||||||||||
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SMD2050-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2017 | SMD2 | Active | Not Applicable | 0.024 0.61mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Lead Free | 423°F~428°F 217°C~220°C | ||||||||||||||
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NC191LT35 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 280°F 138°C | No-Clean | |||||||||||||||
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SMD2SW.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | Spool, 1 oz (28.35g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | ||||||||||||||||
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BGA0019-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Stainless Steel | 2017 | Proto-Advantage BGA | Active | 1 (Unlimited) | 36 | ROHS3 Compliant | 0.0040 0.102mm | BGA | 0.016 0.40mm | 1.300 L x 0.900 W (33.02mm x 22.86mm) | ||||||||||||||||
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SMDSWLF.015 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||||||||
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SMDSWLF.031 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 8 oz (227g), 1/2 lb | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||||||||
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SMDLTLFP10T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Syringe | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 281°F 138°C | No-Clean |