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Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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TS391AX250 | Chip Quik Inc. | 44.3050 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | No-Clean | |||||||||
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SMDSWLF.015 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 8 oz (227g), 1/2 lb | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||||
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SMD2060 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.030 0.76mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | |||||||||
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SMD3SW.031 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 2 oz (56.70g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | |||||||||||
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SMDIN100-S-1 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | ROHS3 Compliant | Solder Shot | In100 (100) | Bag, 1 oz (28g) | Lead Free | 315°F 157°C | |||||||||||||
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NC4SW.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 565°F~574°F 296°C~301°C | No-Clean | |||||||||||
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SMD291SNL500T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||
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SMD291SNL500T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||
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SMD4300AX250T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Jar | 2015 | Active | Not Applicable | Non-RoHS Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | Water Soluble | ||||||
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SMD291SNL500T5C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Cartridge | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||
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BARSN60PB40-8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | Non-RoHS Compliant | Bar Solder | Sn60Pb40 (60/40) | Bar, 0.5 lb (227g) | Leaded | 361°F~370°F 183°C~188°C | |||||||||||||
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SMD2200 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||
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RASWLF.031 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 21 AWG, 20 SWG | Spool, 2 oz (56.70g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||
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SMDAG100-S-0.25 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | ROHS3 Compliant | Solder Shot | Ag100(100) | Bag, 0.25 oz (7g) | Lead Free | 1762°F 961°C | |||||||||||||
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RASWLF.020 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 4 oz (113.40g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||
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SMD4300AX250T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Jar | 2015 | Active | Not Applicable | Non-RoHS Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | Water Soluble | ||||||
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840933 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | C502 | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | Wire Solder | 23 AWG, 24 SWG | Spool, 8.8 oz (250g) | 361°F 183°C | No-Clean | |||||||||||
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SMD2SWLF.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 oz (28.35g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | |||||||||||
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SMD2170 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.014 0.36mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | ||||||||||
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SMD2205 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.025 0.64mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||
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SMD4300AX10T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Syringe | 2014 | Active | Not Applicable | Non-RoHS Compliant | 0.077lb 34.93g | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | Leaded | 361°F 183°C | Water Soluble | ||||||
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RASW.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 1 oz (28.35g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||||
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SMD2SW.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | SMD2 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | |||||||||
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SMD3SW.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | |||||||||||
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SMDSWLF.020 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | 0.125lb 56.7g | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 2 oz (56.70g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||
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91-7068-8844 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||
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SS-S031AS | MENDA/EasyBraid | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | 20 AWG | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool | Leaded | 361°F 183°C | Water Soluble | ||||||||||||
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SS-S020AS | MENDA/EasyBraid | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | 24 AWG | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool | Leaded | 361°F 183°C | Water Soluble | ||||||||||||
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NC3SWLF.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F 221°C | No-Clean | |||||||||||
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1993881 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | LOCTITE® GC 10 | Active | Not Applicable | RoHS Compliant | Solder Paste | 41°F~77°F 5°C~25°C | 12 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F 217°C | No-Clean |
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TS391AX250 Chip Quik Inc.
TS391AX250 datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 44.3050
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