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Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Lead Free | Package / Case | REACH SVHC | Outside Diameter | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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RASWLF.015 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 2 oz (56.70g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||
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BARSN62PB36AG2-8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | Non-RoHS Compliant | Bar Solder | Sn62Pb36Ag2 (62/36/2) | Bar, 0.5 lb (227g) | Leaded | 354°F 179°C | |||||||||||||||||
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BARSN96.5AG3.0CU0.5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | ROHS3 Compliant | Bar Solder | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | Bar, 1 lb (454g) | Lead Free | 422°F~428°F 217°C~220°C | |||||||||||||||||
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SMD4300SNL250T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | ||||||||||
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07-6337-0050 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2011 | ULTRAPURE® | Active | 1 (Unlimited) | Non-RoHS Compliant | Lead Free | Bar Solder | Sn63Pb37 (63/37) | Bar, 10 lbs (4.54kg) | Leaded | 361°F 183°C | |||||||||||||||
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24-7070-0027 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Wire | 2016 | 44 | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn95Ag5 (95/5) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F~473°F 221°C~245°C | Rosin Activated (RA) | ||||||||||
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19-6337-0062 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | Solid Core Wire | Active | 1 (Unlimited) | 0.062 1.57mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 14 AWG, 16 SWG | Leaded | 361°F 183°C | ||||||||||||||
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SMDLTLFP50T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.113lb 51.26g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | Lead Free | 281°F 138°C | No-Clean | |||||||||||
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RASWLF.015 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 1 oz (28.35g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||
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92-7068-7601 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||||
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4884-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4880 | Active | Not Applicable | 0.025 0.64mm | Non-RoHS Compliant | 1lb 453.59g | 22 AWG | Wire Solder | Sn63Pb37 (63/37) | 22 AWG, 23 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||
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1817240 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Bar | 2000 | Active | Not Applicable | Non-RoHS Compliant | Lead Free | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F 217°C | |||||||||||||
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92-7150-8800 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.031 0.79mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn62Pb36Ag2 (62/36/2) | 20 AWG, 22 SWG | Spool, 17.64 oz (500g) | Leaded | 354°F 179°C | No-Clean | |||||||||||||
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NCSWLF.015 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||||
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SMD2SWLF.015 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 2 oz (56.70g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | |||||||||||||||
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SMD2SWLF.020 .4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 24 AWG, 25 SWG | Tube, 0.7 oz (19.85g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||||
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92-6040-8800 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.031 0.79mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 20 AWG, 22 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F~374°F 183°C~190°C | No-Clean | |||||||||||||
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18-6337-0118 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Solid Core Wire | Obsolete | 1 (Unlimited) | 0.118 3.00mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 9 AWG, 11 SWG | Spool, 20 lbs (9.07kg) | Leaded | 361°F 183°C | ||||||||||||
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TS391LT500C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Cartridge, 17.64 oz (500g) | Lead Free | 281°F 138°C | No-Clean | |||||||||||||
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SMD291SNL10T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Syringe | 2014 | Active | Not Applicable | ROHS3 Compliant | 0.077lb 34.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||||
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4888-227G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4880 | Active | Not Applicable | 0.062 1.57mm | Non-RoHS Compliant | 062 | 0.5lb 226.8g | 14 AWG | Wire Solder | Sn63Pb37 (63/37) | 14 AWG, 16 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||
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24-6040-0061 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 44 | Active | Not Applicable | 0.062 1.57mm | Non-RoHS Compliant | Contains Lead | 062 | No SVHC | 1.5748 mm | 1lb 453.59g | 14 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | |||||
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4898-227G | MG Chemicals | 49.9699 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4890 | Active | Not Applicable | 0.062 1.57mm | Non-RoHS Compliant | 062 | 0.5lb 226.8g | 14 AWG | Wire Solder | Sn60Pb40 (60/40) | 14 AWG, 16 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F~376°F 183°C~191°C | Rosin Activated (RA) | |||||||||
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NC191AX50 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||||
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TS391LT50 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | Lead Free | 281°F 138°C | No-Clean | |||||||||||||
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24-6337-0053 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2007 | 44 | Active | Not Applicable | 0.050 1.27mm | Non-RoHS Compliant | Contains Lead | Unknown | 1.27 mm | 1lb 453.59g | 16 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||
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NC2SW.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean | |||||||||||||||
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RASWLF.031 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 21 AWG, 20 SWG | Spool, 8 oz (227g), 1/2 lb | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||
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SMD3SW.031 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 4 oz (113.40g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | |||||||||||||||
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SMD291SNL50T6 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean |
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NCSWLF.015 1LB Chip Quik Inc.
Solder LF Solder Wire 96.5/3/0.5 Tin/Silver/Copper No-Clean .015 1lb
Price: 0.0000
RFQ -
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24-6040-0061 Kester Solder
KESTER SOLDER24-6040-0061SOLDER WIRE, 60/40 SN/PB, 190°C, 453.592G
Price: 0.0000
RFQ -
4898-227G MG Chemicals
4898-227G datasheet pdf and Solder product details from MG Chemicals stock available at Utmel
Price: 49.9699
RFQ -
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