Items : %s%s
Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | Package / Case | REACH SVHC | Height | Width | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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NC191AX50 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||||||
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SMD2SWLF.020 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | |||||||||||||||||
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SMDIN100-R | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | ROHS3 Compliant | Ribbon Solder | In100 (100) | Spool | Lead Free | 315°F 157°C | |||||||||||||||||||
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SMD2050-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2017 | SMD2 | Active | Not Applicable | 0.024 0.61mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Lead Free | 423°F~428°F 217°C~220°C | |||||||||||||||
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70-0202-0311 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | EP256HA | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn62Pb36Ag2 (62/36/2) | Cartridge, 21.16 oz (600g) | Leaded | 354°F 179°C | No-Clean | ||||||||||||||||
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SMDLTLFP250T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | Lead Free | 281°F 138°C | No-Clean | ||||||||||||||
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24-7068-1402 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2006 | 48 | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Lead Free | 217 | 1lb 453.59g | 20 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Activated (RA) | |||||||||
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24-7068-8213 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 88 | Obsolete | 1 (Unlimited) | 0.031 0.79mm | RoHS Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Activated (RA) | ||||||||||||||
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SMD291SNL10 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Solder | Syringe | 2009 | Active | Not Applicable | 127mm | ROHS3 Compliant | 217 | No SVHC | 25.4mm | 76.2mm | 0.077lb 34.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||
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SMD291AX250T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Solder | Jar | 2015 | Active | Not Applicable | Non-RoHS Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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SMD3SW.031 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 4 oz (113.40g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | |||||||||||||||||
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RASWLF.015 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 4 oz (113.40g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||||
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SMDSWLF.006 50G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.006 0.15mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 34 AWG, 38 SWG | Spool, 1.76 oz (50g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||||||||
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SMD291SNL50T6 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||||||
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SMDLTLFP | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Syringe | 2015 | Active | Not Applicable | ROHS3 Compliant | No SVHC | 15g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 281°F 138°C | No-Clean | |||||||||||
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SMD2SWLF.020 .4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 24 AWG, 25 SWG | Tube, 0.7 oz (19.85g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||||||
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SMDLTLFP10T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Syringe | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 281°F 138°C | No-Clean | ||||||||||||||
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SMDSWLF.031 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 8 oz (227g), 1/2 lb | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||||||||||
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RASWLF.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||||
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RASWLF.031 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 21 AWG, 20 SWG | Spool, 4 oz (113.40g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||||
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SMD2SWLF.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 oz (28.35g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | |||||||||||||||||
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SMD2036-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.018 0.46mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | ||||||||||||||||
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SMD291AX500T3C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Cartridge | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||||
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SMDSWLF.015 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 oz (28.35g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||||||||||
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TS991SNL500T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||||||
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SMD2SW.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | Spool, 1 oz (28.35g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | |||||||||||||||||
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SMDSWLF.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | 0.062lb 28.12g | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 1 oz (28.35g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||||||||
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SMD2SWLF.031 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | |||||||||||||||||
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NC2SWLF.015 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||||||
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92-6040-0039 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2016 | 44 | Obsolete | 1 (Unlimited) | 0.040 1.02mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 18 AWG, 19 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) |
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SMD291SNL10 Chip Quik Inc.
CHIP QUIK SMD291SNL10 Solder Paste, No-Clean, 217 C, 35 g
Price: 0.0000
RFQ -
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TS991SNL500T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar)
Price: 0.0000
RFQ -
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NC2SWLF.015 1OZ Chip Quik Inc.
Solder LF Solder Wire 99.3/0.7 Tin/Copper No-Clean .015 1oz
Price: 0.0000
RFQ -























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